公开(公告)号：US12132295B2

公开(公告)日：2024-10-29

申请号：US17120240

申请日：2020-12-13

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Takashi Kondo ,  Satoshi Inada ,  Junichiro Hayakawa ,  Takeshi Minamiru ,  Takafumi Higuchi

IPC: H01S5/042 ,  G01S7/484 ,  G01S17/10 ,  H01S5/02257 ,  H01S5/42

CPC classification number: H01S5/0428 ,  G01S7/484 ,  G01S17/10 ,  H01S5/02257 ,  H01S5/423

Abstract: A light-emitting device is provided with a light source and a controller. The light source includes multiple light-emitting elements and multiple driving elements that are provided in correspondence with the light-emitting elements and drive the light-emitting elements to light up by going to an ON state. The controller controls a switching between a successive lighting operation that causes the light-emitting elements to light up successively and a simultaneous lighting operation that causes the light-emitting elements to light up simultaneously in parallel. The light source includes a power supply line set to a reference potential or a power supply potential, a driving signal line that is connected to the power supply line and that supplies a driving signal to the driving elements, and a lighting signal line that supplies a lighting signal for causing the light-emitting elements to light up. In the successive lighting operation, the controller sets the power supply line to the power supply potential and sets each driving element to the ON state with the driving signal and the lighting signal to cause each light-emitting element corresponding to each driving element to light up successively. In the simultaneous lighting operation, the controller sets the power supply line to the reference potential and also sets the driving elements to the ON state with the driving signal and the lighting signal to cause the light-emitting elements to light up simultaneously in parallel.

公开(公告)号：US11599610B2

公开(公告)日：2023-03-07

申请号：US16708348

申请日：2019-12-09

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Takeshi Minamiru ,  Satoshi Inada ,  Kenichi Ono ,  Takafumi Higuchi ,  Tsutomu Otsuka

IPC: G06F21/32 ,  H01L33/62 ,  H01S5/042 ,  H01L31/16 ,  H01S5/42 ,  H01S5/02325 ,  G06V40/16 ,  H01S5/00 ,  H01S5/183 ,  H01S5/343

Abstract: A light-emitting device includes a light diffusing member that diffuses light emitted from a light source so that an object to be measured is irradiated with the light; and a holding unit that holds the light diffusing member and is provided on a wire connected to the light source so as to be located in an uncoated region of the wire.

公开(公告)号：US20220115836A1

公开(公告)日：2022-04-14

申请号：US17559293

申请日：2021-12-22

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Takeshi MINAMIRU ,  Satoshi Inada ,  Takafumi Higuchi ,  Shigetoshi Nakamura ,  Kenichi Ono

IPC: H01S5/02255 ,  H01S5/183 ,  H01S5/343 ,  G01B11/24 ,  G01S17/894 ,  G01S7/481 ,  G01S7/4865

Abstract: A light-emitting device includes: a light source including light-emitting elements configured to oscillate in a single transverse mode; and an optical member that is provided on a light-emitting path of the light source and configured to diffuse and emit light emitted by the light source.

公开(公告)号：US12119417B2

公开(公告)日：2024-10-15

申请号：US17335201

申请日：2021-06-01

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Satoshi Inada ,  Kenichi Ono ,  Takeshi Minamiru ,  Akemi Murakami ,  Junichiro Hayakawa ,  Tsutomu Otsuka

IPC: H01S5/042 ,  H01L31/0224 ,  H01L31/18 ,  H01S5/02 ,  H01S5/0239 ,  H01S5/183

CPC classification number: H01L31/022408 ,  H01L31/18 ,  H01S5/0208 ,  H01S5/0239 ,  H01S5/0425 ,  H01S5/183

Abstract: An optical semiconductor element includes: a semiconductor substrate that is semi-insulating; a columnar body that is formed on a front surface-side of the semiconductor substrate and configured to emit or receive light from the front surface-side; a front surface-side electrode that is connected to the columnar body; a back surface-side electrode formed on a back surface-side of the semiconductor substrate; and an electrically conductive member that is formed to penetrate through the semiconductor substrate to connect the front surface-electrode and the back surface-side electrode, and has a protruding portion protruding on the front surface-side of the semiconductor substrate.

公开(公告)号：US12027510B2

公开(公告)日：2024-07-02

申请号：US17355270

申请日：2021-06-23

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Takashi Kondo ,  Satoshi Inada ,  Takeshi Minamiru ,  Daisuke Iguchi ,  Kazuhiro Sakai ,  Tomoaki Sakita ,  Michiaki Murata

IPC: H01L25/16 ,  G01B11/24 ,  G06V20/64 ,  G06V40/16 ,  H01S5/02257 ,  H01S5/02345 ,  H01S5/0236 ,  H01S5/0239 ,  H01S5/026 ,  H01S5/183 ,  H01S5/343 ,  H01S5/42 ,  H01L33/46 ,  H01L33/60

CPC classification number: H01L25/167 ,  G01B11/24 ,  G06V20/64 ,  G06V40/172 ,  H01S5/02257 ,  H01S5/0236 ,  H01S5/0239 ,  H01S5/0262 ,  H01S5/18361 ,  H01S5/34313 ,  H01S5/423 ,  H01L33/46 ,  H01L33/60

Abstract: A light-emitting element array chip includes: a first light-emitting element array that includes a first light-emitting element including a first substrate, a light-emitting element layer formed on the first substrate, and a first cathode electrode electrically connected to the light-emitting element layer; and a second light-emitting element array that includes a second light-emitting element including a second substrate, a non-p-type lower reflector formed on the second substrate, and a second cathode electrode electrically connected to the non-p-type lower reflector, in which the first light-emitting element array is provided on an emission surface side of the second light-emitting element array.

公开(公告)号：US11657130B2

公开(公告)日：2023-05-23

申请号：US16511095

申请日：2019-07-15

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Satoshi Inada ,  Kenichi Ono ,  Takeshi Minamiru ,  Michiaki Murata ,  Takafumi Higuchi

IPC: G01S7/481 ,  G01S17/89 ,  G06F21/45 ,  G01B11/24 ,  G01S17/04 ,  H01S5/183

CPC classification number: G01S7/4815 ,  G01B11/24 ,  G01S17/04 ,  G01S17/89 ,  G06F21/45 ,  H01S5/183

Abstract: A light emitter includes: a substrate; a driving section provided on the substrate; a light source that is provided on the substrate and is driven by the driving section; a cover section through which light emitted from the light source is transmitted and that is disposed in an optical axial direction of the light source; and a support section that is provided on a part of the substrate excluding a part between the driving section and the light source and supports the cover section.

公开(公告)号：US12261414B2

公开(公告)日：2025-03-25

申请号：US17354098

申请日：2021-06-22

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Takeshi Minamiru ,  Kenichi Ono ,  Satoshi Inada ,  Michiaki Murata

IPC: H01S5/042 ,  G06F21/32 ,  G06F21/84 ,  G06V20/64 ,  H01S5/40 ,  G06V40/16

Abstract: A light-emission device includes: a first light emitting element chip; a second light emitting element chip having a light output higher than a light output of the first light emitting element chip, the second light emitting element chip being configured to be driven independently from the first light emitting element chip and arranged side by side with the first light emitting element chip; and a light diffusion member including a first region provided on an emission path of the first light emitting element chip and a second region provided on an emission path of the second light emitting element chip, and having a diffusion angle at the second region larger than a diffusion angle at the first region.

公开(公告)号：US11585903B2

公开(公告)日：2023-02-21

申请号：US16511029

申请日：2019-07-15

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Tomoaki Sakita ,  Satoshi Inada ,  Takeshi Minamiru ,  Daisuke Iguchi ,  Kazuhiro Sakai ,  Yoshinori Shirakawa

IPC: G01S7/481 ,  G01S17/89 ,  G01B11/24 ,  G06F21/45 ,  G01S17/04 ,  H01S5/183

Abstract: Provided is a light emitting device including: a base material mounted on a wiring substrate; a light emitting element array provided on the base material; a first conductive pattern provided on the surface of the base material, the first conductive pattern including a first facing region connected to the light emitting element array, the first facing region being along a side surface of the light emitting element array and facing to the light emitting element array, and a first extending region extended beyond the first facing region; and penetrating members penetrating the base material from the first conductive pattern to a back surface side of the base material, each penetrating member being connected to the first facing region or the first extending region.

公开(公告)号：US11539191B2

公开(公告)日：2022-12-27

申请号：US16712940

申请日：2019-12-12

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kenichi Ono ,  Takeshi Minamiru ,  Satoshi Inada ,  Takafumi Higuchi ,  Tsutomu Otsuka

IPC: H01S5/042 ,  H01S5/42 ,  G06F21/32 ,  G02B5/02 ,  H01S5/02325 ,  H01S5/183 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/02345 ,  H01S5/22 ,  H01S5/343

Abstract: A light-emitting device includes a light diffusing member that diffuses light emitted from a light source so that an object to be measured is irradiated with the light; and a holding unit that is provided on plural wires connected to the light source and holds the light diffusing member.