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公开(公告)号：US12261414B2
公开(公告)日：2025-03-25
申请号：US17354098
申请日：2021-06-22
Applicant: FUJIFILM BUSINESS INNOVATION CORP.
Inventor： Takeshi Minamiru , Kenichi Ono , Satoshi Inada , Michiaki Murata
Abstract: A light-emission device includes: a first light emitting element chip; a second light emitting element chip having a light output higher than a light output of the first light emitting element chip, the second light emitting element chip being configured to be driven independently from the first light emitting element chip and arranged side by side with the first light emitting element chip; and a light diffusion member including a first region provided on an emission path of the first light emitting element chip and a second region provided on an emission path of the second light emitting element chip, and having a diffusion angle at the second region larger than a diffusion angle at the first region.
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Patent Agency Ranking
公开(公告)号：US11953308B2
公开(公告)日：2024-04-09
申请号：US16939168
申请日：2020-07-27
Applicant: FUJIFILM BUSINESS INNOVATION CORP.
Inventor： Shigetoshi Nakamura , Kenichi Ohno , Michiaki Murata , Tsutomu Ishii , Jiro Minabe
CPC classification number: G01B11/026 , G01B11/24 , G01C3/08 , G02B3/0006 , G06V10/145 , H01S5/32316 , H01S5/423
Abstract: A light emitting element array includes: a light emitting element group that includes plural light emitting elements; and plural lenses that are provided, corresponding to the plural light emitting elements, on a light emitting surface side of the plural light emitting elements, and that deflects light emitted from the plural light emitting elements according to a positional relation with the plural light emitting elements. Distances between central axes of light emission of the plural light emitting elements and central axes of the plural lenses corresponding to the plural light emitting elements increase from a center side of the light emitting element group toward an end side of the light emitting element group, and a degree of change in the distances decreases from the center side of the light emitting element group toward the end side of the light emitting element group.
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公开(公告)号：US12027510B2
公开(公告)日：2024-07-02
申请号：US17355270
申请日：2021-06-23
Applicant: FUJIFILM BUSINESS INNOVATION CORP.
Inventor： Takashi Kondo , Satoshi Inada , Takeshi Minamiru , Daisuke Iguchi , Kazuhiro Sakai , Tomoaki Sakita , Michiaki Murata
IPC: H01L25/16 , G01B11/24 , G06V20/64 , G06V40/16 , H01S5/02257 , H01S5/02345 , H01S5/0236 , H01S5/0239 , H01S5/026 , H01S5/183 , H01S5/343 , H01S5/42 , H01L33/46 , H01L33/60
CPC classification number: H01L25/167 , G01B11/24 , G06V20/64 , G06V40/172 , H01S5/02257 , H01S5/0236 , H01S5/0239 , H01S5/0262 , H01S5/18361 , H01S5/34313 , H01S5/423 , H01L33/46 , H01L33/60
Abstract: A light-emitting element array chip includes: a first light-emitting element array that includes a first light-emitting element including a first substrate, a light-emitting element layer formed on the first substrate, and a first cathode electrode electrically connected to the light-emitting element layer; and a second light-emitting element array that includes a second light-emitting element including a second substrate, a non-p-type lower reflector formed on the second substrate, and a second cathode electrode electrically connected to the non-p-type lower reflector, in which the first light-emitting element array is provided on an emission surface side of the second light-emitting element array.
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4.发明授权公开(公告)号：US11657130B2
公开(公告)日：2023-05-23
申请号：US16511095
申请日：2019-07-15
Applicant: FUJIFILM BUSINESS INNOVATION CORP.
Inventor： Satoshi Inada , Kenichi Ono , Takeshi Minamiru , Michiaki Murata , Takafumi Higuchi
Abstract: A light emitter includes: a substrate; a driving section provided on the substrate; a light source that is provided on the substrate and is driven by the driving section; a cover section through which light emitted from the light source is transmitted and that is disposed in an optical axial direction of the light source; and a support section that is provided on a part of the substrate excluding a part between the driving section and the light source and supports the cover section.
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公开(公告)号：US11081344B2
公开(公告)日：2021-08-03
申请号：US16805896
申请日：2020-03-02
Applicant: FUJIFILM BUSINESS INNOVATION CORP.
Inventor： Atsushi Fukugawa , Michiaki Murata
IPC: H01L21/00 , H01L21/02 , H01L21/463 , H01L21/304
Abstract: Provided is a method for manufacturing a semiconductor substrate including: preparing a semiconductor substrate having a front surface on which an epitaxial layer has been formed; and forming a fracture layer on a rear surface of the semiconductor substrate before forming elements on the epitaxial layer.
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公开(公告)号：US11929589B2
公开(公告)日：2024-03-12
申请号：US17128175
申请日：2020-12-20
Applicant: FUJIFILM Business Innovation Corp.
Inventor： Takashi Kondo , Michiaki Murata , Kenichi Ono , Masahiro Yoshikawa , Takehito Hikichi , Yuji Shirai
CPC classification number: H01S5/042 , H01L27/0817 , H01S5/0239 , H01S5/0261 , H01S5/18313 , H01S5/3095 , H01S5/423
Abstract: A light-emitting component includes: a substrate; plural light-emitting elements that are disposed on the substrate and that emit light in a direction intersecting with a surface of the substrate; and plural thyristors that are stacked on the plural light-emitting elements and that are turned ON to drive the corresponding light-emitting elements so that the light-emitting elements emit light or an amount of light emitted from the light-emitting elements is increased. Each of the plural light-emitting elements includes a current confinement region which is oxidized via a hole provided in a multilayer structure. The multilayer structure is constituted by a corresponding light-emitting element and a corresponding thyristor.
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