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公开(公告)号:US20220123524A1
公开(公告)日:2022-04-21
申请号:US17565641
申请日:2021-12-30
Applicant: FUJIFILM Business Innovation Corp.
Inventor: Takafumi HIGUCHI , Takeshi MINAMIRU , Satoshi INADA , Shigetoshi NAKAMURA , Kenichi ONO
Abstract: A light-emitting device includes: a light source including plural light-emitting elements; a first optical member that is provided in a light-emitting path of the light source, the first optical member being configured to reduce intensity of light emitted from the light source and emit the light; and a second optical member that is provided on a light-emitting side of the first optical member and is configured to diffuse and irradiate light incident from the first optical member.
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公开(公告)号:US20230307894A1
公开(公告)日:2023-09-28
申请号:US18326981
申请日:2023-05-31
Applicant: FUJIFILM Business Innovation Corp.
Inventor: Kazuhiro SAKAI , Daisuke IGUCHI , Takeshi MINAMIRU , Yoshinori SHIRAKAWA , Tomoaki SAKITA , Tsutomu OTSUKA
IPC: H01S5/068 , H01S5/0687 , H01S5/02255 , H01S5/02325 , G06V20/64 , G02B27/42 , G06V40/16 , H01S5/42 , G02B5/02 , G06V10/145
CPC classification number: H01S5/423 , G02B5/0278 , G02B27/4205 , G06V10/145 , G06V20/64 , G06V40/166 , H01S5/02255 , H01S5/02325 , H01S5/06804 , H01S5/0687 , H01S5/04254
Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.
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公开(公告)号:US20220077659A1
公开(公告)日:2022-03-10
申请号:US17528177
申请日:2021-11-16
Applicant: FUJIFILM Business Innovation Corp.
Inventor: Kazuhiro SAKAI , Daisuke IGUCHI , Takeshi MINAMIRU , Yoshinori SHIRAKAWA , Tomoaki SAKITA , Tsutomu OTSUKA
IPC: H01S5/42 , H01S5/068 , H01S5/0687 , G02B27/42 , G02B5/02 , G06K9/00 , G06K9/20 , H01S5/02255 , H01S5/02325
Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.
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公开(公告)号:US20240250501A1
公开(公告)日:2024-07-25
申请号:US18494309
申请日:2023-10-25
Applicant: FUJIFILM BUSINESS INNOVATION CORP. , FUJIFILM CORPORATION
Inventor: Naoya SEKITA , Takeshi MINAMIRU , Yuto IWANE , Koga MIZUNO , Kazutaka TAKEDA , Atsushi MUKAI
IPC: H01S5/183
CPC classification number: H01S5/18311 , H01S5/18347 , H01S5/1835 , H01S5/18361 , H01S5/18394
Abstract: A surface-emitting type semiconductor laser includes a substrate, and a structure that includes a first multilayer-film reflective mirror of a first conductivity type formed on the substrate, an active layer formed on the first multilayer-film reflective mirror, and a second multilayer-film reflective mirror of a second conductivity type that is formed on the active layer and includes a current confinement layer, and that is a structure in which a shape of an aperture formed in the current confinement layer to represent a part not subjected to oxide confinement is a shape not including an axially symmetrical or point symmetrical part.
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5.
公开(公告)号:US20230252122A1
公开(公告)日:2023-08-10
申请号:US18134272
申请日:2023-04-13
Applicant: FUJIFILM Business Innovation Corp.
Inventor: Satoshi INADA , Kenichi ONO , Takeshi MINAMIRU , Michiaki MURATA , Takafumi HIGUCHI
CPC classification number: G06F21/32 , G01S7/4815 , G01S17/89 , G06F21/45 , G01B11/24 , G01S17/04 , G06V40/166 , H01S5/183
Abstract: A light emitter includes: a substrate; a driving section provided on the substrate; a light source that is provided on the substrate and is driven by the driving section; a cover section through which light emitted from the light source is transmitted and that is disposed in an optical axial direction of the light source; and a support section that is provided on a part of the substrate excluding a part between the driving section and the light source and supports the cover section.
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公开(公告)号:US20220077654A1
公开(公告)日:2022-03-10
申请号:US17147425
申请日:2021-01-12
Applicant: FUJIFILM Business Innovation Corp.
Inventor: Takeshi MINAMIRU , Takashi KONDO , Takafumi HIGUCHI
Abstract: A light emitting element formed of a laminate having a current constriction layer includes: a semiconductor substrate; a light emitting portion having plural first recess portions having a depth reaching the current constriction layer, and a current constriction structure formed in the current constriction layer and having an oxidized region where the current constriction layer is oxidized and a non-oxidized region surrounded by the oxidized region; an electrode pad disposed between the light emitting portion and an outer edge portion of the semiconductor substrate; and a step portion disposed between the electrode pad and the light emitting portion and formed from an upper surface of the laminate to the current constriction layer, and the current constriction layer in a region surrounded by the step portion is the oxidized region except for the non-oxidized region.
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公开(公告)号:US20210313762A1
公开(公告)日:2021-10-07
申请号:US17353480
申请日:2021-06-21
Applicant: FUJIFILM BUSINESS INNOVATION CORP.
Inventor: Takeshi MINAMIRU , Kazuhiro SAKAI , Daisuke IGUCHI
IPC: H01S5/042 , G01B11/24 , G01S7/484 , G01S17/894 , H01S5/0225 , H01S5/42 , G06K9/00
Abstract: A light-emitting device includes: a wiring substrate; a base member that is mounted on the wiring substrate; a light source that is mounted on the base member; a drive unit that is mounted on the wiring substrate and drives the light source; a wiring pattern that is on the wiring substrate, is connected to the light source and extends from a back surface side of the base member toward the drive unit; and a circuit element that is provided in a region on the base member between the light source and the drive unit, the region overlapping the wiring pattern in a plan view.
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公开(公告)号:US20220114835A1
公开(公告)日:2022-04-14
申请号:US17559626
申请日:2021-12-22
Applicant: FUJIFILM BUSINESS INNOVATION CORP.
Inventor: Takeshi MINAMIRU , Satoshi INADA , Takafumi HIGUCHI , Shigetoshi NAKAMURA , Kenichi ONO
IPC: G06V40/16 , H04N13/307 , G06V10/147 , G06V10/141 , G06V10/422
Abstract: A light-emitting device includes: a light source including plural light-emitting elements; a first optical member that is provided in a light-emitting path of the light source, the first optical member being configured to narrow a spread angle of light emitted from each of the light-emitting elements of the light source and emit the narrowed light; and a second optical member that is provided on a light-emitting side of the first optical member and is configured to diffuse and irradiate light incident from the first optical member.
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公开(公告)号:US20210320479A1
公开(公告)日:2021-10-14
申请号:US17355270
申请日:2021-06-23
Applicant: FUJIFILM BUSINESS INNOVATION CORP.
Inventor: Takashi KONDO , Satoshi INADA , Takeshi MINAMIRU , Daisuke IGUCHI , Kazuhiro SAKAI , Tomoaki SAKITA , Michiaki MURATA
IPC: H01S5/42 , H01S5/026 , H01S5/183 , H01S5/02257 , H01S5/343 , H01S5/0236 , G06K9/00 , G06K9/20 , G01B11/24
Abstract: A light-emitting element array chip includes: a first light-emitting element array that includes a first light-emitting element including a first substrate, a light-emitting element layer formed on the first substrate, and a first cathode electrode electrically connected to the light-emitting element layer; and a second light-emitting element array that includes a second light-emitting element including a second substrate, a non-p-type lower reflector formed on the second substrate, and a second cathode electrode electrically connected to the non-p-type lower reflector, in which the first light-emitting element array is provided on an emission surface side of the second light-emitting element array.
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10.
公开(公告)号:US20210305774A1
公开(公告)日:2021-09-30
申请号:US17109728
申请日:2020-12-02
Applicant: FUJIFILM BUSINESS INNOVATION CORP.
Inventor: Daisuke IGUCHI , Kazuhiro SAKAI , Takeshi MINAMIRU
Abstract: A light-emitting device includes a laser element array having a quadrangular planar shape, a pair of capacitors that supply an electric current for light emission of the laser element array, and a driving unit that drives the laser element array by turning on and off the electric current for light emission of the laser element array. The pair of capacitors are disposed beside two sides of the laser element array that face each other so as to sandwich the laser element array, and the driving unit is disposed beside another side of the laser element array.
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