公开(公告)号：US20210108106A1

公开(公告)日：2021-04-15

申请号：US17063965

申请日：2020-10-06

Applicant: Fujifilm Electronic Materials U.S.A., Inc.

Inventor： Yannan Liang ,  Bin Hu ,  Liqing Wen ,  Shu-Wei Chang

IPC: C09G1/02 ,  H01L21/321

Abstract: A polishing composition includes an abrasive; an optional pH adjuster; a barrier film removal rate enhancer; a TEOS removal rate inhibitor; a cobalt removal rate enhancer; an azole-containing corrosion inhibitor; and a cobalt corrosion inhibitor.

公开(公告)号：US20240034958A1

公开(公告)日：2024-02-01

申请号：US18356486

申请日：2023-07-21

Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

Inventor： Yannan Liang ,  Bin Hu ,  Shu-Wei Chang

IPC: C11D11/00 ,  C11D1/02 ,  C11D3/00 ,  C11D3/33 ,  C11D3/30 ,  C11D3/28 ,  C11D3/39 ,  H01L21/306

CPC classification number: C11D11/0047 ,  C11D1/02 ,  C11D3/0047 ,  C11D3/33 ,  C11D3/30 ,  C11D3/28 ,  C11D3/3942 ,  H01L21/30625

Abstract: A composition includes at least one pH adjuster, at least one chelating agent, at least one anionic surfactant, at least one nitrogen containing heterocycle, at least one alkylamine compound, and an aqueous solvent, wherein the composition has a pH of from about 7 to about 14.

公开(公告)号：US11732157B2

公开(公告)日：2023-08-22

申请号：US17063965

申请日：2020-10-06

Applicant: Fujifilm Electronic Materials U.S.A., Inc.

Inventor： Yannan Liang ,  Bin Hu ,  Liqing Wen ,  Shu-Wei Chang

IPC: C09G1/02 ,  H01L21/321 ,  B24B1/00 ,  C09K3/14 ,  C09G1/00 ,  C09K13/06 ,  C09G1/04 ,  C09G1/06 ,  B24B37/04 ,  H01L21/306

CPC classification number: C09G1/02 ,  B24B1/00 ,  B24B37/044 ,  C09G1/00 ,  C09G1/04 ,  C09G1/06 ,  C09K3/1454 ,  C09K3/1463 ,  C09K13/06 ,  H01L21/30625 ,  H01L21/3212

Abstract: A polishing composition includes an abrasive; an optional pH adjuster; a barrier film removal rate enhancer; a TEOS removal rate inhibitor; a cobalt removal rate enhancer; an azole-containing corrosion inhibitor; and a cobalt corrosion inhibitor.

公开(公告)号：US20210301177A1

公开(公告)日：2021-09-30

申请号：US17214987

申请日：2021-03-29

Applicant: Fujifilm Electronic Materials U.S.A., Inc.

Inventor： James McDonough ,  Ting-Kai Huang ,  Yannan Liang ,  Shu-Wei Chang ,  Sung Tsai Lin ,  Liqing Wen

IPC: C09G1/02 ,  H01L21/321

Abstract: This disclosure features a polishing composition that includes at least one abrasive; at least one first corrosion inhibitor that includes a phosphate or a phosphonate group; at least one complexing agent; at least one second corrosion inhibitor that is at least one azole compound; and optionally a pH adjuster.