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公开(公告)号：US5928066A
公开(公告)日：1999-07-27
申请号：US993989
申请日：1997-12-18
摘要： A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the rotary drum; a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, and a wafer inclining member for changing the tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with the main surface of the wafer; and a moving member for bringing the wafer held on the supporting member into contact with or separating it from the tape wound around the rotary drum.
摘要翻译： 公开了半导体晶片的外围倒角部分的抛光装置。 抛光装置包括：围绕其周边的旋转鼓，其上缠绕有其上的研磨层的带; 用于旋转所述旋转滚筒的第一马达; 晶片保持机构，其包括用于保持晶片的晶片保持部件，用于旋转晶片保持部件的第二电动机，用于支撑晶片保持部件和第二电动机的支撑部件，以及用于改变晶片保持部件的倾斜角度的晶片倾斜部件 所述晶片相对于所述旋转鼓通过使所述支撑构件在基本上平行于所述晶片的主表面的第一轴线上往复旋转; 以及移动构件，用于使保持在支撑构件上的晶片与缠绕在旋转鼓上的带接触或分离。
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公开(公告)号：US5733181A
公开(公告)日：1998-03-31
申请号：US329952
申请日：1994-10-27
CPC分类号： B24B21/002 , B24B9/065
摘要： An apparatus for polishing the notch of a wafer in an effective and efficient way, which comprises: a flexible tape carrying abrasive grains in the working face thereof; an infeed reel for feeding the tape stored thereon: a take-up reel for taking up the tape fed from the infeed reel; a motor for driving to rotate the take-up reel; a means for blowing a fluid to the backside surface to the edge portion of the notch to be in direct contact along the full periphery of the notch; and a means for oscillating the tape sideways.
摘要翻译： 一种用于以有效和有效的方式抛光晶片的凹口的装置，其包括：在其工作面中承载磨料颗粒的柔性带; 用于馈送存储在其上的带的进给卷轴;卷取卷轴，用于卷取从进料卷轴进给的带; 用于驱动旋转卷取卷轴的马达; 用于将流体吹送到所述凹口的所述边缘部分的所述后侧表面沿着所述凹口的整个周边直接接触的装置; 以及用于横向摆动带的装置。
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公开(公告)号：US5476413A
公开(公告)日：1995-12-19
申请号：US306439
申请日：1994-09-19
IPC分类号： B24B9/00 , B24B9/06 , B24B21/00 , B24D9/06 , H01L21/304
CPC分类号： B24B9/065 , B24B21/002 , B24B21/004 , B24D9/06
摘要： An apparatus for polishing the periphery portion of a wafer, by which improvement on the polishing velocity may be effected and besides a more efficient spatial usage of the working layer of an abrasive tape is capable, comprising a tape holding fixed abrasive grains thereon; a feed reel for feeding the tape stored by winding itself; a take-up reel for taking up the tape by winding itself; a rotary drum inside of which both of the reels are equipped in such a manner that they are mountable or demountable, where a portion of the tape in the way from the feed reel to the take-up reel is adaptive to wind the rotary drum around the outer cylindrical surface thereof in close contact in the shape of a helicoid and one of the main faces of the wafer is positioned to be in a plane intersecting the central axis of the rotary drum at an angle.
摘要翻译： 抛光晶片周边部分的装置可以进行研磨速度的改善，并且除了可以更有效地利用砂带工作层的空间使用之外，还包括在其上保持固定磨粒的带; 用于馈送通过缠绕自身而存储的带的馈送卷轴; 用于卷绕磁带的卷取卷轴; 其中两个卷盘的两个卷轴被安装成可安装或拆卸的旋转滚筒，其中从进给卷轴到卷取卷轴的带的一部分适于卷绕旋转滚筒 其圆柱形表面紧密接触螺旋形状并且晶片的主面之一被定位成与旋转鼓的中心轴线成一定角度的平面。
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公开(公告)号：US5766065A
公开(公告)日：1998-06-16
申请号：US567162
申请日：1995-12-05
IPC分类号： B24B9/00 , B24B9/06 , H01L21/304 , B24B5/00
CPC分类号： B24B9/065
摘要： A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the rotary drum; a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, and a wafer inclining member for changing the tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with the main surface of the wafer; and a moving member for bringing the wafer held on the supporting member into contact with or separating it from the tape wound around the rotary drum.
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5.发明授权Method for mirror-polishing chamfered portion of wafer and mirror-polishing apparatus 失效用于镜面抛光的晶片倒角部分和镜面抛光装置的方法
公开(公告)号：US5727990A
公开(公告)日：1998-03-17
申请号：US779040
申请日：1997-01-06
CPC分类号： B24B9/065
摘要： A method and an apparatus, which enable mirror-polishing a peripheral chamfered portion of a semiconductor wafer effectively, are disclosed. Mirror-polishing a peripheral side surface of the chamfered portion of the wafer, beveled surfaces thereof, and rounded edges formed between the peripheral side surface and each of the beveled surfaces, are individually carried out.
摘要翻译： 公开了一种有效地对半导体晶片的外围倒角部进行镜面研磨的方法和装置。 对晶片的倒角部分的周边侧表面进行镜面抛光，其边缘表面和形成在周边侧表面和每个倾斜表面之间的圆形边缘分别进行。
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公开(公告)号：US5547415A
公开(公告)日：1996-08-20
申请号：US72741
申请日：1993-06-07
CPC分类号： B24B9/065 , B24B37/00 , B24B41/005
摘要： A method and apparatus for polishing chamfers made along the periphery; of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot, arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60.degree. to transfer the wafers.
摘要翻译： 一种沿周边抛光倒角的方法和装置; 半导体晶片被设计成使得当晶片被传送机器人臂的旋转吸盘拾取时，晶片不会从吸盘释放直到整个抛光操作完成; 在一个实施例中，使用具有六个晶片吸盘的圆形转台，其适于逐步转动，每个步骤包括60°的转角，以转移晶片。
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公开(公告)号：US5404678A
公开(公告)日：1995-04-11
申请号：US72776
申请日：1993-06-07
CPC分类号： B24B9/065 , B24B27/0023 , B24B41/005
摘要： A wafer chamfer polishing apparatus with a rotary circular dividing table, wherein the vacuum pump for pneumatically activating the wafer suction cups is mounted on an integral part of the rotary circular dividing table and the drive motors for dynamically activating the wafer suction cups are installed on an independent stationary body.
摘要翻译： 具有旋转圆形分割台的晶片倒角抛光装置，其中用于气动激活晶片吸盘的真空泵安装在旋转圆形分割台的一体部分上，用于动态启动晶片吸盘的驱动马达安装在 独立静止体。
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公开(公告)号：US06234879B1
公开(公告)日：2001-05-22
申请号：US08619882
申请日：1996-03-20
IPC分类号： B24B900
CPC分类号： B24B9/065 , B24B37/00 , B24B41/005
摘要： A method and apparatus for polishing chamfers made along the periphery of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60° to transfer the wafers.
摘要翻译： 一种用于抛光沿半导体晶片的周边形成的倒角的方法和装置，其设计成使得当晶片被传送机器人臂的旋转吸盘一次拾取时，晶片不会从吸盘释放直到整个抛光操作 完成了; 在一个实施例中，使用具有六个晶片吸盘的圆形转台，其适于逐步转动，每个步骤包括60°的转角以转移晶片。
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公开(公告)号：US5882539A
公开(公告)日：1999-03-16
申请号：US700604
申请日：1996-08-14
IPC分类号： B24B9/06 , B24B37/02 , B24B37/04 , H01L21/304 , B24B1/00
CPC分类号： H01L21/02021 , B24B37/02 , B24B37/042 , B24B9/065 , Y10S438/906 , Y10S438/928 , Y10S438/959 , Y10S438/974
摘要： A wafer processing method which can polish the chamfered portion of a wafer quickly, is disclosed. The processing method comprises the steps of: chamfering a peripheral portion of a wafer obtained by slicing an ingot, by grinding; lapping the wafer; etching the chamfered or lapped wafer; thereafter honing the entirety of the chamfered peripheral portion of the wafer by using a grinding stone while applying a predetermined load to the grinding stone; and thereafter polishing the entirety of the chamfered peripheral portion and the front and rear surfaces of the wafer.
摘要翻译： 公开了可以快速抛光晶片的倒角部分的晶片处理方法。 该处理方法包括以下步骤：通过研磨将通过切割锭块获得的晶片的周边部分倒角; 研磨晶圆; 蚀刻倒角或重叠的晶片; 然后通过使用研磨石珩磨整个切削的周边部分，同时向研磨石施加预定的载荷; 然后对整个切削的周边部分和晶片的前表面和后表面进行抛光。
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公开(公告)号：US5538463A
公开(公告)日：1996-07-23
申请号：US156829
申请日：1993-11-24
摘要： An apparatus for bevelling the edge of a wafer, comprising a framework, a table rotatably mounted to the framework and capable of holding down the wafer, a buff rotatably mounted to the framework opposite the table and having a formed groove for bevelling the wafer edge, an air cylinder assembly mounted to the framework and pressing the buff by different forces on the orientation flat, the circular edge and the round joints of the wafer held down by the table, a sensor sensing the orientation flat, the circular edge and the round joints of the wafer held down by the table and producing corresponding signals, and a control controlling the air cylinder assembly to select between the forces in response to the signals. The apparatus may comprise a grooving cutter assembly removably held by the table, a lock locking the rotation of the table when the apparatus produces the formed groove in the buff, and a stopper stopping the air cylinder assembly and positioning the cutter assembly relative to the buff.
摘要翻译： 一种用于斜切晶片边缘的装置，包括框架，可旋转地安装到框架并能够保持晶片的台子，可旋转地安装到与桌子相对的框架上的抛光轮，并具有用于斜切晶片边缘的形成的凹槽， 安装到框架上的气缸组件，并且通过由定位平面，圆形边缘和由桌子压下的晶片的圆形接头上的不同的力来挤压凸轮，感测定向平面，圆形边缘和圆形接头的传感器 并且产生对应的信号，以及控制气缸组件以响应于信号在力之间进行选择的控制。 该设备可以包括可移动地由工作台保持的切槽刀具组件，当设备在抛光器中产生形成的凹槽时锁定桌子的旋转，并且止动器阻止气缸组件并且相对于凸轮定位刀具组件 。
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