SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT

    公开(公告)号:US20250048594A1

    公开(公告)日:2025-02-06

    申请号:US18919998

    申请日:2024-10-18

    Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

    FUEL COOLING SYSTEM
    2.
    发明公开
    FUEL COOLING SYSTEM 审中-公开

    公开(公告)号:US20240246693A1

    公开(公告)日:2024-07-25

    申请号:US18156522

    申请日:2023-01-19

    CPC classification number: B64D37/34 F02C7/16 F02C7/22 F05D2260/213

    Abstract: A fuel system includes a fuel tank that stores fuel therein, and a fuel cooling system. The fuel cooling system includes a fuel cooling system fuel line in fluid communication with the fuel tank, one or more fuel cooling system heat exchangers in fluid communication with the fuel cooling system fuel line, and a fuel cooling system fuel pump. The fuel cooling system fuel pump pumps the fuel from the fuel tank such that the fuel flows through the fuel cooling system fuel line and into the one or more fuel cooling system heat exchangers to absorb heat from one or more aircraft components to become heated fuel. The heated fuel is returned and stored in the fuel tank.

    ADDITIVELY MANUFACTURED COOLING ASSEMBLIES FOR THERMAL AND/OR MECHANICAL SYSTEMS, AND METHODS FOR MANUFACTURING THE ASSEMBLIES

    公开(公告)号:US20210365086A1

    公开(公告)日:2021-11-25

    申请号:US17394088

    申请日:2021-08-04

    Abstract: A multi-domain cooling assembly configured to be coupled with one or more heat sources includes a body having an outer surface and at least one cooling chamber disposed inside the body. The at least one cooling chamber extends in at least two orthogonal dimensions and includes a working fluid to extract thermal energy from the one or more heat sources. The assembly includes a cooling channel disposed within the body and fluidly coupled with a passageway that carries cooling fluid into and out of the cooling channel. At least a portion of the cooling fluid is a liquid phase, a gas phase, or a liquid-gas mix phase. The cooling channel is fluidly separate from the at least one cooling chamber. The cooling channel is thermally coupled with the at least one cooling chamber. The at least one cooling chamber transfers thermal energy from the working fluid to the cooling fluid.

    SYSTEM AND METHOD FOR PASSIVELY COOLING AN ENCLOSURE
    8.
    发明申请
    SYSTEM AND METHOD FOR PASSIVELY COOLING AN ENCLOSURE 审中-公开
    用于惯性冷却外壳的系统和方法

    公开(公告)号:US20160338221A1

    公开(公告)日:2016-11-17

    申请号:US14711405

    申请日:2015-05-13

    CPC classification number: B60L15/007 H02M1/00 H05K7/20936 Y02T10/645

    Abstract: A system and method are provided for passively cooling an inverter subsystem within an enclosure. The method and system absorb heat generated by an inverter subsystem within an enclosure through a first heat spreader. The first heat spreader is thermally coupled to in the inverter subsystem and a first interior surface of the enclosure. The system and method transfer a portion of the heat from the first heat spreader to a second heat spreader through a plurality of heat pipes. The plurality of heat pipes are thermally coupled to the first heat spreader and the second heat spreader. The system and method further thermally couple the second heat spreader to a second interior surface of the enclosure.

    Abstract translation: 提供了一种用于被动地冷却外壳内的逆变器子系统的系统和方法。 该方法和系统通过第一散热器吸收外壳内的逆变器子系统产生的热量。 第一散热器热连接到逆变器子系统和外壳的第一内表面。 该系统和方法通过多个热管将一部分热量从第一散热器传递到第二散热器。 多个热管热耦合到第一散热器和第二散热器。 该系统和方法进一步将第二散热器热耦合到外壳的第二内表面。

    Systems and methods for using additive manufacturing for thermal management

    公开(公告)号:US12150279B2

    公开(公告)日:2024-11-19

    申请号:US16845381

    申请日:2020-04-10

    Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.

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