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公开(公告)号：US09845235B2
公开(公告)日：2017-12-19
申请号：US14844132
申请日：2015-09-03
Applicant: General Electric Company
Inventor： Joleyn Eileen Brewer , Christopher Fred Keimel , Marco Francesco Aimi , Andrew Minnick , Renner Stephen Ruffalo
CPC classification number: B81B3/0027 , B81B3/0075 , B81B7/0003 , B81B7/008 , B81B2201/01 , B81B2201/014 , B81B2201/0228 , B81B2203/0118 , B81B2203/0127 , B81B2203/0315 , B81B2203/053 , B81B2207/015 , B81B2207/115 , B81C1/00134 , B81C1/0015 , B81C1/00158 , B81C1/00182 , B81C1/00373 , B81C2201/0107 , G01L9/0042 , G01L9/0044
Abstract: A system and method for a micro-electrical-mechanical system (MEMS) device including a substrate and a free-standing and suspended electroplated metal MEMS structure formed on the substrate. The free-standing and suspended electroplated metal MEMS structure includes a metal mechanical element mechanically coupled to the substrate and a seed layer mechanically coupled to and in electrical communication with the mechanical element, the seed layer comprising at least one of a refractory metal and a refractory metal alloy, wherein a thickness of the mechanical element is substantially greater than a thickness of the seed layer such that the mechanical and electrical properties of the free-standing and suspended electroplated metal MEMS structure are defined by the material properties of the mechanical element.
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2.发明申请公开(公告)号：US20170062890A1
公开(公告)日：2017-03-02
申请号：US14839402
申请日：2015-08-28
Applicant: General Electric Company
Inventor： Yongjae Lee , Joseph Alfred Iannotti , Christopher Fred Keimel , Christopher James Kapusta
IPC: H01P1/10 , H01H61/01 , H01H57/00 , H01H55/00 , H01L21/56 , H01L21/52 , H01L21/54 , H01H59/00 , H01L21/48
CPC classification number: H01P1/15 , H01H55/00 , H01H57/00 , H01H59/0009 , H01H61/01 , H01H2057/006 , H01H2061/006 , H01L21/4853 , H01L21/52 , H01L21/54 , H01L21/56 , H01L2224/16225 , H01L2924/16195 , H01P1/127 , H01P3/084
Abstract: A RF MEMS package includes a MEMS die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.
Abstract translation: RF MEMS封装包括具有形成在第一安装衬底的顶表面上的信号线的MEMS管芯组件，所述信号线包括选择性地将所述信号线的第一部分电耦合到所述信号线的第二部分的MEMS器件， 以及两对接地焊盘，形成在第一安装基板的顶表面上，与信号线的相应部分相邻。 接地焊盘对被定位在MEMS器件的相应侧面附近。 接地组件电耦合到所述一对接地焊盘，并且包括形成在所述第二安装衬底的表面上的第二安装衬底和接地区域。 接地区域面向第一安装基板的顶表面并且电耦合到成对的接地焊盘。 在接地区域和信号线之间形成空穴。
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3.发明授权公开(公告)号：US09570783B1
公开(公告)日：2017-02-14
申请号：US14839402
申请日：2015-08-28
Applicant: General Electric Company
Inventor： Yongjae Lee , Joseph Alfred Iannotti , Christopher Fred Keimel , Christopher James Kapusta
IPC: H01P1/10 , H01H57/00 , H01P1/15 , H01H59/00 , H01H61/01 , H01H55/00 , H01L21/48 , H01L21/56 , H01L21/52 , H01L21/54 , H01H61/00
CPC classification number: H01P1/15 , H01H55/00 , H01H57/00 , H01H59/0009 , H01H61/01 , H01H2057/006 , H01H2061/006 , H01L21/4853 , H01L21/52 , H01L21/54 , H01L21/56 , H01L2224/16225 , H01L2924/16195 , H01P1/127 , H01P3/084
Abstract: A RF MEMS package includes a MEMS die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.
Abstract translation: RF MEMS封装包括具有形成在第一安装衬底的顶表面上的信号线的MEMS管芯组件，所述信号线包括选择性地将所述信号线的第一部分电耦合到所述信号线的第二部分的MEMS器件， 以及两对接地焊盘，形成在第一安装基板的顶表面上，与信号线的相应部分相邻。 接地焊盘对被定位在MEMS器件的相应侧面附近。 接地组件电耦合到所述一对接地焊盘，并且包括形成在所述第二安装衬底的表面上的第二安装衬底和接地区域。 接地区域面向第一安装基板的顶表面并且电耦合到成对的接地焊盘。 在接地区域和信号线之间形成空穴。
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公开(公告)号：US09465160B2
公开(公告)日：2016-10-11
申请号：US13970852
申请日：2013-08-20
Applicant: General Electric Company
Inventor： Christopher Fred Keimel , John Brian Hewgley , Juan Jose Becerra
CPC classification number: G02B6/02 , B32B37/12 , B32B37/24 , B32B2037/243 , B32B2255/205 , B32B2255/28 , B32B2307/40 , B32B2307/412 , B32B2551/00 , C25D11/04 , C25D11/26 , G02B6/1226
Abstract: A method of manufacturing a layered material stack that includes a plasmonic interface between a plasmonic material and optical waveguide material is disclosed. The method includes providing a substrate layer, disposing a layer of plasmonic material on the substrate layer, depositing a metal constituent of an optical waveguide material directly onto the layer of plasmonic material, and anodizing the metal constituent of the optical waveguide material to form an optically transparent oxide of the metal constituent configured to couple light into the layer of plasmonic material, with the optically transparent oxide of the metal constituent forming an optical waveguide structure.
Abstract translation: 公开了一种制造层状材料堆叠的方法，其包括等离子体激元材料和光波导材料之间的等离子体激元界面。 该方法包括提供衬底层，在衬底层上设置等离子体激元材料层，将光波导材料的金属成分直接沉积到等离子体激元材料层上，以及阳极氧化光波导材料的金属成分以形成光学 金属成分的透明氧化物构造成将光耦合到等离子体激元材料层中，金属成分的光学透明氧化物形成光波导结构。
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公开(公告)号：US11326883B2
公开(公告)日：2022-05-10
申请号：US16549760
申请日：2019-08-23
Applicant: General Electric Company
IPC: G01C19/5684 , G01P15/02 , G01P15/08
Abstract: A gyroscope includes at least one anchor and a plurality of gyroscope spring elements coupled to the at least one anchor. The gyroscope also includes a plurality of concentric rings coupled to the plurality of gyroscope spring elements and configured to encircle the plurality of gyroscope spring elements. The gyroscope further includes an excitation/detection/tuning unit electrostatically coupled to the plurality of concentric rings.
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Patent Agency Ranking
公开(公告)号：US10511163B2
公开(公告)日：2019-12-17
申请号：US14982735
申请日：2015-12-29
Applicant: General Electric Company
Abstract: A surge suppression device includes a micro electromechanical system (MEMS) switch electrically connected to a current path. Additionally, the surge suppression device includes a transient voltage suppression (TVS) device electrically connected in series to the MEMS switch. The surge suppression device is configured to protect electronic components from voltage surges or current surges.
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公开(公告)号：US10068733B2
公开(公告)日：2018-09-04
申请号：US14919797
申请日：2015-10-22
Applicant: General Electric Company
Inventor： Yanfei Liu , Glenn Scott Claydon , Christopher Fred Keimel , Christian Michael Giovanniello, Jr.
Abstract: A switching system includes a MEMS switching circuit having a MEMS switch and a driver circuit, and an auxiliary circuit coupled in parallel with the MEMS switching circuit that comprises solid state switching circuitry. A control circuit in communication with the MEMS switching circuit and the auxiliary circuit performs selective switching of a load current towards the MEMS switching circuitry and the auxiliary circuit, with the control circuit programmed to transmit a control signal to the driver circuit to cause the MEMS switch to actuate to an open or closed position across a switching interval, activate the auxiliary circuit during the switching interval when the MEMS switch is switching between the open and closed positions, and deactivate the auxiliary circuit upon reaching the open or closed position after completion of the switching interval, such that the load current selectively flows through the MEMS switch and the solid state switching circuitry.
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公开(公告)号：US09954263B2
公开(公告)日：2018-04-24
申请号：US14839464
申请日：2015-08-28
Applicant: General Electric Company
Inventor： Yongjae Lee , Joseph Alfred Iannotti , Christopher Fred Keimel , Christopher James Kapusta
CPC classification number: H01P1/127 , B81B7/007 , H01H49/00 , H01H59/0009 , H01P11/00
Abstract: A radio frequency (RF) microelectromechanical system (MEMS) package includes a first mounting substrate, a signal line formed on a top surface of the first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and a ground assembly coupled to the first mounting substrate. The ground assembly includes a second mounting substrate, a ground plane formed on a bottom surface of the second mounting substrate, and at least one electrical interconnect extending through a thickness of the second mounting substrate to contact the ground plane, wherein the ground plane is spaced apart from the signal line.
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公开(公告)号：US20170117109A1
公开(公告)日：2017-04-27
申请号：US14919769
申请日：2015-10-22
Applicant: General Electric Company
Inventor： Yanfei Liu , Glenn Scott Claydon , Christopher Fred Keimel , Christian Michael Giovanniello, JR.
CPC classification number: H01H47/02 , H01H9/542 , H01H59/0009 , H01H2071/008
Abstract: A switching system includes a MEMS switching circuit having a MEMS switch and a driver circuit. An auxiliary circuit is coupled in parallel with the MEMS switching circuit, the auxiliary circuit comprising first and second connections that connect the auxiliary circuit to the MEMS switching circuit on opposing sides of the MEMS switch, first and second solid state switches connected in parallel, and a resonant circuit connected between the first and second solid state switches. A control circuit controls selective switching of a load current towards the MEMS switching circuit and the auxiliary circuit by selectively activating the first and second solid state switches and the resonant circuit so as to limit a voltage across the MEMS switch by diverting at least a portion of the load current away from the MEMS switch to flow to the auxiliary circuit prior to the MEMS switch changing state.
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公开(公告)号：US09362608B1
公开(公告)日：2016-06-07
申请号：US14558990
申请日：2014-12-03
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Yongjae Lee , Marco Francesco Aimi , Glenn Scott Claydon , Christopher Fred Keimel
CPC classification number: H01P1/127 , H01H59/0009 , H01H2001/0084
Abstract: An ohmic RF MEMS relay includes a substrate with a capacitive coupling, Csub; two actuating elements electrically coupled in series, so as to define a channel, wherein the actuating elements are configured to be independently actuated or simultaneously operated. The actuating elements have their own capacitive coupling, Cgap; a midpoint on the channel is in electrical communication with the actuating elements; and an anchor mechanically coupled to the substrate and supporting at least one of the actuating elements. Also, an ohmic RF MEMS relay that includes an input port; a plurality of first MEMS switches that make up a first switching group in electrical communication with the input port, thereby defining a plurality of channels each leading from each of the MEMS switches; and at least one outlet port along each of the channels distal from the first switching group and in electrical communication with the input port.
Abstract translation: 欧姆RF MEMS继电器包括具有电容耦合的衬底，Csub; 串联电耦合的两个致动元件，以便限定通道，其中所述致动元件构造成独立地致动或同时操作。 致动元件具有自己的电容耦合，Cgap; 通道上的中点与致动元件电连通; 以及锚固件，其机械地联接到所述基板并且支撑所述致动元件中的至少一个。 另外，包括输入端口的欧姆RF MEMS继电器; 多个第一MEMS开关，其构成与所述输入端口电连通的第一开关组，从而限定每个从所述MEMS开关导出的多个通道; 以及沿着远离第一开关组的每个通道的至少一个出口端口，并与输入端口电连通。
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