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公开(公告)号:US20230266544A1
公开(公告)日:2023-08-24
申请号:US17679188
申请日:2022-02-24
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian , Nicholas Polomoff , Keith Donegan , Qizhi Liu , Steven M. Shank
IPC: G02B6/42 , H01S5/02251
CPC classification number: G02B6/4212 , G02B6/421 , G02B6/4245 , H01S5/02251 , G02B1/002
Abstract: Structures including an edge coupler, and methods of fabricating a structure that includes an edge coupler. The structure includes an edge coupler having a waveguide core with an end surface and a longitudinal axis. The end surface defines a plane tilted in a first direction at a first acute angle relative to the longitudinal axis and tilted in a second direction at a second acute angle relative to the longitudinal axis. The second direction differs from the first direction.
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公开(公告)号:US20230352570A1
公开(公告)日:2023-11-02
申请号:US17733118
申请日:2022-04-29
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Mark D. Levy , Sarah A. McTaggart , Laura J. Silverstein , Qizhi Liu , Jason E. Stephens
IPC: H01L29/732 , H01L29/66 , H01L29/08 , H01L29/10 , H01L29/45
CPC classification number: H01L29/732 , H01L29/66272 , H01L29/0817 , H01L29/0821 , H01L29/1004 , H01L29/456
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a bipolar junction transistor and methods of manufacture. The structure includes: a collector region; a base region adjacent to the collector region; an emitter region adjacent to the base region; contacts having a first material connecting to the collector region and the base region; and at least one contact having a second material connecting to the emitter region.
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公开(公告)号:US11094834B2
公开(公告)日:2021-08-17
申请号:US16790084
申请日:2020-02-13
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Qizhi Liu , Vibhor Jain , John J. Pekarik , Judson R. Holt
IPC: H01L21/00 , H01L29/808 , H01L29/06 , H01L29/10 , H01L29/08 , H01L21/02 , H01L21/225 , H01L29/66
Abstract: A junction field effect transistor (JFET) structure includes a doped polysilicon gate over a channel region of a semiconductor layer. The doped polysilicon gate has a first doping type. A raised epitaxial source is on the source region of the semiconductor layer and adjacent a first sidewall of the doped polysilicon gate, and has a second doping type opposite the first doping type. A raised epitaxial drain is on the drain region of the semiconductor layer and adjacent a second sidewall of the doped polysilicon gate, and has the second doping type. A doped semiconductor region is within the channel region of the semiconductor layer and extending from the source region to the drain region, and a non-conductive portion of the semiconductor layer is within the channel region to separate the doped semiconductor region from the doped polysilicon gate.
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公开(公告)号:US20210091213A1
公开(公告)日:2021-03-25
申请号:US16748055
申请日:2020-01-21
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Vibhor Jain , John J. Pekarik , Qizhi Liu , Judson Holt
IPC: H01L29/737 , H01L29/06 , H01L29/08 , H01L29/10 , H01L29/66
Abstract: Structures for a heterojunction bipolar transistor and methods of forming a structure for a heterojunction bipolar transistor. A collector layer includes an inclined side surface, and a dielectric layer is positioned in a lateral direction adjacent to the inclined side surface of the collector layer. An intrinsic base is disposed over the collector layer, and an emitter is disposed over the intrinsic base. An airgap is positioned between the dielectric layer and the inclined side surface of the collector layer in the lateral direction, and an extrinsic base is positioned in the lateral direction adjacent to the intrinsic base. The extrinsic base is positioned over the airgap.
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公开(公告)号:US11869941B2
公开(公告)日:2024-01-09
申请号:US17679166
申请日:2022-02-24
Applicant: GlobalFoundries U.S. Inc.
Inventor: Sarah A. McTaggart , Rajendran Krishnasamy , Qizhi Liu
IPC: H01L21/265 , H01L29/732 , H01L29/737 , H01L29/08 , H01L29/66
CPC classification number: H01L29/0817 , H01L21/26586 , H01L29/66272 , H01L29/732 , H01L29/7371
Abstract: Disclosed are a structure including a transistor and a method of forming the structure. The transistor includes an emitter region with first and second emitter portions. The first emitter portion extends through a dielectric layer. The second emitter portion is on the first emitter portion and the top of the dielectric layer. An additional dielectric layer covers the top of the second emitter portion. The second emitter portion and the dielectric and additional dielectric layers are wider than the first emitter portion. At least a section of the second emitter portion is narrower than the dielectric and additional dielectric layers, thereby creating cavities positioned vertically between edge portions of the dielectric and additional dielectric layers and positioned laterally adjacent to the second emitter portion. The cavities are filled with dielectric material or dielectric material blocks the side openings to the cavities creating pockets of air, of gas or under vacuum.
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公开(公告)号:US11656409B2
公开(公告)日:2023-05-23
申请号:US17197133
申请日:2021-03-10
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Yusheng Bian , Qizhi Liu
Abstract: Embodiments of the disclosure provide an optical antenna for a photonic integrated circuit (PIC). The optical antenna includes a semiconductor waveguide on a semiconductor layer. The semiconductor waveguide includes a first vertical sidewall over the semiconductor layer over the semiconductor layer. A plurality of grating protrusions extends horizontally from the first vertical sidewall of the semiconductor waveguide.
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公开(公告)号:US20220404547A1
公开(公告)日:2022-12-22
申请号:US17354408
申请日:2021-06-22
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Yusheng Bian , Qizhi Liu
Abstract: Embodiments of the disclosure provide an optical antenna for a photonic integrated circuit (PIC). The optical antenna includes a vertically oriented semiconductor waveguide with a first end on a semiconductor layer. The vertically oriented semiconductor waveguide includes a first sidewall and a second sidewall opposite the first sidewall. A reflective material is along the second sidewall of the vertically oriented semiconductor waveguide. A first plurality of grating protrusions extends from the first sidewall of the vertically oriented semiconductor waveguide.
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公开(公告)号:US20220190145A1
公开(公告)日:2022-06-16
申请号:US17120916
申请日:2020-12-14
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Sarah McTaggart , Qizhi Liu , Vibhor Jain , Mark Levy , Paula Fisher , James R. Elliott
IPC: H01L29/737 , H01L29/66
Abstract: Device structures and fabrication methods for heterojunction bipolar transistors. Trench isolation regions are positioned in a semiconductor substrate to define active regions. A base layer includes first sections that are respectively positioned over the active regions and second sections that are respectively positioned over the trench isolation regions. Emitter fingers are respectively positioned on the first sections of the base layer. The first sections of the base layer include single-crystal semiconductor material, and the second sections of the base layer include polycrystalline semiconductor material. The second sections of the base layer are spaced in a vertical direction from the trench isolation regions to define a first cavity that extends about a perimeter of the base layer and second cavities that are connected to the first cavity.
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公开(公告)号:US11217685B2
公开(公告)日:2022-01-04
申请号:US16909376
申请日:2020-06-23
Applicant: GLOBALFOUNDRIES U.S. INC.
Inventor: Herbert Ho , Vibhor Jain , John J. Pekarik , Claude Ortolland , Judson R. Holt , Qizhi Liu , Viorel Ontalus
IPC: H01L29/737 , H01L29/66 , H01L29/08
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a device with a marker layer and methods of manufacture. The device includes: a collector region; an intrinsic base region above the collector region; an emitter region comprising emitter material and a marker layer vertically between the intrinsic base region and the emitter material; and an extrinsic base region in electrical contact with the intrinsic base region.
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公开(公告)号:US11145725B2
公开(公告)日:2021-10-12
申请号:US16823005
申请日:2020-03-18
Applicant: GLOBALFOUNDRIES U.S. INC.
Inventor: Qizhi Liu , Vibhor Jain , Judson R. Holt , Herbert Ho , Claude Ortolland , John J. Pekarik
IPC: H01L29/417 , H01L29/66 , H01L29/737 , H01L29/08
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a heterojunction bipolar transistor and methods of manufacture. The structure includes: a sub-collector region; a collector region in electrical connection to the sub-collector region; an emitter located adjacent to the collector region and comprising emitter material, recessed sidewalls on the emitter material and an extension region extending at an upper portion of the emitter material above the recessed sidewalls; and an extrinsic base separated from the emitter by the recessed sidewalls.
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