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    Methods and apparatus for processing a substrate
    2.
    发明申请
    Methods and apparatus for processing a substrate 有权
    用于处理衬底的方法和设备

    公开(公告)号：US20070131654A1

    公开(公告)日：2007-06-14

    申请号：US11299295

    申请日：2005-12-09

    申请人： Erik Wasinger ,  Gary Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Shin ,  Donald Olgado

    发明人： Erik Wasinger ,  Gary Ettinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Shin ,  Donald Olgado

    IPC分类号： C03C15/00 ,  H01L21/306

    CPC分类号： C03C19/00 ,  B24B1/04 ,  B24B9/065 ,  B24B21/004 ,  H01L21/02021

    摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.

    摘要翻译： 适于抛光衬底边缘的装置和方法包括抛光膜，适于张紧和加载抛光膜的框架，使得膜的至少一部分被支撑在平面中，以及基板旋转驱动器，其适于旋转 衬底抵靠抛光膜的平面，使得抛光膜适于对衬底施加力，轮廓到衬底的边缘，边缘至少包括外边缘和第一斜面，并且抛光外边缘和 第一斜面作为基底旋转。 提供了许多其他方面。

    METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
    5.
    发明申请
    METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE 审中-公开
    用于处理基板的方法和装置

    公开(公告)号：US20090017731A1

    公开(公告)日：2009-01-15

    申请号：US12239730

    申请日：2008-09-26

    申请人： Gary C. Ettinger ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

    发明人： Gary C. Ettinger ,  Erik C. Wasinger ,  Sen-Hou Ko ,  Wei-Yung Hsu ,  Liang-Yuh Chen ,  Ho Seon Shin ,  Donald Olgado

    IPC分类号： B24B1/00

    CPC分类号： B24B9/065 ,  B24B21/002 ,  B24B41/002 ,  H01L21/02021

    摘要： Methods and apparatus for cleaning an edge of a substrate are provided. The invention includes a polishing film having a polishing side and a second side; an inflatable pad disposed adjacent the second side of the polishing film; a frame adapted to support the polishing film and the inflatable pad; and a substrate rotation driver adapted to rotate a substrate against the polishing side of the polishing film, wherein the polishing film is disposed between an edge of the substrate and the inflatable pad so that the inflatable pad and polishing film contour to the edge of the substrate with the polishing film contacting the edge of the substrate. Numerous other aspects are provided.

    摘要翻译： 提供了用于清洁基板边缘的方法和设备。 本发明包括具有抛光侧和第二面的抛光膜; 邻近抛光膜的第二侧设置的可充气垫; 适于支撑抛光膜和可充气垫的框架; 以及衬底旋转驱动器，其适于将衬底旋转抵靠所述抛光膜的抛光侧，其中所述抛光膜设置在所述衬底的边缘和所述可充气垫之间，使得所述可充气衬垫和抛光膜轮廓到所述衬底的边缘 抛光膜与基板的边缘接触。 提供了许多其他方面。

    Methods and apparatus for cleaning an edge of a substrate
    7.
    发明申请
    Methods and apparatus for cleaning an edge of a substrate 审中-公开
    用于清洁衬底边缘的方法和设备

    公开(公告)号：US20060243304A1

    公开(公告)日：2006-11-02

    申请号：US11411012

    申请日：2006-04-24

    申请人： Wei-Yung Hsu ,  Donald Olgado ,  Ho Shin ,  Liang-Yuh Chen

    发明人： Wei-Yung Hsu ,  Donald Olgado ,  Ho Shin ,  Liang-Yuh Chen

    IPC分类号： B08B7/00 ,  B08B5/04

    CPC分类号： H01L21/67046 ,  B08B1/04 ,  H01L21/67028

    摘要： In one aspect, a method for cleaning an edge of a substrate is provided. The method includes the steps of (a) supporting a substrate on a rotatable substrate support; (b) contacting an edge of the substrate with one or more rollers; (c) rotating the substrate support so as to rotate the substrate; and (d) rotating the one or more rollers so as to clean the edge of the substrate Numerous other aspects are provided.

    摘要翻译： 一方面，提供一种清洗基板的边缘的方法。 该方法包括以下步骤：（a）将基板支撑在可旋转的基板支撑件上; （b）使所述基板的边缘与一个或多个辊接触; （c）旋转衬底支撑件以旋转衬底; 和（d）旋转所述一个或多个辊以便清洁所述基底的边缘。提供许多其它方面。