Method for fabricating semiconductor device including gate spacer
    2.
    发明授权
    Method for fabricating semiconductor device including gate spacer 有权
    包括栅极间隔物的半导体器件的制造方法

    公开(公告)号:US06815320B2

    公开(公告)日:2004-11-09

    申请号:US10444221

    申请日:2003-05-23

    IPC分类号: H01L213205

    摘要: Provided is a method for fabricating a semiconductor device. According to the method, an insolating layer which defines an active region on a semiconductor substrate is formed and a gate is formed on the active region of the semiconductor substrate. A first spacer layer which covers the gate and is extended to cover the isolating layer is formed as a first insulating material. A second spacer layer is formed on the first spacer layer as a second insulating material. A second spacer which remains on the sidewalls of the gate by removing some portions of the second spacer layer is formed. A first spacer by a portion of the first spacer layer, which is protected by the second spacer by partially etching the exposed portions of the first spacer layer using the second spacer as a mask so as to reduce the thickness of the first spacer layer, and a protection layer, which protects the insulating layer by remaining the portion of the first spacer of which thickness is reduced, are formed. The second spacer is selectively removed and a gate spacer of the first spacer is formed by removing the remaining protection layer.

    摘要翻译: 提供一种制造半导体器件的方法。 根据该方法,形成在半导体衬底上限定有源区的绝缘层,并且在半导体衬底的有源区上形成栅极。 覆盖栅极并延伸以覆盖隔离层的第一间隔层形成为第一绝缘材料。 第二间隔层作为第二绝缘材料形成在第一间隔层上。 形成通过去除第二间隔层的一些部分而保留在栅极的侧壁上的第二间隔物。 第一间隔物通过第一间隔层的一部分被第二间隔物保护,通过使用第二间隔物作为掩模部分蚀刻第一间隔层的暴露部分以减小第一间隔层的厚度,以及 形成保护层,其通过保留厚度减小的第一间隔物的部分来保护绝缘层。 选择性地去除第二间隔物,并且通过去除剩余的保护层来形成第一间隔物的栅极间隔物。

    CMOS gate electrode using selective growth and a fabrication method thereof
    3.
    发明授权
    CMOS gate electrode using selective growth and a fabrication method thereof 失效
    CMOS栅电极及其制造方法

    公开(公告)号:US06696328B2

    公开(公告)日:2004-02-24

    申请号:US10413387

    申请日:2003-04-15

    IPC分类号: H01L218238

    CPC分类号: H01L21/823842 Y10S438/933

    摘要: A CMOS gate electrode formed using a selective growth method and a fabrication method thereof, wherein, in the CMOS gate electrode, a first gate pattern of polysilicon germanium (poly-SiGe) is formed on a PMOS region of a semiconductor substrate, and a second gate pattern of polysilicon is selectively grown from an underlying layer. Although the first gate pattern on the PMOS region is formed of poly-SiGe, the characteristics of the second gate pattern on the NMOS region do not deteriorate, thereby increasing the overall characteristics of a CMOS transistor.

    摘要翻译: 一种使用选择性生长方法形成的CMOS栅电极及其制造方法,其中在CMOS栅电极中,在半导体衬底的PMOS区上形成多晶硅锗(poly-SiGe)的第一栅极图案, 从下层选择性地生长多晶硅的栅极图案。 尽管PMOS区上的第一栅极图案是由多晶硅形成的,但NMOS区域上的第二栅极图案的特性不会恶化,从而增加了CMOS晶体管的总体特性。

    Non-volatile memory device and method of fabricating the same
    8.
    发明授权
    Non-volatile memory device and method of fabricating the same 失效
    非易失性存储器件及其制造方法

    公开(公告)号:US07586137B2

    公开(公告)日:2009-09-08

    申请号:US11200491

    申请日:2005-08-09

    IPC分类号: H01L29/76

    摘要: A non-volatile memory device having an asymmetric channel structure is provided. The non-volatile memory device includes a semiconductor substrate, a source region and a drain region which are formed in the semiconductor substrate and doped with n-type impurities, a trapping structure which includes a tunneling layer, which is disposed on a predetermined region of the semiconductor substrate and through which charge carriers are tunneled, and a charge trapping layer, which is formed on the tunneling layer and traps the tunneled charge carriers, a gate insulating layer which is formed on the trapping structure and the exposed semiconductor substrate, a gate electrode which is formed on the gate insulating layer, and a channel region which is formed between the source region and the drain region and includes a first channel region formed on a lower part of the trapping structure and a second channel region formed on a lower part of the gate insulating layer, the threshold voltage of the first channel region being lower than that of the second channel region.

    摘要翻译: 提供了具有非对称沟道结构的非易失性存储器件。 非易失性存储器件包括形成在半导体衬底中并掺杂有n型杂质的半导体衬底,源极区和漏极区,包括隧穿层的俘获结构,其被布置在 半导体衬底和通过其电荷载流子被隧道化;以及电荷俘获层,其形成在隧穿层上并俘获隧穿电荷载流子;形成在俘获结构和暴露的半导体衬底上的栅极绝缘层,栅极 形成在栅极绝缘层上的电极和形成在源极区域和漏极区域之间的沟道区域,并且包括形成在捕获结构的下部的第一沟道区域和形成在栅极绝缘层的下部的第二沟道区域 所述第一沟道区的阈值电压低于所述第二沟道区的阈值电压。

    Non-volatile memory device and method of fabricating the same
    9.
    发明授权
    Non-volatile memory device and method of fabricating the same 有权
    非易失性存储器件及其制造方法

    公开(公告)号:US07473961B2

    公开(公告)日:2009-01-06

    申请号:US11183614

    申请日:2005-07-18

    IPC分类号: H01L29/792

    摘要: A non-volatile memory device having improved electrical characteristics and a method of fabricating the non-volatile memory device are provided. The non-volatile memory device includes a gate electrode, which is formed on a semiconductor substrate on which source and drain regions are formed, a trapping structure, which is interposed between the semiconductor substrate and the gate electrode and comprises an electron tunneling layer and a charge trapping layer, and an electron back-tunneling prevention layer, which is interposed between the gate electrode and the charge trapping layer, prevents electrons in the gate electrode from back-tunneling through the charge trapping layer, and is formed of a metal having a higher work function than the gate electrode.

    摘要翻译: 提供了具有改善的电特性的非易失性存储器件以及制造该非易失性存储器件的方法。 非易失性存储器件包括形成在其上形成有源极和漏极区域的半导体衬底上的栅电极,该栅极电极介于半导体衬底和栅电极之间,并且包括电子隧穿层和 电荷捕获层和插入在栅电极和电荷捕获层之间的电子反向穿隧防止层防止栅电极中的电子通过电荷捕获层反向隧穿,并且由具有 工作功能比栅电极高。

    Non-volatile memory device and method of fabricating the same

    公开(公告)号:US20060027854A1

    公开(公告)日:2006-02-09

    申请号:US11200491

    申请日:2005-08-09

    IPC分类号: H01L29/76

    摘要: A non-volatile memory device having an asymmetric channel structure is provided. The non-volatile memory device includes a semiconductor substrate, a source region and a drain region which are formed in the semiconductor substrate and doped with n-type impurities, a trapping structure which includes a tunneling layer, which is disposed on a predetermined region of the semiconductor substrate and through which charge carriers are tunneled, and a charge trapping layer, which is formed on the tunneling layer and traps the tunneled charge carriers, a gate insulating layer which is formed on the trapping structure and the exposed semiconductor substrate, a gate electrode which is formed on the gate insulating layer, and a channel region which is formed between the source region and the drain region and includes a first channel region formed on a lower part of the trapping structure and a second channel region formed on a lower part of the gate insulating layer, the threshold voltage of the first channel region being lower than that of the second channel region.