公开(公告)号：US11964277B2

公开(公告)日：2024-04-23

申请号：US17691214

申请日：2022-03-10

Applicant: Hewlett-Packard Development Company L.P.

Inventor： David Olsen ,  Si-lam J. Choy ,  Paul Mark Haines ,  Justin M. Roman

IPC: G01N33/68 ,  A01N1/02 ,  B01L3/00 ,  C07C309/65 ,  C07C309/73 ,  G01N1/40 ,  G01N21/01 ,  G01N21/31 ,  G01N21/33 ,  G01N21/64 ,  G01N27/414 ,  G01N33/52 ,  G01N33/532 ,  G01N33/543 ,  G01N33/569 ,  G01N33/72 ,  G01N35/00 ,  G01N35/02 ,  G01N35/04 ,  G01N35/10

CPC classification number: B01L3/502746 ,  B01L2300/048 ,  B01L2400/0487 ,  B01L2400/0605 ,  B01L2400/0622 ,  B01L2400/082

Abstract: A metered volume microfluidic device can include fluid flow microfluidics. The fluid flow microfluidics can include an inflow channel, a metered volume chamber positioned to receive working fluid from the inflow channel, a metered volume outflow channel positioned to receive and direct a metered volume of the working fluid when discharged from the metered volume chamber, and a capillary check valve. The capillary check valve can allow excess working fluid to exit the metered volume chamber when filling the metered volume chamber via the inflow channel. The capillary check valve can also prevent excess working fluid that has passed there through from being reintroduced into the metered volume chamber when the working fluid is discharged into the metered volume outflow channel.

公开(公告)号：US20190119104A1

公开(公告)日：2019-04-25

申请号：US16094287

申请日：2016-07-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Devin Alexander Mourey ,  Michael W. Cumbie ,  Si-lam J. Choy

IPC: B81B7/04 ,  G01C19/00 ,  G01P15/08

Abstract: One example provides a microelectromechanical systems (MEMS) device that includes a number of silicon die over-molded with an overmold material, a number of active areas formed on the silicon die, the active areas including at least one sensor to sense a number of attributes of a fluid introduced to the at least one sensor, and a fan-out layer coupled to the silicon die, the fan-out layer including a number of fluid channels formed therein that interface with active areas of the silicon die and allow the fluid to flow to the at least one sensor.

公开(公告)号：US12023937B2

公开(公告)日：2024-07-02

申请号：US17798902

申请日：2020-03-11

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Jacob M. Lum ,  Si-lam J. Choy ,  Jeffrey R. Pollard ,  Tsuyoshi Yamashita ,  Jeremy Sells ,  Garrett E. Clark

IPC: B41J2/18 ,  B41J2/14

CPC classification number: B41J2/18 ,  B41J2/1408

Abstract: A fluid ejection die may include a fluid actuator, a substrate supporting the fluid actuator, a chamber layer supported by the substrate and a bypass passage in the substrate. The substrate may include a closed inlet channel having an inlet opening for connection to an outlet of a fluid source and an outlet channel having an outlet opening of a first size for connection to an inlet of the fluid source. The chamber layer includes a recirculation passage to supply fluid for ejection by the fluid actuator through an ejection orifice and to circulate fluid across the fluid actuator from the closed inlet channel to the outlet channel. The bypass passage is of a second size less than the first size and connects the inlet channel to the inlet of the fluid source while bypassing any fluid actuator provided for ejecting fluid through an ejection orifice.

公开(公告)号：US11975468B2

公开(公告)日：2024-05-07

申请号：US17312349

申请日：2019-07-26

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Si-lam J. Choy ,  Michael W. Cumbie

IPC: B29C45/00 ,  B29C45/14 ,  B29C45/32 ,  B41J2/16 ,  B29K63/00 ,  B29L31/00

CPC classification number: B29C45/14508 ,  B29C45/14065 ,  B29C45/322 ,  B41J2/1601 ,  B41J2/1637 ,  B29K2063/00 ,  B29K2995/0012 ,  B29L2031/767

Abstract: In various examples, a printbar is formed from multiple modular fluid ejection subassemblies joined together through a molding process that provides for a continuous planar substrate surface. A mold may secure the modular fluid ejection subassemblies during a molding process in which a runner conveys a molding material to seams between the joined modular fluid ejection subassemblies.

公开(公告)号：US11117376B2

公开(公告)日：2021-09-14

申请号：US16226904

申请日：2018-12-20

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Si-lam J. Choy ,  Devin Mourey ,  Eric L. Nikkel

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/155

Abstract: A printhead assembly may include a first set of distinct parallel printhead dies in a second set of distinct parallel printhead dies. The first set of distinct parallel printhead dies may have respective major dimensions extending in a longitudinal direction and respective ends that are aligned in a transverse direction. The second set of distinct parallel printhead dies may have respective major dimensions extending in the longitudinal direction and respective ends aligned in the transverse direction. The second set of distinct parallel printhead dies may partially overlap the first set of distinct parallel printhead dies in the transverse direction.

公开(公告)号：US20230234355A1

公开(公告)日：2023-07-27

申请号：US18127619

申请日：2023-03-28

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Galen Cook ,  Garrett E. Clark ,  Michael W. Cumbie ,  James R. Przybyla ,  Richard Seaver ,  Frank D. Derryberry ,  Si-lam J. Choy

IPC: B41J2/145 ,  B41J2/14

CPC classification number: B41J2/145 ,  B41J2/14 ,  B41J2002/14459 ,  B41J2202/12 ,  B41J2202/20

Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.

公开(公告)号：US20220032626A1

公开(公告)日：2022-02-03

申请号：US17276971

申请日：2018-11-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Si-lam J. Choy

IPC: B41J2/16 ,  B41J2/14 ,  B29C35/02 ,  B29C53/04

Abstract: A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.

公开(公告)号：US20190135615A1

公开(公告)日：2019-05-09

申请号：US16099020

申请日：2016-07-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Si-lam J. Choy ,  Chien-Hua Chen ,  Michael W. Cumbie ,  Devin Alexander Mourey

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/18 ,  H01L23/29

Abstract: A composite wafer includes a first silicon die with a first top surface; and a polymer substrate with a top surface and a bottom surface. The silicon die is embedded in the polymer substrate such that the top surface of the substrate and the first top surface of the first silicon die are coplanar and the bottom surface of the polymer substrate is planar.

公开(公告)号：US20220161568A1

公开(公告)日：2022-05-26

申请号：US17312366

申请日：2019-07-31

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Ronald Albert Askeland ,  Blair A. Butler ,  Ronald J. Ender ,  Craig L. Malik ,  Daniel D. Dowell ,  Seth Stephen Haddix ,  Si-lam J. Choy ,  Alexander Govyadinov

IPC: B41J2/175

Abstract: An example printing fluid pen comprises a plurality of fluid ports, a pressure regulator in fluid communication with a first fluid port, and a valve in fluid communication with a second fluid port. The first fluid port is to deliver printing fluid to a fluid ejection device, and the second fluid port to direct printing fluid out of the pen. In response to negative pressure, the valve is to open to enable fluids within the pen to exit via the second port.

公开(公告)号：US20220143883A1

公开(公告)日：2022-05-12

申请号：US17312349

申请日：2019-07-26

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Si-lam J. Choy ,  Michael W. Cumbie

IPC: B29C45/14 ,  B29C45/32 ,  B41J2/16

Abstract: In various examples, a printbar is formed from multiple modular fluid ejection subassemblies joined together through a molding process that provides for a continuous planar substrate surface. A mold may secure the modular fluid ejection subassemblies during a molding process in which a runner conveys a molding material to seams between the joined modular fluid ejection subassemblies.