Light emitting device and method of manufacturing the same
    1.
    发明授权
    Light emitting device and method of manufacturing the same 有权
    发光元件及其制造方法

    公开(公告)号:US08901586B2

    公开(公告)日:2014-12-02

    申请号:US13181007

    申请日:2011-07-12

    IPC分类号: H01L33/00 H01L33/38

    摘要: Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a substrate; a light emitting structure disposed on the substrate and having a stack structure in which a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer are stacked; a lens disposed on the light emitting structure; and a first terminal portion and a second terminal portion electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively. At least one of the first and second terminal portions extends from a top surface of the light emitting structure along respective side surfaces of the light emitting structure and the substrate.

    摘要翻译: 公开了一种发光器件及其制造方法。 发光装置包括:基板; 发光结构,其设置在所述基板上,并具有其中层叠有第一导电类型半导体层,有源层和第二导电类型半导体层的堆叠结构; 设置在所述发光结构上的透镜; 以及分别电连接到第一导电类型半导体层和第二导电类型半导体层的第一端子部分和第二端子部分。 第一和第二端子部分中的至少一个从发光结构的顶表面沿着发光结构和基板的相应侧表面延伸。

    LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    发光装置及其制造方法

    公开(公告)号:US20120007120A1

    公开(公告)日:2012-01-12

    申请号:US13181007

    申请日:2011-07-12

    IPC分类号: H01L33/58 H01L33/50

    摘要: Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a substrate; a light emitting structure disposed on the substrate and having a stack structure in which a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer are stacked; a lens disposed on the light emitting structure; and a first terminal portion and a second terminal portion electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively. At least one of the first and second terminal portions extends from a top surface of the light emitting structure along respective side surfaces of the light emitting structure and the substrate.

    摘要翻译: 公开了一种发光器件及其制造方法。 发光装置包括:基板; 发光结构,其设置在所述基板上,并具有其中层叠有第一导电类型半导体层,有源层和第二导电类型半导体层的堆叠结构; 设置在所述发光结构上的透镜; 以及分别电连接到第一导电类型半导体层和第二导电类型半导体层的第一端子部分和第二端子部分。 第一和第二端子部分中的至少一个从发光结构的顶表面沿着发光结构和基板的相应侧表面延伸。

    LED PACKAGE AND METHOD FOR MANUFACTURING SAME
    4.
    发明申请
    LED PACKAGE AND METHOD FOR MANUFACTURING SAME 审中-公开
    LED封装及其制造方法

    公开(公告)号:US20150295149A1

    公开(公告)日:2015-10-15

    申请号:US14235045

    申请日:2011-07-25

    摘要: There are provided a light emitting diode (LED) package including a heat slug to have excellent heat dissipation efficiency and a manufacturing method thereof, the LED package including: a lead frame receiving power supplied thereto; an LED chip electrically connected to the lead frame; a heat slug provided with a mounting part having the LED chip mounted thereon and outwardly discharging heat generated by the LED chip; and a body part covering at least a portion of an outer circumferential surface of the heat slug, wherein at least a portion of a circumferential region of the body part has higher heat resistance than that of an internal region thereof.

    摘要翻译: 提供一种包括散热片的发热二极管(LED)封装以具有优异的散热效率及其制造方法,该LED封装包括:引导框架,其接收供电的电力; 电连接到引线框架的LED芯片; 具有设置有安装在其上的LED芯片的安装部件并向外排出由LED芯片产生的热量的散热块; 以及覆盖所述散热片的外周面的至少一部分的主体部,其中,所述主体部的周向区域的至少一部分的耐热性比其内部区域的耐热性高。

    LED PACKAGE
    5.
    发明申请
    LED PACKAGE 有权
    LED封装

    公开(公告)号:US20100148201A1

    公开(公告)日:2010-06-17

    申请号:US12630477

    申请日:2009-12-03

    IPC分类号: H01L33/00

    摘要: There is provided an LED package including: a body unit; an LED chip mounted onto the body unit; lead frames mounted onto the body unit and electrically connected to the LED chip; and a reflection unit having a cavity to receive the LED chip therein and reflecting light emitted from the LED chip to the outside. Here, the reflection unit has a curved cross-section.

    摘要翻译: 提供了一种LED封装,包括:主体单元; 安装在身体单元上的LED芯片; 引线框架安装在主体单元上并电连接到LED芯片; 以及反射单元,其具有用于在其中接收LED芯片并将从LED芯片发射的光反射到外部的空腔。 这里,反射单元具有弯曲的横截面。

    BAR-TYPE DISPLAY DEVICE USING DIFFRACTIVE LIGHT MODULATOR
    6.
    发明申请
    BAR-TYPE DISPLAY DEVICE USING DIFFRACTIVE LIGHT MODULATOR 审中-公开
    使用衍射光调制器的BAR型显示器件

    公开(公告)号:US20080218700A1

    公开(公告)日:2008-09-11

    申请号:US12039625

    申请日:2008-02-28

    IPC分类号: G03B21/14

    CPC分类号: G03B21/005 G03B21/208

    摘要: Disclosed herein is a display device using a diffractive light modulator. The display device includes a light source unit, a light condensing unit, an illumination unit, a diffractive light modulator, a light path adjustment unit, and a projection unit. The light path adjustment unit causes the linear light to enter the diffractive light modulator, and emits the diffracted light along a line extending from an incident light path.

    摘要翻译: 这里公开了使用衍射光调制器的显示装置。 显示装置包括光源单元,聚光单元,照明单元,衍射光调制器,光路调节单元和投影单元。 光路调整单元使线状光进入衍射光调制器,并沿着从入射光路延伸的线发射衍射光。

    DISPLAY DEVICE USING SINGLE-PANEL DIFFRACTIVE LIGHT MODULATOR
    8.
    发明申请
    DISPLAY DEVICE USING SINGLE-PANEL DIFFRACTIVE LIGHT MODULATOR 失效
    使用单面板衍射光调制器的显示设备

    公开(公告)号:US20070229935A1

    公开(公告)日:2007-10-04

    申请号:US11693632

    申请日:2007-03-29

    IPC分类号: G02B26/00

    CPC分类号: G02B27/0025 G02B26/0808

    摘要: Disclosed herein is a display device using a single-panel diffractive light modulator. The display device includes a light source unit, a condensing unit, an illumination unit, a diffractive light modulator, a projection unit, a filter unit, and a distortion correcting means.

    摘要翻译: 这里公开了使用单面衍射光调制器的显示装置。 显示装置包括光源单元,聚光单元,照明单元,衍射光调制器,投影单元,滤波器单元和失真校正装置。