公开(公告)号：US20120241797A1

公开(公告)日：2012-09-27

申请号：US13428726

申请日：2012-03-23

申请人： Hak Hwan KIM ,  Min Jung Kim ,  Kyung Mi Moon ,  Jong Sup Song ,  Jae Sung You ,  Ill Heoung Choi ,  Cheol Jun Yoo

发明人： Hak Hwan KIM ,  Min Jung Kim ,  Kyung Mi Moon ,  Jong Sup Song ,  Jae Sung You ,  Ill Heoung Choi ,  Cheol Jun Yoo

IPC分类号： H01L33/50

CPC分类号： H01L33/62 ,  H01L21/568 ,  H01L33/505 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2224/83

摘要： A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.

摘要翻译： 提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片 的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。

公开(公告)号：US20120211780A1

公开(公告)日：2012-08-23

申请号：US13404924

申请日：2012-02-24

申请人： Suk Ho Jung ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

发明人： Suk Ho Jung ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

IPC分类号： H01L33/50

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/504 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2924/00014

摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.

摘要翻译： 根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。

公开(公告)号：US20080035951A1

公开(公告)日：2008-02-14

申请号：US11822185

申请日：2007-07-03

申请人： Hee Seok Park ,  Gil Han Park ,  Sang Duk Yoo ,  Young Min Park ,  Hak Hwan Kim ,  Seon Young Myoung ,  Sang Bum Lee ,  Ki Tae Park ,  Myoung Sik Jung ,  Kyeong Ik Min

发明人： Hee Seok Park ,  Gil Han Park ,  Sang Duk Yoo ,  Young Min Park ,  Hak Hwan Kim ,  Seon Young Myoung ,  Sang Bum Lee ,  Ki Tae Park ,  Myoung Sik Jung ,  Kyeong Ik Min

IPC分类号： H01L29/24 ,  H01L21/36 ,  H01L33/00

CPC分类号： C30B25/04 ,  C30B25/02 ,  C30B29/406 ,  H01L21/0237 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/02639 ,  H01L21/02647 ,  H01L33/007 ,  H01L33/24

摘要： A method for selectively growing a nitride semiconductor, in which a mask is formed, with an opening formed therein, on a nitride semiconductor layer. A nitride semiconductor crystal is selectively grown on a portion of the nitride semiconductor layer exposed through the opening in the mask, the nitride semiconductor crystal shaped as a hexagonal pyramid and having crystal planes inclined with respect to a top surface of the nitride semiconductor. Here, the nitride semiconductor crystal has at least one intermediate stress-relieving area having crystal planes inclined at a greater angle than those of upper and lower areas of the nitride semiconductor crystal, the intermediate stress-relieving area relieving stress which occurs from continuity in the inclined crystal planes.

摘要翻译： 一种在氮化物半导体层上选择性地生长其中形成掩模的氮化物半导体，其中形成有开口的方法。 氮化物半导体晶体选择性地生长在通过掩模中的开口暴露的氮化物半导体层的一部分上，氮化物半导体晶体形状为六角锥，并具有相对于氮化物半导体的顶表面倾斜的晶面。 这里，氮化物半导体晶体具有至少一个具有比氮化物半导体晶体的上部和下部区域倾斜角度大的晶面的中间应力消除区域，由中间应力消除区域的连续性产生的中间应力消除面积减轻应力 斜晶面。

公开(公告)号：US08960984B2

公开(公告)日：2015-02-24

申请号：US13594014

申请日：2012-08-24

申请人： Kyung Mi Moon ,  Hak Hwan Kim

发明人： Kyung Mi Moon ,  Hak Hwan Kim

IPC分类号： F21V8/00 ,  G02F1/1335 ,  H01L33/58

CPC分类号： G02B6/0021 ,  G02F1/133615 ,  H01L33/58

摘要： A backlight unit (BLU) is disclosed. The BLU may include a light emitting diode (LED) module including at least one LED chip mounted on a substrate in a chip-on-board (COB) type, and a light guide panel including an incidence surface configured to receive light emitted from an emission surface of the LED chip and to include at least one insertion recess disposed corresponding to the LED chip, such that the LED chip is bonded to the LED module to be inserted in the insertion recess.

摘要翻译： 公开了一种背光单元（BLU）。 BLU可以包括发光二极管（LED）模块，其包括安装在基板上（COB）类型的基板上的至少一个LED芯片，以及导光板，其包括入射表面，该入射表面被配置为接收从 并且包括与LED芯片相对设置的至少一个插入凹槽，使得LED芯片被结合到LED模块以插入插入凹部中。

公开(公告)号：US08901586B2

公开(公告)日：2014-12-02

申请号：US13181007

申请日：2011-07-12

申请人： Hak Hwan Kim ,  Ho Sun Paek ,  Hyung Kun Kim ,  Sung Kyong Oh ,  Jong In Yang

发明人： Hak Hwan Kim ,  Ho Sun Paek ,  Hyung Kun Kim ,  Sung Kyong Oh ,  Jong In Yang

IPC分类号： H01L33/00 ,  H01L33/38

CPC分类号： H01L33/58 ,  H01L33/0095 ,  H01L33/382 ,  H01L33/385

摘要： Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a substrate; a light emitting structure disposed on the substrate and having a stack structure in which a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer are stacked; a lens disposed on the light emitting structure; and a first terminal portion and a second terminal portion electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively. At least one of the first and second terminal portions extends from a top surface of the light emitting structure along respective side surfaces of the light emitting structure and the substrate.

摘要翻译： 公开了一种发光器件及其制造方法。 发光装置包括：基板; 发光结构，其设置在所述基板上，并具有其中层叠有第一导电类型半导体层，有源层和第二导电类型半导体层的堆叠结构; 设置在所述发光结构上的透镜; 以及分别电连接到第一导电类型半导体层和第二导电类型半导体层的第一端子部分和第二端子部分。 第一和第二端子部分中的至少一个从发光结构的顶表面沿着发光结构和基板的相应侧表面延伸。

公开(公告)号：US08278671B2

公开(公告)日：2012-10-02

申请号：US13404924

申请日：2012-02-24

申请人： Suk Ho Jung ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

发明人： Suk Ho Jung ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/504 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2924/00014

摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.

摘要翻译： 根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。

公开(公告)号：US20120007120A1

公开(公告)日：2012-01-12

申请号：US13181007

申请日：2011-07-12

申请人： Hak Hwan KIM ,  Ho Sun Paek ,  Hyung Kun Kim ,  Sung Kyong Oh ,  Jong In Yang

发明人： Hak Hwan KIM ,  Ho Sun Paek ,  Hyung Kun Kim ,  Sung Kyong Oh ,  Jong In Yang

IPC分类号： H01L33/58 ,  H01L33/50

CPC分类号： H01L33/58 ,  H01L33/0095 ,  H01L33/382 ,  H01L33/385

摘要： Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a substrate; a light emitting structure disposed on the substrate and having a stack structure in which a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer are stacked; a lens disposed on the light emitting structure; and a first terminal portion and a second terminal portion electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively. At least one of the first and second terminal portions extends from a top surface of the light emitting structure along respective side surfaces of the light emitting structure and the substrate.

摘要翻译： 公开了一种发光器件及其制造方法。 发光装置包括：基板; 发光结构，其设置在所述基板上，并具有其中层叠有第一导电类型半导体层，有源层和第二导电类型半导体层的堆叠结构; 设置在所述发光结构上的透镜; 以及分别电连接到第一导电类型半导体层和第二导电类型半导体层的第一端子部分和第二端子部分。 第一和第二端子部分中的至少一个从发光结构的顶表面沿着发光结构和基板的相应侧表面延伸。

公开(公告)号：US20100171143A1

公开(公告)日：2010-07-08

申请号：US12571751

申请日：2009-10-01

申请人： Ho Sun PAEK ,  Hak Hwan Kim ,  Young Jin Lee ,  Hyung Kun Kim ,  Suk Ho Jung

发明人： Ho Sun PAEK ,  Hak Hwan Kim ,  Young Jin Lee ,  Hyung Kun Kim ,  Suk Ho Jung

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

摘要： There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes.

摘要翻译： 提供了具有高散热效率的LED封装。 根据本发明的一个方面的LED封装可以包括：封装主体，包括凹入到封装体中的第一凹槽部分，并且作为安装区域设置在封装主体的顶部; 第一引线框架和第二引线框架布置在第一槽部分的下表面上，同时第一和第二引线框架的一部分被暴露; LED芯片安装在第一槽部分的下表面上并电连接到第一和第二引线框架; 以及设置在包装体的底部并由碳纳米管形成的多个散热图案。

公开(公告)号：US20100090231A1

公开(公告)日：2010-04-15

申请号：US12571754

申请日：2009-10-01

申请人： Suk Ho JUNG ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

发明人： Suk Ho JUNG ,  Hyung Kun Kim ,  Hak Hwan Kim ,  Young Jin Lee ,  Ho Sun Paek

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/504 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2924/00014

摘要： An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion. Accordingly, a reduction in luminous efficiency of an LED caused by yellowing is prevented to thereby increase luminous efficiency and achieve a reduction in size.

摘要翻译： 根据本发明的一个方面的LED封装模块可以包括：其上具有预定电极的基板; 安装在基板上的多个LED芯片，以预定间隔彼此分开，并与电极电连接; 围绕所述多个LED芯片中的至少一个模制的第一颜色树脂部分; 围绕除了第一着色树脂部分成型的LED芯片之外的所有LED芯片的第二颜色树脂部分模制，并且具有与第一着色树脂部分不同的颜色; 以及第三颜色树脂部分，其包围第一着色树脂部分和第二颜色树脂部分，并且具有与第一着色树脂部分和第二着色树脂部分不同的颜色。 因此，防止由黄化引起的LED的发光效率的降低，从而提高发光效率并实现尺寸的减小。

公开(公告)号：US06269251B1

公开(公告)日：2001-07-31

申请号：US09528392

申请日：2000-03-20

申请人： Hak-Hwan Kim

发明人： Hak-Hwan Kim

IPC分类号： H04B700

CPC分类号： H03G3/3042 ,  H03F1/30 ,  H03F1/3247

摘要： Disclosed is a method of controlling electric power according to a temperature compensation for a wireless communication terminal including a memory for storing each of code values of a maximum and minimum power according to a temperature variation and each of weight values for sending power, comprising the steps of; (a) calculating a compensation value at an associated sending power according to a reference temperature; (b) calculating a basic code value at an associated sending power according to a reference temperature; and (c) obtaining a compensated code value by adding the compensation value to the basic code value.

摘要翻译： 公开了一种根据用于无线通信终端的温度补偿来控制电力的方法，所述无线通信终端包括存储器，用于存储根据温度变化和发送功率的每个权重值的每个最大和最小功率的代码值，所述方法包括步骤 的; （a）根据参考温度计算相关发送功率的补偿值; （b）根据参考温度计算相关发送功率的基本码值; 和（c）通过将补偿值加到基本代码值来获得补偿代码值。