公开(公告)号：US20230328936A1

公开(公告)日：2023-10-12

申请号：US18336209

申请日：2023-06-16

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Faming SUN ,  Jun CHEN ,  Quanming LI ,  Xiaowei HUI

IPC: H05K7/20 ,  H01L23/367 ,  H02S40/42 ,  H02S40/32 ,  H02M1/32

CPC classification number: H05K7/209 ,  H01L23/367 ,  H02M1/327 ,  H02S40/32 ,  H05K7/20936 ,  H02S40/42

Abstract: A power converter, heat exchangers, heat sinks, and a photovoltaic power generation system, related to the field of heat dissipation. The power converter includes: a power semiconductor device, a magnetic element, a sealed cavity, and a heat dissipation cavity. The power semiconductor device and the magnetic element are disposed in the sealed cavity. The power semiconductor device dissipates heat through a first heat sink, and cooling fins of the first heat sink are located in the heat dissipation cavity. The magnetic element dissipates heat through a second heat sink, and cooling fins of the second heat sink are located in the heat dissipation cavity, Accordingly, reliability and heat dissipation effect of heat dissipation performed by the power converter are improved.

公开(公告)号：US20220338369A1

公开(公告)日：2022-10-20

申请号：US17854210

申请日：2022-06-30

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Longhe WEI ,  Jun CHEN ,  Zhisheng LIAN ,  Quanming LI

IPC: H05K7/20

Abstract: The technology of this application relates to a heat dissipation apparatus applicable to a circuit board, where a plurality of heating elements are disposed on the circuit board. The heat dissipation apparatus includes a substrate, at least one heat conductor is disposed on one surface that is of the substrate and that faces the circuit board, one end of the heat conductor is connected to the substrate, and the other end extends toward the circuit board and is close to the heating elements. At least one heat conductor is disposed on the one surface that is of the substrate and that faces the circuit board, one end of the heat conductor is connected to the substrate, and the other end of the heat conductor extends toward the circuit board and is close to the heating elements.

公开(公告)号：US20230096967A1

公开(公告)日：2023-03-30

申请号：US18061075

申请日：2022-12-02

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Faming SUN ,  Quanming LI ,  Jun CHEN

IPC: H02S40/42

Abstract: A heat dissipation apparatus and a photovoltaic inverter are related to the field of heat dissipation device technologies, to improve a heat dissipation capability of the heat dissipation apparatus. The heat dissipation apparatus includes at least two stacked fan layers, and each fan layer includes at least one fan. A heat dissipation channel in a radiator has a first inlet, and the first inlet communicates with each air exhaust vent in at least one fan layer by using an air duct component. Compared with a solution in which fans are arranged along a width direction of the radiator, the at least two fan layers are stacked, which may not be limited by a width of the radiator. More fans can be arranged in a hierarchical stacking manner, and more fans can increase an overall amount of exhausted air, thereby improving the heat dissipation capability of the heat dissipation apparatus.

公开(公告)号：US20230014262A1

公开(公告)日：2023-01-19

申请号：US17947688

申请日：2022-09-19

Applicant: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.

Inventor： Hao WU ,  Quanming LI ,  Jun CHEN ,  Li HE

IPC: H02J50/00 ,  H02J50/10 ,  H05K7/20

Abstract: Embodiments of this application provide a wireless charger, and relate to the field of charging device technologies. The wireless charger includes a wireless charging module, a first fan, a housing including a contact plate used for contact with the rear surface of the terminal device, and an air intake vent disposed at a position that is of the housing and that is close to the first fan, and an airflow guide structure disposed on a side that is of the housing and that is adjacent to the contact plate. The airflow guide structure extends toward the display surface of the terminal device.

公开(公告)号：US20250058601A1

公开(公告)日：2025-02-20

申请号：US18804294

申请日：2024-08-14

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Linfeng LU ,  Quanming LI ,  Ming Fung WONG

IPC: B60H1/00

Abstract: A thermal management integrated module includes a water-side component, a refrigerant component, and a heat exchanger. The water-side component and the refrigerant component are respectively located on two opposite sides of the heat exchanger. The water-side component includes a water path substrate. A plumbing of the water path substrate is configured to accommodate a first medium. The refrigerant component includes a refrigerant substrate. A plumbing of the refrigerant substrate is configured to accommodate a second medium. The heat exchanger is located in a gap space formed by the water path substrate and the refrigerant substrate. Both the plumbing of the water path substrate and the plumbing of the refrigerant substrate communicate with a plumbing of the heat exchanger. The water-side component has a first external connection port. The first external connection port is configured to connect to a water tank in the thermal management system through a coolant hose.

公开(公告)号：US20220359932A1

公开(公告)日：2022-11-10

申请号：US17729168

申请日：2022-04-26

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Hao MENG ,  Quanming LI

IPC: H01M10/6567 ,  H01M10/613 ,  H01M10/63 ,  H01M10/627

Abstract: A temperature control apparatus and a temperature control system include at least one liquid storage device for storing liquid, at least two liquid supply devices, and a controller. Each liquid supply device is connected to the at least one liquid storage device through a first multiport valve to obtain liquid and is connected to a temperature regulating device through a second multiport valve. The controller is configured to control the first multiport valve and the second multiport valve that are connected to the controller to be conducted or not to be conducted. When the first multiport valve and the second multiport valve are conducted, each liquid supply device outputs the obtained liquid to the temperature regulating device. The temperature regulating device regulates a temperature of the liquid injected by each liquid storage device, and then supplies the liquid to at least one battery system.

公开(公告)号：US20220256732A1

公开(公告)日：2022-08-11

申请号：US17579770

申请日：2022-01-20

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Hao WU ,  Quanming LI ,  Jun CHEN ,  Xiaowei HUI

IPC: H05K7/20 ,  H02J7/00 ,  H02J50/10 ,  H02J50/00 ,  H05K5/02 ,  F28F3/12

Abstract: The wireless charger includes a housing, a circuit board component, and a heat conduction structure. The housing has a first air inlet and a first air outlet, and a heat dissipation air channel that communicates with the first air inlet and the first air outlet and that is located inside the housing. is formed between the first air inlet and the first air outlet. The circuit board component is located in the heat dissipation air channel. The heat conduction structure includes a contact part and a connection part that are connected to each other, at least a part of the contact part is exposed to an outer surface of the housing, the contact part is configured to be in contact with a to-be-charged device, and the connection part is located inside the housing and is in contact with the heat dissipation air channel.

公开(公告)号：US20230014936A1

公开(公告)日：2023-01-19

申请号：US17953487

申请日：2022-09-27

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Jiangang WANG ,  Shaobo YANG ,  Jun CHEN ,  Quanming LI

IPC: B60H1/32

Abstract: A temperature control system includes: a first cooling circuit, where a first cooling medium is circulated in the first cooling circuit, and the first cooling circuit is configured to cool a first structural unit; a second cooling circuit, where a second cooling medium is circulated in the second cooling circuit, and the second cooling circuit is configured to cool a second structural unit; and a heat exchanger, separately connected to the first cooling circuit and the second cooling circuit, and configured to perform heat exchange between the first cooling medium and the second cooling medium, where the first cooling circuit includes a bypass branch, and the bypass branch is connected in parallel to the heat exchanger. According to the temperature control system, heat dissipation efficiency for an inverter and an overall heat dissipation capability for a powertrain are improved.