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1.发明授权Method for forming electrical connections to a solid state device including electrical packaging arrangement therefor 失效用于形成与固态器件的电连接的方法，包括其电气封装装置
公开(公告)号：US3325882A
公开(公告)日：1967-06-20
申请号：US46618265
申请日：1965-06-23
Applicant: IBM
Inventor： CHARLES CHIOU , GARCIA JOSEPH R
CPC classification number: H01L24/82 , H01L24/24 , H01L2224/24227 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01058 , H01L2924/01067 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , Y10S148/05 , Y10S148/085 , Y10T29/49155 , Y10T29/4981 , H01L2924/00
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2.发明授权
公开(公告)号：US3428866A
公开(公告)日：1969-02-18
申请号：US3428866D
申请日：1966-12-12
Applicant: IBM
Inventor： CHIOU CHARLES , GARCIA JOSEPH R
CPC classification number: H01L24/80 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01042 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01R4/02 , H01L2924/00
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公开(公告)号：US3254274A
公开(公告)日：1966-05-31
申请号：US14087861
申请日：1961-09-26
Applicant: IBM
Inventor： GARCIA JOSEPH R , HARLOW LESLIE A
IPC: H01L23/13 , H01L23/488 , H01L25/07
CPC classification number: H01L24/49 , H01L23/13 , H01L23/488 , H01L24/48 , H01L25/072 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/09701 , H01L2924/12033 , H01L2924/12036 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
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