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公开(公告)号：US10540474B2
公开(公告)日：2020-01-21
申请号：US15922910
申请日：2018-03-15
Applicant: Industrial Technology Research Institute
Inventor： Heng-Chieh Chien , Sheng-Tsai Wu , Ming-Ji Dai , Chih-Ming Shen
IPC: G06F17/50
Abstract: A chip temperature computation method and a chip temperature computation device are provided. The chip temperature computation method includes: computing an upper layer thermal resistance and a lower layer thermal resistance of a chip, computing a total thermal resistance of the chip, and computing a temperature of the chip according to the total thermal resistance.
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公开(公告)号：US20180128468A1
公开(公告)日：2018-05-10
申请号：US15479733
申请日：2017-04-05
Applicant: Industrial Technology Research Institute
Inventor： Heng-Chieh Chien , Yu-Lin Chao , Wen-Fu Hsu , Chih-Ming Shen , Chia-Wei Jui , Yao-Shun Chen
CPC classification number: F21V21/35 , F21V19/0045 , F21V21/14 , F21V23/06 , F21Y2115/15 , H01R25/142 , Y02B20/36
Abstract: A rail-type organic light emitting diode lamp assembly is provided. The lamp assembly includes a lamp module, an annular member, a connector, a conductive member, and a rail module. The annular member includes a protrusion portion having a pair of indentations. The connector is connected to the annular member, and includes a through hole, a first end provided with a pair of ears and a second end provided with a pair of hooks. The conductive member is provided in the through hole and has a first end in contact with the annular conductive coil. The rail module is connected with the connector and includes a conductor in contact with a second end of the conductive member. The connector can be slidably hooked to the rail module through the hooks, and after the ears are inserted into the indentations, the annular member can be rotatable with respect to the connector.
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公开(公告)号：US20170294421A1
公开(公告)日：2017-10-12
申请号：US15632392
申请日：2017-06-26
Applicant: Industrial Technology Research Institute
Inventor： Yu-Wei Huang , Tao-Chih Chang , Chih-Ming Shen
IPC: H01L25/075 , H01L21/683 , H01L33/00 , H01L33/48 , H01L21/48 , H01L21/68 , H01L33/62
CPC classification number: H01L25/0753 , H01L21/4853 , H01L21/68 , H01L21/6835 , H01L24/00 , H01L33/0079 , H01L33/483 , H01L33/62 , H01L2221/68363 , H01L2933/0066
Abstract: A fabricating method of a semiconductor light emitting device includes disposing a plurality of non-conductive walls on a substrate. An alignment position is formed between every two adjacent non-conductive walls. A plurality of semiconductor light emitting units on a first carrier board are respectively aligned to the alignment positions. The semiconductor light emitting units are divided into a plurality of groups. The semiconductor light emitting units in one of the groups are dissociated from the first carrier board. Thus, the semiconductor light emitting units in the group fall into the corresponding alignment positions due to gravity. Each of the semiconductor light emitting units is electrically connected with the substrate through a first electrode. A conductive layer is formed on the semiconductor light emitting units. Accordingly, the semiconductor light emitting units are electrically connected together to the conductive layer through second electrodes.
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公开(公告)号：US09721931B2
公开(公告)日：2017-08-01
申请号：US14949893
申请日：2015-11-24
Applicant: Industrial Technology Research Institute
Inventor： Yu-Wei Huang , Tao-Chih Chang , Chih-Ming Shen
IPC: H01L25/07 , H01L25/075 , H01L23/00 , H01L33/62
CPC classification number: H01L25/0753 , H01L21/4853 , H01L21/68 , H01L21/6835 , H01L24/00 , H01L33/0079 , H01L33/483 , H01L33/62 , H01L2221/68363 , H01L2933/0066
Abstract: A semiconductor light emitting device including a substrate, a plurality of semiconductor light emitting units and a plurality of non-conductive walls is provided. The semiconductor light emitting device is disposed on the substrate in an array. Each of the semiconductor light emitting units has a first electrode and a second electrode opposite to the first electrode. Each of the semiconductor light emitting units is electrically connected to the substrate through the first electrode, and the semiconductor light emitting units are electrically connected together to a conducting layer through the second electrodes. The semiconductor light emitting units have different emission colors. The non-conductive walls are disposed between adjacent semiconductor light emitting units, to separate the semiconductor light emitting units. A fabricating method of semiconductor light emitting device is also provided.
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公开(公告)号：US11132786B2
公开(公告)日：2021-09-28
申请号：US16134986
申请日：2018-09-19
Applicant: Industrial Technology Research Institute
Inventor： Ming-Kaan Liang , An-Chun Luo , Yu-Shan Deng , Chih-Ming Shen , Ming-Ji Dai
Abstract: A board defect filtering method is provided. The method includes: receiving a defect list; obtaining a plurality of defect images of a plurality of defect records on the defect list; receiving a circuit layout image; analyzing a defect location of a first defect image of the plurality of defect images according to the circuit layout image; cropping the first defect image to obtain a first cropped defect image according to the defect location; inputting the first cropping defect image to a defect classifying model; and determining whether the first defect image is a qualified product image or not according to an output result of the defect classifying model.
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Patent Agency Ranking
公开(公告)号：US10288696B2
公开(公告)日：2019-05-14
申请号：US15352989
申请日：2016-11-16
Applicant: Industrial Technology Research Institute
Inventor： Chih-Chung Chiu , Chih-Ming Tzeng , Li-Ling Liao , Yu-Lin Chao , Chih-Ming Shen , Ming-Kaan Liang , Chun-Kai Liu , Ming-Ji Dai
Abstract: An intelligent diagnosis system for a power module. The system includes a power module, a hardware checking module and a diagnostic module. The power module has a temperature sensing element for obtaining a temperature difference between a starting minimum temperature and a current temperature. The hardware checking module has a current sensing element, a voltage sensing element and a magnetic coupling closed loop detection element for obtaining the current, the output voltage and the input voltage of the power module, and the hardware loop status, respectively. The diagnostic module calculates the number of cycles that have been operated, a measured impedance and an instantaneous power based on those measurement results, and calculating a risk index based on the number of cycles that have been operated, the temperature difference, the measured impedance, the instantaneous power and the hardware loop status, thereby determining the accumulation of the abnormality index record.
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公开(公告)号：US20160211415A1
公开(公告)日：2016-07-21
申请号：US14949893
申请日：2015-11-24
Applicant: Industrial Technology Research Institute
Inventor： Yu-Wei Huang , Tao-Chih Chang , Chih-Ming Shen
CPC classification number: H01L25/0753 , H01L21/4853 , H01L21/68 , H01L21/6835 , H01L24/00 , H01L33/0079 , H01L33/483 , H01L33/62 , H01L2221/68363 , H01L2933/0066
Abstract: A semiconductor light emitting device including a substrate, a plurality of semiconductor light emitting units and a plurality of non-conductive walls is provided. The semiconductor light emitting device is disposed on the substrate in an array. Each of the semiconductor light emitting units has a first electrode and a second electrode opposite to the first electrode. Each of the semiconductor light emitting units is electrically connected to the substrate through the first electrode, and the semiconductor light emitting units are electrically connected together to a conducting layer through the second electrodes. The semiconductor light emitting units have different emission colors. The non-conductive walls are disposed between adjacent semiconductor light emitting units, to separate the semiconductor light emitting units. A fabricating method of semiconductor light emitting device is also provided.
Abstract translation: 提供了包括基板，多个半导体发光单元和多个非导电壁的半导体发光器件。 半导体发光器件以阵列方式设置在衬底上。 每个半导体发光单元具有第一电极和与第一电极相对的第二电极。 每个半导体发光单元通过第一电极电连接到基板，并且半导体发光单元通过第二电极电连接到导电层。 半导体发光单元具有不同的发射颜色。 非导电壁设置在相邻的半导体发光单元之间，以分离半导体发光单元。 还提供了半导体发光器件的制造方法。
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公开(公告)号：US20160163940A1
公开(公告)日：2016-06-09
申请号：US14952919
申请日：2015-11-26
Applicant: Industrial Technology Research Institute
Inventor： Yu-Wei Huang , Tao-Chih Chang , Chih-Ming Shen
CPC classification number: H01L33/62 , H01L21/568 , H01L25/0753 , H01L25/0756 , H01L33/58 , H01L2224/04105 , H01L2224/12105 , H01L2224/16225 , H01L2224/18 , H01L2224/19 , H01L2224/24137 , H01L2224/32225 , H01L2224/73204 , H01L2224/73267 , H01L2224/92244 , H01L2924/18162 , H01L2924/00
Abstract: A package structure for a light emitting device is provided, wherein an anisotropic conductive film (ACF) and flip-chip bonding technique can be applied for bonding the light emitting device to a carrier. In addition, plural package units are stacked by performing a build-up process or a lamination process to form a full color micro-display. The package structure for the light emitting device provides simple and quick manufacturing process and is suitable for mass production. Furthermore, solutions for optical issues such as light guiding or light mixing are also provided.
Abstract translation: 提供了一种用于发光器件的封装结构，其中可以应用各向异性导电膜（ACF）和倒装芯片接合技术来将发光器件接合到载体上。 此外，通过执行积聚处理或层压处理来堆叠多个封装单元以形成全色微显示器。 用于发光器件的封装结构提供简单且快速的制造工艺，并且适用于批量生产。 此外，还提供了诸如光导或光混合的光学问题的解决方案。
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公开(公告)号：US20220201870A1
公开(公告)日：2022-06-23
申请号：US17126033
申请日：2020-12-18
Applicant: Industrial Technology Research Institute
Inventor： Chien-Min Hsu , Chih-Ming Shen , Shih-Hsien Wu
Abstract: A fabrication method of a flexible electronic package device including the following steps is provided. A tolerable bending radius of the flexible electronic package device is obtained. A minimum surface curvature radius of a selected portion of an applied carrier is obtained. A relationship of the tolerable bending radius being smaller than the minimum surface curvature radius is ensured. The flexible electronic package device is disposed on the selected portion.
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公开(公告)号：US11363724B1
公开(公告)日：2022-06-14
申请号：US17126033
申请日：2020-12-18
Applicant: Industrial Technology Research Institute
Inventor： Chien-Min Hsu , Chih-Ming Shen , Shih-Hsien Wu
IPC: H05K3/30 , H05K1/18 , H01L23/498 , H01L23/00
Abstract: A fabrication method of a flexible electronic package device including the following steps is provided. A tolerable bending radius of the flexible electronic package device is obtained. A minimum surface curvature radius of a selected portion of an applied carrier is obtained. A relationship of the tolerable bending radius being smaller than the minimum surface curvature radius is ensured. The flexible electronic package device is disposed on the selected portion.
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