公开(公告)号：US20160192039A1

公开(公告)日：2016-06-30

申请号：US14365653

申请日：2013-12-28

Applicant: INTEL cORPORATION

Inventor： Indira NEGI ,  Lakshman KRISHNAMURTHY ,  Fuad AL-AMIN ,  Xiaochao YANG ,  Brian K. VOGEL ,  Jun LI ,  Alexander ESSAIAN ,  Sai Hemachandra VEMPRALA ,  Donnie H. Kim ,  Lama NACHMAN ,  Haibin LIU

IPC: H04Q9/00 ,  H04W68/00 ,  H04R1/10 ,  A61B5/00 ,  A61B5/024 ,  A61B5/01 ,  A61B5/053 ,  H04M1/725 ,  G10L19/00

CPC classification number: H04Q9/00 ,  A61B5/0022 ,  A61B5/01 ,  A61B5/024 ,  A61B5/0533 ,  G10L19/00 ,  H04M1/6058 ,  H04M1/6066 ,  H04M1/7253 ,  H04M1/72569 ,  H04M2250/12 ,  H04Q2209/40 ,  H04R1/1091 ,  H04R2201/107 ,  H04R2499/11 ,  H04W68/00 ,  H04W88/02

Abstract: A system and method for device action and configuration based on user context detection from sensors in peripheral devices are disclosed. A particular embodiment includes: a peripheral device including one or more sensors to produce sensor data; and logic, at least a portion of which is partially implemented in hardware, the logic configured to determine a context from the sensor data and to perform at least one action based on the determined context, the at least one action including modifying a configuration in a mobile device for sending notifications to a user.

Abstract translation: 公开了一种基于外围设备中的传感器的用户上下文检测的用于设备动作和配置的系统和方法。 具体实施例包括：包括一个或多个传感器以产生传感器数据的外围设备; 以及逻辑，其至少一部分部分地以硬件方式实现，所述逻辑被配置为根据所述传感器数据确定上下文并且基于所确定的上下文来执行至少一个动作，所述至少一个动作包括修改 用于向用户发送通知的移动设备。

公开(公告)号：US20180286840A1

公开(公告)日：2018-10-04

申请号：US15765992

申请日：2015-11-04

Applicant: Intel Corporation

Inventor： Vijay K. NAIR ,  Adel A. ELSHERBINI ,  Lakshman KRISHNAMURTHY ,  Johanna M. SWAN ,  Alexander ESSAIAN ,  Torrey W. FRANK

IPC: H01L25/16 ,  H01L23/498 ,  H01L25/00 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L25/162 ,  H01L21/568 ,  H01L23/48 ,  H01L23/49816 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/73 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24155 ,  H01L2224/24195 ,  H01L2224/73209 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/18162 ,  H01L2924/19105

Abstract: Embodiments are generally directed to three-dimensional small form factor system in package architecture. An embodiment of an apparatus includes a first package having a first side and an opposite second side, the first package including a plurality of embedded electronic components and one or more embedded via bars, each via bar including a plurality of through vias; and a second package having a first side and an opposite second side, the second package including a plurality of embedded electronic components, wherein a first side of the first package and a second side of second package are coupled together by a plurality of connections, including at least a first connection connecting the second package to a first component of the first package and a second connection connecting the second package to a first via bar of the one or more via bars.