New Magnet Design Which Improves Erosion Profile for PVD Systems
    1.
    发明申请
    New Magnet Design Which Improves Erosion Profile for PVD Systems 审中-公开
    提高PVD系统侵蚀性能的新型磁铁设计

    公开(公告)号:US20140124359A1

    公开(公告)日:2014-05-08

    申请号:US13667856

    申请日:2012-11-02

    Abstract: Methods and apparatuses for performing combinatorial processing are disclosed. Methods include introducing a substrate into a processing chamber. The processing chamber includes a sputter assembly disposed over the substrate. The sputter assembly includes a rotatable n-fold, symmetric-shaped magnetron and a sputter target. The methods include depositing a first film on the surface of a first site-isolated region of the substrate. The methods further include depositing a second film on the surface of a second site-isolated region of the substrate. Furthermore, methods include evaluating results of the first and second films.

    Abstract translation: 公开了用于执行组合处理的方法和装置。 方法包括将衬底引入处理室。 处理室包括设置在基板上方的溅射组件。 溅射组件包括可旋转的n倍对称形磁控管和溅射靶。 所述方法包括在衬底的第一位置隔离区域的表面上沉积第一膜。 该方法还包括在衬底的第二位置隔离区域的表面上沉积第二膜。 此外,方法包括评估第一和第二膜的结果。

    Sputter Gun
    2.
    发明申请
    Sputter Gun 审中-公开
    溅射枪

    公开(公告)号:US20140174918A1

    公开(公告)日:2014-06-26

    申请号:US13721419

    申请日:2012-12-20

    Abstract: A sputter gun is provided. The sputter gun includes a target and a first plate coupled to a surface of the target. A first magnet is disposed over a second magnet. A second plate coupled to a surface of the first magnet and a gap is defined between a surface of the second magnet and a surface of the first plate. A fluid inlet and a fluid outlet are disposed above a surface of the first magnet. A restriction bar is coupled to the second plate, wherein the restriction bar is configured to prevent a flow path of fluid through the first inlet to the second inlet unless the fluid traverses the gap defined between a surface of the second magnet and a surface of the first plate. Alternative configurations of the sputter gun are included.

    Abstract translation: 提供溅射枪。 溅射枪包括目标和耦合到靶的表面的第一板。 第一磁体设置在第二磁体上。 耦合到第一磁体的表面的第二板和间隙限定在第二磁体的表面和第一板的表面之间。 流体入口和流体出口设置在第一磁体的表面上方。 限制杆联接到第二板,其中限制杆被配置为防止流体通过第二入口的第一入口的流动路径,除非流体穿过限定在第二磁体的表面与第二磁体的表面之间的间隙 第一盘。 包括溅射枪的替代配置。

    Substrate Carrier
    3.
    发明申请
    Substrate Carrier 审中-公开
    基板载体

    公开(公告)号:US20140166840A1

    公开(公告)日:2014-06-19

    申请号:US13716044

    申请日:2012-12-14

    CPC classification number: H01L21/68728 H01L21/68757

    Abstract: A substrate carrier is provided. The substrate carrier includes a base for supporting a substrate. A plurality of support tabs is affixed to a surface of the base. The plurality of support tabs have a cavity defined within an inner region of each support tab of the plurality of support tabs. A plurality of protrusions extends from the surface of the base, wherein one of the plurality of protrusions mates with one cavity to support one of the plurality of support tabs. A film is deposited over the surface of the base, surfaces of the plurality of support tabs and surfaces of the plurality of protrusions.

    Abstract translation: 提供衬底载体。 衬底载体包括用于支撑衬底的基底。 多个支撑片固定到基座的表面上。 多个支撑突片具有限定在多个支撑突片中的每个支撑突片的内部区域内的空腔。 多个突起从基座的表面延伸,其中多个突起中的一个与一个空腔配合,以支撑多个支撑突片中的一个。 薄膜沉积在基底的表面上,多个支撑突片的表面和多个突起的表面。

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