公开(公告)号：US20150043169A1

公开(公告)日：2015-02-12

申请号：US13964263

申请日：2013-08-12

Applicant: Infineon Technologies AG

Inventor： Frank WINTER ,  Ottmar GEITNER ,  Ivan NIKITIN ,  Juergen HOEGERL

IPC: H05K1/18

CPC classification number: H01L23/4334 ,  H01L21/4871 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/838 ,  H01L2224/83801 ,  H01L2224/8384 ,  H05K1/185 ,  H05K3/4608 ,  Y10T29/49002

Abstract: According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mould compound and comprises surface structures.

Abstract translation: 根据示例性方面，提供一种电子模块，其中所述电子模块包括电子芯片，该电子芯片包括至少一个电子元件，间隔元件，包括布置在所述电子芯片上并与所述至少一个电子元件导热连接的主表面 以及至少部分地包围电子芯片和间隔元件的模具化合物，其中间隔元件包括与模具化合物接触并包括表面结构的侧表面。

公开(公告)号：US20150264796A1

公开(公告)日：2015-09-17

申请号：US14214962

申请日：2014-03-16

Applicant: Infineon Technologies AG

Inventor： Christian NEUGIRG ,  Andreas GRASSMANN ,  Wolfram HABLE ,  Ottmar GEITNER ,  Frank WINTER ,  Alexander SCHWARZ ,  Inpil YOO

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/18

CPC classification number: H01L23/3733 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/373 ,  H01L23/49833 ,  H01L24/36 ,  H01L24/40 ,  H01L2224/40137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/181 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first carrier; a spacing element comprising a surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component; a second carrier arranged on the spacing element; and a mold compound enclosing the electronic chip and the spacing element at least partially; wherein the spacing element comprises a material having a CTE value being matched with at least one other CTE.

Abstract translation: 提供一种电子模块，其包括第一载体; 电子芯片，其包括至少一个电子部件并且布置在所述第一载体上; 间隔元件，包括布置在所述电子芯片上并与所述至少一个电子部件导热连接的表面; 布置在间隔元件上的第二载体; 以及至少部分地包围所述电子芯片和所述间隔元件的模具化合物; 其中所述间隔元件包括具有与至少一个其它CTE匹配的CTE值的材料。

公开(公告)号：US20170092563A1

公开(公告)日：2017-03-30

申请号：US15375855

申请日：2016-12-12

Applicant: Infineon Technologies AG

Inventor： Frank WINTER ,  Ottmar GEITNER ,  Ivan NIKITIN ,  Jürgen HÖGERL

IPC: H01L23/433 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/4334 ,  H01L21/4871 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/838 ,  H01L2224/83801 ,  H01L2224/8384 ,  H05K1/185 ,  H05K3/4608 ,  Y10T29/49002

Abstract: According to an exemplary aspect an electronic module is provided, wherein the electronic module comprises an electronic chip comprising at least one electronic component, a spacing element comprising a main surface arranged on the electronic chip and being in thermally conductive connection with the at least one electronic component, and a mold compound at least partially enclosing the electronic chip and the spacing element, wherein the spacing element comprises a lateral surface which is in contact to the mould compound and comprises surface structures.

公开(公告)号：US20140353818A1

公开(公告)日：2014-12-04

申请号：US13909133

申请日：2013-06-04

Applicant: Infineon Technologies AG

Inventor： Ottmar GEITNER ,  Wolfram HABLE ,  Andreas Grassmann ,  Frank Winter ,  Christian Neugirg ,  Ivan Nikitin

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L24/89 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/26135 ,  H01L2224/29005 ,  H01L2224/291 ,  H01L2224/29124 ,  H01L2224/29147 ,  H01L2224/30181 ,  H01L2224/83048 ,  H01L2224/83139 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/97 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A method of manufacturing a power module comprising two substrates is provided, wherein the method comprises disposing a compensation layer of a first thickness above a first substrate; disposing a second substrate above the compensation layer; and reducing the thickness of the compensation layer from the first thickness to a second thickness after the second substrate is disposed on the compensation layer

Abstract translation: 提供一种制造包括两个基板的功率模块的方法，其中所述方法包括在第一基板之上设置第一厚度的补偿层; 在补偿层之上设置第二衬底; 以及在所述第二衬底设置在所述补偿层上之后，将所述补偿层的厚度从所述第一厚度减小到第二厚度