公开(公告)号：US10157848B2

公开(公告)日：2018-12-18

申请号：US14882524

申请日：2015-10-14

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Jens Pohl ,  Thomas Spoettl ,  Peter Stampka

IPC: H01L23/495 ,  H01L23/538 ,  H01L21/56 ,  H01L23/31 ,  H01L23/66 ,  G06K19/07 ,  G06K19/077

Abstract: A chip card module arrangement may include a first surface and a second surface, which are opposite from one another, and a chip receptacle for one or more semiconductor chips on the surfaces. The chip card module arrangement may further include a connecting material receiving area on one of the two surfaces, the connecting material receiving area only taking up a portion of the surface.

公开(公告)号：US10114992B2

公开(公告)日：2018-10-30

申请号：US15644863

申请日：2017-07-10

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Jens Pohl ,  Thomas Spoettl ,  Peter Stampka

IPC: G06K5/00 ,  G06K7/10

Abstract: An electronic identification document is provided. The electronic identification document may include a carrier, an identification element, a microwave interaction structure configured to interact with microwave radiation, and an alteration element, wherein the alteration element may be part of or in contact with the microwave interaction structure and may be configured to alter, upon interaction of the interaction structure with microwaves, its state from an initial state to a permanent altered state, wherein the permanent altered state may differ from the initial state by a change of the alteration element in color, brightness, saturation, and/or transparency.

公开(公告)号：US20180101758A1

公开(公告)日：2018-04-12

申请号：US15726417

申请日：2017-10-06

Applicant: Infineon Technologies AG

Inventor： Thomas Spoettl ,  Frank Pueschner ,  Peter Stampka ,  Mathias Belzner ,  Ralph Domnick ,  Daniel Weiss

IPC: G06K19/07 ,  H01L23/498 ,  G06K19/077

CPC classification number: G06K19/0723 ,  G06K19/02 ,  G06K19/07718 ,  G06K19/10 ,  H01L23/49855

Abstract: In various embodiments, a smart card module is provided. The smart card module may include an electronic circuit in or on a carrier, a smart card module contact layer, which is coupled to the electronic circuit and provides a plurality of smart card module contacts, a mirror layer on the smart card module contact layer, said mirror layer at least partly covering the smart card module contacts, and an optically translucent, electrically conductive oxide layer, which covers the mirror layer. The optically translucent, electrically conductive oxide layer includes a plurality of regions of different layer thicknesses for providing different color components.

公开(公告)号：US20180025192A1

公开(公告)日：2018-01-25

申请号：US15644863

申请日：2017-07-10

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Jens Pohl ,  Thomas Spoettl ,  Peter Stampka

IPC: G06K7/10

CPC classification number: G06K7/10366

Abstract: An electronic identification document is provided. The electronic identification document may include a carrier, an identification element, a microwave interaction structure configured to interact with microwave radiation, and an alteration element, wherein the alteration element may be part of or in contact with the microwave interaction structure and may be configured to alter, upon interaction of the interaction structure with microwaves, its state from an initial state to a permanent altered state, wherein the permanent altered state may differ from the initial state by a change of the alteration element in color, brightness, saturation, and/or transparency.

公开(公告)号：US09141902B2

公开(公告)日：2015-09-22

申请号：US13631929

申请日：2012-09-29

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Kristof Bothe ,  Juergen Hoegerl ,  Andreas Karl ,  Andreas Mueller-Hipper ,  Peter Scherl ,  Peter Stampka ,  Uwe Wagner

IPC: G06K19/02 ,  G06K19/077

CPC classification number: G06K19/07747

Abstract: A smart card module for a smart card, comprising a chip having electrical contacts at a front side; a first laminate layer, wherein a rear side of the chip is connected to the first laminate layer, the rear side of the chip opposite the front side; a second laminate layer; a first conductive layer, wherein the electrical contacts of the chip are connected to the first conductive layer and the first conductive layer is arranged between the chip and the second laminate layer; and an adhesive material arranged between the chip and the conductive layer and/or the second laminate layer.

Abstract translation: 一种用于智能卡的智能卡模块，包括：在前侧具有电触点的芯片; 第一层叠层，其中所述芯片的后侧连接到所述第一层压层，所述芯片的与所述前侧相对的后侧; 第二层压层; 第一导电层，其中所述芯片的电触点连接到所述第一导电层，并且所述第一导电层布置在所述芯片和所述第二层压层之间; 以及布置在所述芯片和所述导电层和/或所述第二层压层之间的粘合剂材料。

公开(公告)号：US20140353387A1

公开(公告)日：2014-12-04

申请号：US14292270

申请日：2014-05-30

Applicant: Infineon Technologies AG

Inventor： Juergen Hoegerl ,  Andreas Mueller-Hipper ,  Frank Pueschner ,  Wolfgang Schindler ,  Peter Stampka

IPC: G06K19/077 ,  H01L23/00

CPC classification number: G06K19/07743 ,  G06K19/07728 ,  G06K19/07745 ,  H01L23/16 ,  H01L23/293 ,  H01L24/16 ,  H01L24/83 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/014

Abstract: A smart card module for use in a smart card includes a microchip and a contact zone for making contact with the microchip by means of a reader. The microchip can be enclosed by an encapsulation which can enclose the microchip completely from all sides.

Abstract translation: 用于智能卡的智能卡模块包括微芯片和用于通过读取器与微芯片接触的接触区域。 微芯片可以通过封装，其可以从所有侧面完全包围微芯片。

公开(公告)号：US20140239428A1

公开(公告)日：2014-08-28

申请号：US13779828

申请日：2013-02-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Frank Pueschner ,  Juergen Hoegerl ,  Peter Stampka

IPC: H01L31/02 ,  H01L31/18

CPC classification number: H01L31/02 ,  G06K19/07728 ,  G06K19/07775 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L31/18 ,  H01L2223/6677 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13193 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/3512 ,  H01Q1/2283 ,  H01Q7/00

Abstract: According to various embodiments, a chip arrangement may be provided, the chip arrangement including: a chip; an antenna structure disposed over a first side of the chip, wherein the antenna structure may include an antenna being electrically conductively coupled to the chip; and a reinforcement structure, wherein the reinforcement structure supports the chip to increase the stability of the chip arrangement.

Abstract translation: 根据各种实施例，可以提供芯片布置，芯片布置包括：芯片; 布置在所述芯片的第一侧上的天线结构，其中所述天线结构可以包括导电耦合到所述芯片的天线; 以及加强结构，其中所述加强结构支撑所述芯片以增加所述芯片布置的稳定性。

公开(公告)号：US11681888B2

公开(公告)日：2023-06-20

申请号：US17075730

申请日：2020-10-21

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Walther Pachler ,  Josef Gruber ,  Jens Pohl ,  Stephan Rampetzreiter ,  Thomas Spoettl ,  Peter Stampka

IPC: G06K19/07 ,  G06K19/077 ,  G06V40/13

CPC classification number: G06K19/0718 ,  G06K19/07701 ,  G06K19/07756 ,  G06K19/07775 ,  G06V40/1306

Abstract: A sensor device is provided that includes a fingerprint sensor and an antenna coupled with the fingerprint sensor for inductive coupling of the fingerprint sensor with a booster antenna.

公开(公告)号：US20210117743A1

公开(公告)日：2021-04-22

申请号：US17075730

申请日：2020-10-21

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Walther Pachler ,  Josef Gruber ,  Jens Pohl ,  Stephan Rampetzreiter ,  Thomas Spoettl ,  Peter Stampka

IPC: G06K19/07 ,  G06K19/077 ,  G06K9/00

Abstract: A sensor device is provided that includes a fingerprint sensor and an antenna coupled with the fingerprint sensor for inductive coupling of the fingerprint sensor with a booster antenna.

公开(公告)号：US10585034B2

公开(公告)日：2020-03-10

申请号：US16043824

申请日：2018-07-24

Applicant: Infineon Technologies AG

Inventor： Thomas Spoettl ,  Mathias Belzner ,  Ralph Domnick ,  Jens Pohl ,  Frank Pueschner ,  Peter Stampka ,  Daniel Weiss

IPC: G01N21/25 ,  G02B5/08 ,  G06K19/06 ,  G06K19/07 ,  B42D25/324 ,  B42D25/305 ,  B42D25/36 ,  B42D25/351 ,  B42D25/373

Abstract: In various exemplary embodiments, a smart card module is provided. The smart card module includes a carrier and a layer stack at least partly covering the carrier. The layer stack includes a reflection layer, a light-transmissive layer arranged above the reflection layer, and a partly light-transmissive silver layer arranged above the light-transmissive layer. The partly light-transmissive silver layer is configured for reflecting part of light impinging on the partly light-transmissive silver layer.