LIGHT EMITTING UNIT AND DISPLAY DEVICE

    公开(公告)号:US20250022986A1

    公开(公告)日:2025-01-16

    申请号:US18903541

    申请日:2024-10-01

    Abstract: An electronic device includes: a semiconductor layer; a first layer disposed on the semiconductor layer, including at least one of oxygen atoms and nitrogen atoms and having a first maximum thickness; a second layer, wherein the first layer is disposed between the second layer and the semiconductor layer, and the second layer has a second maximum thickness; and a third layer, wherein the second layer is disposed between the first layer and the third layer, the third layer has a third maximum thickness, and the second maximum thickness and the third maximum thickness are greater than the first maximum thickness, wherein the first layer comprises a first position and a second position, the first position is closer to the semiconductor layer than the second position, and a first oxygen atomic percentage at the first position is less than a second oxygen atomic percentage at the second position.

    ELECTRONIC DEVICE
    2.
    发明申请

    公开(公告)号:US20250014383A1

    公开(公告)日:2025-01-09

    申请号:US18895325

    申请日:2024-09-24

    Abstract: An electronic device includes a first substrate, a second substrate overlapped with the first substrate and having a first side and a second side opposite to the first side, a sensor unit disposed between the first substrate and the second substrate, a first blocking layer disposed on the first side, and a second blocking layer disposed on the sensor unit. The second side is disposed between the sensor unit and the first side. The first blocking layer has a first opening, and the second blocking layer has a second opening. A width of the first opening is smaller than a width of the second opening.

    ELECTRONIC DEVICE
    3.
    发明申请

    公开(公告)号:US20240404919A1

    公开(公告)日:2024-12-05

    申请号:US18800801

    申请日:2024-08-12

    Abstract: An electronic device includes: a substrate including a through hole; a connecting element disposed in the through hole; a first insulating layer disposed on the substrate and including a first via; a first conductive element disposed on the first insulating layer and electrically connected to the connecting element through the first via; a second conductive element and a third conductive element disposed on the first conductive element and separated from each other by a space; a second insulating layer disposed in the space; a fourth conductive element disposed under the substrate and electrically connected to the connecting element; and a semiconductor disposed between the substrate and the first insulating layer, wherein, in a cross-sectional view of the electronic device, at least one of the second conductive element and the third conductive element is not overlapping with the connecting element.

    ELECTRONIC DEVICE
    4.
    发明申请

    公开(公告)号:US20240397750A1

    公开(公告)日:2024-11-28

    申请号:US18613060

    申请日:2024-03-21

    Abstract: This disclosure provides an electronic device including a substrate, a main electronic unit, an auxiliary electronic unit, a main working circuit and an auxiliary working circuit. The substrate has a first portion and a second portion bent with respect to the first portion, and the first portion includes a normal active region and a functional active region. The main electronic unit is disposed on the normal active region. The auxiliary electronic unit is disposed on the functional active region. The main working circuit is disposed on the first portion, and the main working circuit outputs a first driving signal to the main electronic unit according to a first data signal. The auxiliary working circuit is disposed on the second portion, and the auxiliary working circuit outputs a second driving signal to the auxiliary electronic unit according to a second data signal.

    ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

    公开(公告)号:US20240387387A1

    公开(公告)日:2024-11-21

    申请号:US18633534

    申请日:2024-04-12

    Abstract: An electronic device and a manufacturing thereof are disclosed. The electronic device includes a first conductive layer, a first insulating layer, a second insulating layer, a second conductive layer, a plurality of semiconductor elements and a covering layer. The first insulating layer is disposed on the first conductive layer. In a cross-sectional view of the electronic device, the first insulating layer has two side-surfaces which are opposite to each other. The second insulating layer is disposed on the first insulating layer and in contact with the two side-surfaces of the first insulating layer. The second conductive layer is disposed on the second insulating layer and electrically connected to the first conductive layer. The plurality of semiconductor elements are disposed on the second conductive layer and electrically connected to the second conductive layer. The covering layer is disposed on the plurality of semiconductor elements.

    OPERATING METHOD FOR VEHICLE
    7.
    发明公开

    公开(公告)号:US20240270185A1

    公开(公告)日:2024-08-15

    申请号:US18409325

    申请日:2024-01-10

    CPC classification number: B60R16/0231 B60K35/28 B60K35/60 B60K2360/166

    Abstract: An operating method for a vehicle is provided to operate the vehicle via at least one command output source. The operating method includes steps of: providing a request signal to the vehicle for transmitting a data signal to at least one component of the vehicle; providing an approval signal to the vehicle; transmitting the data signal from the at least one command output source to the at least one component of the vehicle according to the approval signal; and operating the at least one component of the vehicle according to the data signal.

    ELECTRONIC DEVICE AND SPEAKER DEVICE
    8.
    发明公开

    公开(公告)号:US20240251206A1

    公开(公告)日:2024-07-25

    申请号:US18404466

    申请日:2024-01-04

    CPC classification number: H04R9/046 H04R9/025 H04R9/06

    Abstract: An electronic device includes a substrate; and a coil structure disposed on the substrate. The coil structure is provided with a first conductor layer including a connection line; a second conductor layer including a plurality of line segments separated from each other; and a first insulation layer disposed between the first conductor layer and the second conductor layer, and provided with a plurality of first openings, wherein adjacent two of the plurality of line segments are electrically connected to the connection line through the plurality of first openings.

    ELECTRONIC DEVICE
    10.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240145255A1

    公开(公告)日:2024-05-02

    申请号:US18368029

    申请日:2023-09-14

    Abstract: An electronic includes an electronic element, an encapsulation layer surrounding the electronic element, a first circuit structure, a second circuit structure and a connecting structure. The encapsulation layer has a top surface, a bottom surface and an opening, wherein a sidewall of the opening connects the top surface and the bottom surface. The first circuit structure is disposed at the top surface of the encapsulation layer. The second circuit structure is disposed at the bottom surface of the encapsulation layer. The connecting structure is disposed in the opening, wherein the electronic element is electrically connected to the second circuit structure through the first circuit structure and the connecting structure. The connecting structure includes a first sub layer and a second sub layer, the first sub layer is located between the encapsulation layer and the second sub layer, and the first sub layer covers the sidewall of the opening.

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