公开(公告)号：US11217573B2

公开(公告)日：2022-01-04

申请号：US16809515

申请日：2020-03-04

Applicant: Intel Corporation

Inventor： Suresh V. Pothukuchi ,  Andrew Alduino ,  Ravindranath V. Mahajan ,  Srikant Nekkanty ,  Ling Liao ,  Harinadh Potluri ,  David M. Bond ,  Sushrutha Reddy Gujjula ,  Donald Tiendung Tran ,  David Hui ,  Vladimir Tamarkin

IPC: H01L25/16 ,  H01L23/367 ,  H01L23/40 ,  H01L23/473 ,  H01L23/538 ,  H04Q11/00

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

公开(公告)号：US12222552B2

公开(公告)日：2025-02-11

申请号：US17133347

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Duanni Huang ,  Saeed Fathololoumi ,  Meer Nazmus Sakib ,  Mohammad Montazeri Najafabadi ,  Chaoxuan Ma ,  David Hui ,  Taehwan Kim ,  Ling Liao ,  Hao Li ,  Ganesh Balamurugan ,  Haisheng Rong ,  Aliasghar Eftekhar

IPC: H04B10/66 ,  G02B6/26 ,  G02B6/27 ,  H04J14/06

Abstract: The present disclosure is directed to photonic wavelength division multiplexing (WDM) receivers with polarization diversity and/or low reflectance. In embodiments, a WDM receiver is provided with a splitter, a plurality of waveguides and a plurality of photodetectors in series. The waveguides having particular equal path lengths relationship from the splitter to respective ones of the photodetectors. In other embodiments, the WDM receiver is provided with a splitter, a looped waveguide, a plurality of photodetectors, and a plurality of variable optical attenuators (VOAs). The VOAs are configured to suppress reflection of signal beams back to the transmitter. In various embodiments, the WDM receiver is a receiver sub-assembly of a silicon photonic transceiver disposed in a silicon package. Other embodiments may be described and/or claimed.

公开(公告)号：US20240061194A1

公开(公告)日：2024-02-22

申请号：US17821019

申请日：2022-08-19

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  David Hui ,  Haris Khan Niazi ,  Wenhao Li ,  Bhaskar Jyoti Krishnatreya ,  Henning Braunisch ,  Shawna M. Liff ,  Jiraporn Seangatith ,  Johanna M. Swan ,  Krishna Vasanth Valavala ,  Xavier Francois Brun ,  Feras Eid

IPC: G02B6/42

CPC classification number: G02B6/4274 ,  G02B6/4204

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include an interconnect die in a first layer surrounded by a dielectric material; a processor integrated circuit (processor IC) and an integrated circuit (IC) in a second layer, the second layer on the first layer, wherein the interconnect die is electrically coupled to the processor IC and the IC by first interconnects having a pitch of less than 10 microns between adjacent first interconnects; a photonic integrated circuit (PIC) and a substrate in a third layer, the third layer on the second layer, wherein the PIC has an active surface, and wherein the active surface of the PIC is coupled to the IC by second interconnects having a pitch of less than 10 microns between adjacent second interconnects; and a fiber connector optically coupled to the active surface of the PIC.

公开(公告)号：US11830863B2

公开(公告)日：2023-11-28

申请号：US17539088

申请日：2021-11-30

Applicant: Intel Corporation

Inventor： Suresh V. Pothukuchi ,  Andrew Alduino ,  Ravindranath V. Mahajan ,  Srikant Nekkanty ,  Ling Liao ,  Harinadh Potluri ,  David M. Bond ,  Sushrutha Reddy Gujjula ,  Donald Tiendung Tran ,  David Hui ,  Vladimir Tamarkin

IPC: H01L25/16 ,  H01L23/367 ,  H01L23/40 ,  H01L23/473 ,  H01L23/538 ,  H04Q11/00

CPC classification number: H01L25/167 ,  H01L23/367 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/473 ,  H01L23/5385 ,  H01L23/5386 ,  H04Q11/0005 ,  H01L2023/4031 ,  H04Q2011/0039

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

公开(公告)号：US20210320722A1

公开(公告)日：2021-10-14

申请号：US17304556

申请日：2021-06-23

Applicant: Intel Corporation

Inventor： Zuoguo Wu ,  Ling Liao ,  David Hui

IPC: H04B10/50 ,  H04B10/61 ,  H04B10/40

Abstract: In one embodiment, an apparatus includes a processor, a laser, and a modulator. The processor is to generate a first electrical signal including first data and a second electrical signal including second data. The laser is to generate a multiplexed carrier signal comprising a first carrier signal and a second carrier signal, the laser to operate at a first laser power setting. The modulator is to generate a multiplexed optical signal including a first optical signal based in part on the first electrical signal and the first carrier signal and a second optical signal based in part on the second electrical signal and the second carrier signal. The apparatus is to transmit the multiplexed optical signal to a device and to retransmit the first data from the apparatus to the device based on a detection of error in a received version of the first data at the device. Other embodiments are described and claimed.

公开(公告)号：US20200371385A1

公开(公告)日：2020-11-26

申请号：US16991993

申请日：2020-08-12

Applicant: Intel Corporation

Inventor： Siamak Amiralizadeh Asl ,  David Hui ,  Sanjeev Gupta

IPC: G02F1/035

Abstract: Embodiments of the present disclosure are directed to a photonic integrated circuit (PIC) that includes a micro-ring modulator (MRM) that is coupled with termination circuitry to reduce the reflection coefficient of the MRM when the PIC is electrically coupled to a driver. In embodiments, the termination circuitry may include one or more passive elements. Other embodiments may be described and/or claimed.