公开(公告)号：US20250024622A1

公开(公告)日：2025-01-16

申请号：US18897941

申请日：2024-09-26

Applicant: Intel Corporation

Inventor： Richard Canham ,  Eric W. Buddrius ,  Jeffory L. Smalley ,  Garrett Frans Pauwels ,  Emery Evon Frey ,  Steven Adam Klein ,  Daniel Neumann

IPC: H05K7/10 ,  H01R12/57 ,  H01R13/11 ,  H01R13/405

Abstract: Protrusions of socket bodies having metal are disclosed. An example apparatus comprises a socket body, the socket body including a plastic material, an array of contacts distributed across a surface of the socket body, and a protrusion extending away from the surface of the socket body, the protrusion to facilitate alignment of an IC package with the array of contacts, the protrusion including metal.

公开(公告)号：US20240355758A1

公开(公告)日：2024-10-24

申请号：US18756926

申请日：2024-06-27

Applicant: Intel Corporation

Inventor： Steven Adam Klein ,  Jason Gamba ,  Matthew Thomas Guzy ,  Nicholas Steven Haehn ,  Tarek Adly Ibrahim ,  Brandon Christian Marin ,  Srinivas Venkata Ramanuja Pietambaram ,  Jacob John Schichtel

IPC: H01L23/544 ,  H01L23/15 ,  H01L23/40

CPC classification number: H01L23/544 ,  H01L23/15 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L2223/54426

Abstract: Systems, apparatus, articles of manufacture, and methods to reduce stress between sockets and associated integrated circuit packages having glass cores are disclosed. An example integrated circuit package includes: a semiconductor die, and a substrate including a glass core. The substrate includes a first surface, a second surface opposite the first surface, and a third surface between the first surface and the second surfaces. The first surface supports the semiconductor die. The second surface includes first contacts to electrical couple with second contacts in a socket. At least a portion of the third surface separated and distinct from the glass core.

公开(公告)号：US20250014967A1

公开(公告)日：2025-01-09

申请号：US18893576

申请日：2024-09-23

Applicant: Intel Corporation

Inventor： Kyle Jordan Arrington ,  Prabhakar Subrahmanyam ,  Steven Adam Klein ,  Kelly Porter Lofgreen ,  Joseph Blane Petrini

IPC: H01L23/473 ,  H01L23/40 ,  H01L23/42 ,  H01R12/85 ,  H01R13/52

Abstract: Systems, apparatus, articles of manufacture, and methods to improve thermal dissipation and mechanical loading of integrated circuit packages are disclosed. An example apparatus includes: a socket to receive an integrated circuit package; and a plate to apply a load on the integrated circuit package towards the socket. The plate includes an internal channel to carry a coolant through the plate. The liquid coolant is to facilitate cooling of the integrated circuit package.

公开(公告)号：US20240357744A1

公开(公告)日：2024-10-24

申请号：US18756949

申请日：2024-06-27

Applicant: Intel Corporation

Inventor： Rick Canham ,  Jeffory L. Smalley ,  Steven Adam Klein ,  Shelby Ann Ferguson

IPC: H05K1/11 ,  H05K1/02 ,  H05K5/00

CPC classification number: H05K1/117 ,  H05K1/0203 ,  H05K1/111 ,  H05K5/0034 ,  H05K2201/10189

Abstract: Integrated circuit packages including carriers with incorporated substrates and interfaces are disclosed herein. An integrated circuit package carrier disclosed herein includes a frame including an opening to receive an integrated circuit package and at least one of (1) a circuitry component on a substrate on a surface of the frame or (2) a cable interface directly coupled to the frame.