公开(公告)号：US12081952B2

公开(公告)日：2024-09-03

申请号：US17111130

申请日：2020-12-03

Applicant: Intel Corporation

Inventor： Shantanu D. Kulkarni ,  Jeff Ku ,  Sumod Cherukkate ,  Tongyan Zhai ,  Srikanth Potluri ,  Jordan E. Maslov

IPC: H04R3/04 ,  G10K11/175 ,  H04R1/22 ,  H05K7/20

CPC classification number: H04R3/04 ,  G10K11/175 ,  G10K11/1752 ,  H04R1/222 ,  H05K7/20

Abstract: Systems, apparatus, articles of manufacture, methods are disclosed to reshape fan noise of a fan of an electronic device. An example system includes a microphone to detect a first acoustic signal including fan noise. The example system also includes a processor to: identify a tone in the first acoustic signal; and determine a gain to add to the first acoustic signal to mask the tone. In addition, the example system includes a sound transducer to present a second acoustic signal including the gain.

公开(公告)号：US20230216453A1

公开(公告)日：2023-07-06

申请号：US18121315

申请日：2023-03-14

Applicant: Intel Corporation

Inventor： Yagnesh V. Waghela ,  Sumod Cherukkate ,  Sagar Gupta ,  Sudhakar Arehole Narayana Manja ,  Soumya Prakash Mishra ,  Bala Subramanya ,  Jayprakash Thakur

IPC: H03F3/189 ,  H04R9/06

CPC classification number: H03F3/189 ,  H04R9/06 ,  H03F2200/451 ,  H03F2200/03

Abstract: The speaker coil in a dynamic speaker in a mobile computing device can be used to generate radio frequency (RF) signals having a frequency of about 100 kHz or greater. A speaker amplifier drives the dynamic speaker to produce sound and RF circuitry drives the speaker amplifier to generate the RF signals having a frequency of about 100 kHz or greater. The speaker coil can comprise a tap at an appropriate point between the ends of the coil to cause the coil to operate at resonance over a desired RF frequency band. A low-pass filter can be positioned at the speaker amplifier output to protect the speaker amplifier from RF energy generated by the RF circuitry and a high-pass filter can be positioned at the output of the RF circuitry to protect the RF circuitry from audio energy generated by the speaker amplifier.

公开(公告)号：US20220326096A1

公开(公告)日：2022-10-13

申请号：US17850561

申请日：2022-06-27

Applicant: Intel Corporation

Inventor： Smit Kapila ,  Abhishek Srivastav ,  Sumod Cherukkate ,  Manit Biswas ,  Zhongsheng Wang ,  Bijendra Singh ,  Deepak Ganapathy ,  Dipen Dudhat

IPC: G01K11/22 ,  H05K7/20

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to monitor thermal degradation of a compute device. One such method includes calculating, by executing instructions with processor circuitry, a thermal degradation value based on an equation, the equation generated based on testing of thermal interface materials having varying degrees of degradation. The method also includes comparing, by executing instructions with the processor circuitry, the thermal degradation value to a thermal degradation threshold to determine whether the thermal degradation threshold is satisfied, and, when the thermal degradation threshold is satisfied, triggering generation of a thermal degradation alert.

公开(公告)号：US11119532B2

公开(公告)日：2021-09-14

申请号：US16457046

申请日：2019-06-28

Applicant: Intel Corporation

Inventor： Sumod Cherukkate ,  Gopinath K ,  Prakash Kurma Raju ,  Ajesh K K

IPC: H05K1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/04 ,  H04R1/00 ,  H04R1/02 ,  H04R1/08 ,  H04R1/10 ,  H04R1/20 ,  H04R1/32 ,  H04R3/00 ,  H04R11/04 ,  H04R19/00 ,  H04M1/00 ,  H04M1/03 ,  G06F1/18 ,  B81B3/00 ,  B81C1/00 ,  G06F1/16 ,  H05K1/11 ,  H05K1/18

Abstract: Methods and apparatus to implement microphones in thin form factor electronic devices are disclosed. An electronic device includes a chassis having an exterior surface and an interior surface. The chassis includes a plurality of holes extending through the chassis. The plurality of holes are within a 1 mm diameter circular area of the chassis. The electronic device further includes a microphone coupled to the interior surface of the chassis adjacent the circular area of the chassis.

公开(公告)号：US20250097634A1

公开(公告)日：2025-03-20

申请号：US18467408

申请日：2023-09-14

Applicant: Intel Corporation

Inventor： Avinash Manu Aravindan ,  Sumod Cherukkate ,  Prakash Kurma Raju ,  Ezekiel Poulose

IPC: H04R1/28 ,  H04R1/02 ,  H04R7/04 ,  H04R7/18 ,  H04R31/00

Abstract: Methods and apparatus to improve bass response of speakers in portable devices are disclosed. An example speaker includes a speaker box having a front face and a back face, a distance between the front face and the back face being less than 1 inch. The speaker box has a first portion of a back volume and a second portion of the back volume, the first portion of the back volume defined between the back face and a first region of the front face, the second portion of the back volume defined between the back face a second region of the front face. The example speaker further includes an active speaker driver including a first diaphragm, the first diaphragm coupled to the first region of the front face. The example speaker also includes a second diaphragm coupled to the second region of the front face, the second diaphragm being passive.

公开(公告)号：US11044548B2

公开(公告)日：2021-06-22

申请号：US16727854

申请日：2019-12-26

Applicant: Intel Corporation

Inventor： Samarth Alva ,  Sumod Cherukkate ,  Sachin Bedare

IPC: H04R1/28 ,  H04R1/02 ,  G06F1/16 ,  H04R29/00 ,  H03G5/16

Abstract: In one embodiment, a portable computing device is described. The portable computing device includes a first surface comprising at least one user interface. The portable computing device also includes a second surface opposite the first surface. Further, the portable computing device includes at least one speaker port in the first surface. Further yet, the portable computing device includes a collapsible speaker chamber configured on the second surface opposite the at least one speaker port. Moreover, the portable computing device includes a speaker configured in the portable computing device between the speaker port and the collapsible speaker chamber.

公开(公告)号：US20210092517A1

公开(公告)日：2021-03-25

申请号：US17111130

申请日：2020-12-03

Applicant: Intel Corporation

Inventor： Shantanu D. Kulkarni ,  Jeff Ku ,  Sumod Cherukkate ,  Tongyan Zhai ,  Srikanth Potluri ,  Jordan E. Maslov

IPC: H04R3/04 ,  H04R1/22 ,  G10K11/175 ,  H05K7/20

Abstract: Systems, apparatus, articles of manufacture, methods are disclosed to reshape fan noise of a fan of an electronic device. An example system includes a microphone to detect a first acoustic signal including fan noise. The example system also includes a processor to: identify a tone in the first acoustic signal; and determine a gain to add to the first acoustic signal to mask the tone. In addition, the example system includes a sound transducer to present a second acoustic signal including the gain.

公开(公告)号：US20190324496A1

公开(公告)日：2019-10-24

申请号：US16457046

申请日：2019-06-28

Applicant: Intel Corporation

Inventor： Sumod Cherukkate ,  Gopinath K ,  Prakash Kurma Raju ,  Ajesh K K

IPC: G06F1/16 ,  H04R1/08 ,  H05K1/18 ,  H05K1/11 ,  H05K7/04

Abstract: Methods and apparatus to implement microphones in thin form factor electronic devices are disclosed. An electronic device includes a chassis having an exterior surface and an interior surface. The chassis includes a plurality of holes extending through the chassis. The plurality of holes are within a 1 mm diameter circular area of the chassis. The electronic device further includes a microphone coupled to the interior surface of the chassis adjacent the circular area of the chassis.

公开(公告)号：US20250132109A1

公开(公告)日：2025-04-24

申请号：US18978809

申请日：2024-12-12

Applicant: Intel Corporation

Inventor： Shruthi Sudhakar ,  Sumod Cherukkate ,  Praveen Kashyap Ananta Bhat ,  Prakash Kurma Raju ,  Prasanna Pichumani ,  A Ezekiel Poulose

IPC: H01H13/7065 ,  H04R1/02

Abstract: Apparatus including speakers ported through keys of a keyboard are disclosed. An example electronic device includes a housing, and a keyboard carried by the housing. The keyboard includes a key having a keycap that covers an associated switch. The example electronic device further includes a speaker within the housing underneath the keyboard. The keycap includes an opening to define a port through which sound from the speaker is able to pass.

公开(公告)号：US20240312736A1

公开(公告)日：2024-09-19

申请号：US18185460

申请日：2023-03-17

Applicant: Intel Corporation

Inventor： Abhishek Srivastav ,  Smit Kapila ,  Prakash Kurma Raju ,  Sumod Cherukkate ,  Vijith Halestoph R ,  Srikanth Potluri

IPC: H01H13/14 ,  G06F3/02 ,  H01H13/70 ,  H04R1/02 ,  H04R7/04

CPC classification number: H01H13/14 ,  G06F3/0202 ,  H01H13/70 ,  H04R1/028 ,  H04R7/04 ,  H01H2239/048 ,  H04R2499/15

Abstract: Keyboards for electronic devices with keys having integrated speakers are disclosed herein. An example keyboard includes a key having a key cap and a speaker coupled to the key cap. The speaker is disposed in or at least partially covered by the key cap.