公开(公告)号：US20220413236A1

公开(公告)日：2022-12-29

申请号：US17358502

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Omkar KARHADE ,  Sushrutha Reddy GUJJULA ,  Tolga ACIKALIN ,  Ravindranath V. MAHAJAN ,  James E. JAUSSI ,  Chia-Pin CHIU

IPC: G02B6/42 ,  H01L25/16 ,  H01L23/00 ,  H01L23/367 ,  H01S3/04

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to thermally and/or electrically coupling a thermal die to the surface of a photonic integrated circuit (PIC) within an open cavity in a substrate, where the thermal die is proximate to a laser on the PIC. Other embodiments may be described and/or claimed.

公开(公告)号：US20230318247A1

公开(公告)日：2023-10-05

申请号：US17710881

申请日：2022-03-31

Applicant: INTEL cORPORATION

Inventor： Eleanor Patricia Paras RABADAM ,  Guiyun BAI ,  Sanjeev GUPTA ,  Ronald SPREITZER ,  Jonathan DOYLEND ,  Ankur AGRAWAL ,  Boping XIE ,  Sushrutha Reddy GUJJULA ,  Jason GARCIA ,  Kenneth BROWN ,  Dan WANG ,  Daniel GRODENSKY ,  Israel PETRONIUS ,  Konstantin MATYUCH

IPC: H01S3/04

CPC classification number: H01S3/0405

Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to a package that includes multiple PICs in the package that are optically coupled with each other. In embodiments, the package may include discrete electronic and optical components, and thermal management solutions for co-packaging of multiple PICs. Other embodiments may be described and/or claimed.

公开(公告)号：US20220085001A1

公开(公告)日：2022-03-17

申请号：US17539088

申请日：2021-11-30

Applicant: Intel Corporation

Inventor： Suresh V. POTHUKUCHI ,  Andrew ALDUINO ,  Ravindranath V. MAHAJAN ,  Srikant NEKKANTY ,  Ling LIAO ,  Harinadh POTLURI ,  David M. BOND ,  Sushrutha Reddy GUJJULA ,  Donald Tiendung TRAN ,  David HUI ,  Vladimir TAMARKIN

IPC: H01L25/16 ,  H01L23/367 ,  H01L23/40 ,  H01L23/473 ,  H01L23/538 ,  H04Q11/00

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

公开(公告)号：US20210280566A1

公开(公告)日：2021-09-09

申请号：US16809515

申请日：2020-03-04

Applicant: Intel Corporation

Inventor： Suresh V. POTHUKUCHI ,  Andrew ALDUINO ,  Ravindranath V. MAHAJAN ,  Srikant NEKKANTY ,  Ling LIAO ,  Harinadh POTLURI ,  David M. BOND ,  Sushrutha Reddy GUJJULA ,  Donald Tiendung TRAN ,  David HUI ,  Vladimir TAMARKIN

IPC: H01L25/16 ,  H01L23/538 ,  H01L23/367 ,  H01L23/473 ,  H01L23/40 ,  H04Q11/00

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

公开(公告)号：US20210210478A1

公开(公告)日：2021-07-08

申请号：US17191615

申请日：2021-03-03

Applicant: Intel Corporation

Inventor： Susheel JADHAV ,  Juan DOMINGUEZ ,  Ankur AGRAWAL ,  Kenneth BROWN ,  Yi LI ,  Jing CHEN ,  Aditi MALLIK ,  Xiaoyu HONG ,  Thomas LILJEBERG ,  Andrew C. ALDUINO ,  Ling LIAO ,  David HUI ,  Ren-Kang CHIOU ,  Harinadh POTLURI ,  Hari MAHALINGAM ,  Lobna KAMYAB ,  Sasanka KANUPARTHI ,  Sushrutha Reddy GUJJULA ,  Saeed FATHOLOLOUMI ,  Priyanka DOBRIYAL ,  Boping XIE ,  Abiola AWUJOOLA ,  Vladimir TAMARKIN ,  Keith MEASE ,  Stephen KEELE ,  David SCHWEITZER ,  Brent ROTHERMEL ,  Ning TANG ,  Suresh POTHUKUCHI ,  Srikant NEKKANTY ,  Zhichao ZHANG ,  Kaiyuan ZENG ,  Baikuan WANG ,  Donald TRAN ,  Ravindranath MAHAJAN ,  Baris BICEN ,  Grant SMITH

IPC: H01L25/18 ,  H01L23/473 ,  H01R12/71

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.