公开(公告)号：US20220155539A1

公开(公告)日：2022-05-19

申请号：US16953146

申请日：2020-11-19

Applicant: Intel Corporation

Inventor： Srinivas V. PIETAMBARAM ,  Brandon C. MARIN ,  Sameer PAITAL ,  Sai VADLAMANI ,  Rahul N. MANEPALLI ,  Xiaoqian LI ,  Suresh V. POTHUKUCHI ,  Sujit SHARAN ,  Arnab SARKAR ,  Omkar KARHADE ,  Nitin DESHPANDE ,  Divya PRATAP ,  Jeremy ECTON ,  Debendra MALLIK ,  Ravindranath V. MAHAJAN ,  Zhichao ZHANG ,  Kemal AYGÜN ,  Bai NIE ,  Kristof DARMAWIKARTA ,  James E. JAUSSI ,  Jason M. GAMBA ,  Bryan K. CASPER ,  Gang DUAN ,  Rajesh INTI ,  Mozhgan MANSURI ,  Susheel JADHAV ,  Kenneth BROWN ,  Ankar AGRAWAL ,  Priyanka DOBRIYAL

IPC: G02B6/42

Abstract: Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.

公开(公告)号：US20230299851A1

公开(公告)日：2023-09-21

申请号：US17700043

申请日：2022-03-21

Applicant: Intel Corporation

Inventor： Joshua B. FRYMAN ,  Khaled AHMED ,  Sergey SHUMARAYEV ,  Thomas LILJEBERG ,  Divya PRATAP ,  James E. JAUSSI

IPC: H04B10/25 ,  G02B6/42 ,  H04B10/50

CPC classification number: H04B10/25891 ,  G02B6/4246 ,  G02B6/4202 ,  G02B6/423 ,  H04B10/502

Abstract: A system enables optical communication with direct conversion of the electrical signal into an optical signal with an array of optical sources. The use of the array of optical sources can eliminate the need for a large serializer/deserializer (SERDES). With an array of optical sources, the optical communication can occur at lower power and lower frequency per optical source, with multiple parallel optical sources combining to provide a signal.

公开(公告)号：US20220413236A1

公开(公告)日：2022-12-29

申请号：US17358502

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Omkar KARHADE ,  Sushrutha Reddy GUJJULA ,  Tolga ACIKALIN ,  Ravindranath V. MAHAJAN ,  James E. JAUSSI ,  Chia-Pin CHIU

IPC: G02B6/42 ,  H01L25/16 ,  H01L23/00 ,  H01L23/367 ,  H01S3/04

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to thermally and/or electrically coupling a thermal die to the surface of a photonic integrated circuit (PIC) within an open cavity in a substrate, where the thermal die is proximate to a laser on the PIC. Other embodiments may be described and/or claimed.