摘要:
The temperature of a power semiconductor component is monitored by feeding the block current of a bipolar transistor which is in thermal contact with the component to an amplifying current mirror. The output signal of the current mirror is compared with a reference current. If the mirrored current is greater than the reference current, then the system produces a corresponding output. Temperatures of the power semiconductor component below 140.degree. C. can be reliably detected.
摘要:
A thyristor is controlled by a phototransistor whose photo current is reduced by a MOSFET if the thyristor voltage surpasses a prescribed value. The MOSFET is controlled by two current supplies. The first current supply is connected between a gate terminal and a connecting terminal of the thyristor. The second current supply is connected between the gate and source of the MOSFET. The maximum current capacity of the first current supply is greater than the maximum current capacity of the second current supply.
摘要:
An integrated power semiconductor component includes a substrate of a first conduction type. At least one first region of a second conduction type is embedded in the substrate and at least one second region of the second conduction type is embedded in the substrate. A substrate contact supplies a supply voltage. Contact-making semiconductor components are embedded in the first region and in the second region. At least a portion of the semiconductor components in the first region control at least a portion of the semiconductor components in the second region. A third region of the second conduction type is disposed between the first region and the second region, and the first region and the third region are at different potentials.
摘要:
MOSFET and IGBT components protected against overvoltage by a limiting diode inserted between drain or, respectively, collector terminal and gate terminal are provided. A freewheeling diode connected to the component having a limiting diode with a breakdown voltage that is lower than the breakdown voltage of the freewheeling diode by a defined amount is provided. This over-voltage protection can be achieved in a simple way by integrating the limiting diode into the semiconductor body of the freewheeling diode and by a corresponding arrangement of the anode zone of the limiting diode.
摘要:
A control circuit for an MOS semiconductor component having gate and source terminals has a load connected in series with the source terminal. A voltage source at fluctuating potential has first and second terminals. A first controllable semiconductor switch has a control input and is connected between the first terminal of the voltage source and the gate terminal of the MOS semiconductor component. The second terminal of the voltage source is connected to the source terminal of the MOS semiconductor component. A second switch is controllable by an input signal and has first and second load terminals. A line is connected to a fixed potential and to the first load terminal of the second switch. The second load terminal of the second switch is switched from a first to a second potential as a function of the input signal. The first and second potentials are between potentials of the first and second terminals of the voltage source. The first and second potentials are applied to the control input of the first switch for making the first switch conducting whenever an input signal is applied.
摘要:
A semiconductor element has a semiconductor body of a first conductivity type. The semiconductor body has a zone of a second conductivity type embedded. Further regions of the second conductivity type surround the zone of the second conductivity type like a well. The further regions are interrupted in at least one location by a channel that is formed by the semiconductor body. The further regions are doped with a doping concentration that is high enough so that the further regions are not completely depleted of charge carriers when the semiconductor element is revere-biased.
摘要:
The invention relates to a method for fabricating a drift zone of a vertical semiconductor component and to a vertical semiconductor component having the following features: a semiconductor body (100) having a first side (101) and a second side (102), a drift zone (30) of a first conduction type which is arranged in the region between the first and the second sides (101, 102) and is formed for the purpose of taking up a reverse voltage, a field electrode arrangement arranged in the drift zone (30) and having at least one electrically conducted field electrode (40; 40A-40E; 90A-90J) arranged in a manner insulated from the semiconductor body (100), an electrical potential of the at least one field electrode (40; 40A-40E; 90A-90J) varying in the vertical direction of the semiconductor body (100) at least when a reverse voltage is applied.
摘要:
A temperature-protected semiconductor circuit configuration that has an integrated switching unit. The switching unit is formed of a semiconductor switch, a first integrated temperature sensor for driving the semiconductor switch when an over-temperature is reached, first and second connecting terminals for connecting a load, and a control terminal for applying a drive signal for the semiconductor switch. A second temperature sensor is connected in a heat-conducting manner to the switching unit which exhibits at least one output terminal for providing a temperature-dependent temperature signal.
摘要:
A junction field-effect transistor containing a semiconductor region with an inner region is described. In addition, a first and a second connecting region, respectively, are disposed within the semiconductor region. The first connecting region has the same conductivity type as the inner region, but in a higher doping concentration. The second connecting region has the opposite conductivity type to that of the inner region. This reduces the forward resistance while at the same time maintaining a high reverse voltage strength.
摘要:
The invention relates to a vertical power MOSFET having additional column-like zones (11, 12) which are arranged in an inner zone (1) and have the same and the opposite conductivity type as/to the inner zone (1). The charge carrier life is reduced in the additional zones (12), which are of the same conductivity type as the inner zone (1), and the inner zone (1) is dimensioned such that the space charge zone does not reach the junction between the inner zone and a drain zone.