公开(公告)号：US09496468B2

公开(公告)日：2016-11-15

申请号：US14643609

申请日：2015-03-10

Applicant: KANEKA CORPORATION

Inventor： Tadashi Kokubo ,  Katsuya Ouchi ,  Takahisa Iwahara ,  Kazuhiko Hirabayashi ,  Hiroshi Okoshi ,  Tomokazu Tozawa ,  Shuhei Ozaki

IPC: H01L33/56 ,  H01L23/29 ,  H01L33/60 ,  H01L23/31 ,  C08K3/22 ,  C08K3/36 ,  C08K5/098 ,  H01L23/495 ,  H01L33/62

CPC classification number: H01L33/56 ,  C08K3/22 ,  C08K3/36 ,  C08K5/098 ,  C08K2003/2241 ,  H01L23/295 ,  H01L23/296 ,  H01L23/3171 ,  H01L23/49586 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

公开(公告)号：US20130116378A1

公开(公告)日：2013-05-09

申请号：US13722461

申请日：2012-12-20

Applicant: KANEKA CORPORATION

Inventor： Katsuyu Wakabayashi ,  Katsuya Ouchi

IPC: C08L83/04

CPC classification number: C08L83/04 ,  C08G65/2609 ,  C08G65/2663 ,  C08G65/336 ,  C08G65/337 ,  C08K5/16 ,  C08K5/31 ,  C08K5/5419 ,  C08K5/5425 ,  C08L101/10 ,  C08L2312/08 ,  C09D133/08 ,  C09J171/02 ,  C09K3/10 ,  C09K2200/0239 ,  C09K2200/0657

Abstract: An object of the present invention is to provide a curable composition which is made mainly of a polymer having one or more reactive silicon groups, has good curability even when filler is used while a non-organotin catalyst is used, and is further high in industrial practicability. The object is solved by a curable composition, comprising, as constituents, a polymer (A) having one or more reactive silicon groups on average per molecule thereof, the reactive silicon group(s) being (each) a group which can be crosslinked by forming a siloxane bond, a Lewis acid and/or derivative thereof (B), an amine compound (C), a compound (D) having a reactive silicon group, and filler (E), and obtained by mixing the constituents with each other.

Abstract translation: 本发明的目的是提供一种主要由具有一个或多个反应性硅基团的聚合物制成的可固化组合物，即使使用非有机锡催化剂，即使使用填料也具有良好的固化性，并且工业上更高 实用性。 该目的通过一种可固化组合物来解决，该组合物包含平均每分子具有一个或多个反应性硅基团的聚合物（A），反应性硅基团为（各自）可以被 形成硅氧烷键，路易斯酸和/或其衍生物（B），胺化合物（C），具有反应性硅基团的化合物（D）和填料（E），并且通过将组分彼此混合 。

公开(公告)号：US11910637B2

公开(公告)日：2024-02-20

申请号：US17435776

申请日：2020-01-31

Applicant: KANEKA CORPORATION

Inventor： Takayuki Miyoshi ,  Katsuya Ouchi

IPC: H01L51/50 ,  H10K50/84 ,  H10K50/87 ,  H10K59/131

CPC classification number: H10K50/841 ,  H10K50/87 ,  H10K59/131

Abstract: Provided is an organic EL panel. A first conductive film, an organic functional film, a second conductive film, and a sealing film are provided on a substrate. The first conductive film includes a first main body, a first electrode pad, and a second electrode pad. The second conductive film includes a second main body, and a second electrode pad region extending from the second main body toward the first vertex. The second electrode pad region extends to a stretched region exposed from the sealing film which covers a light-emitting region. A first electrode conduction path surrounds at least half of the light-emitting region and connects the electrode pads. A circuit board is fixed near the first vertex. A first electrode wire is configured to adhere to the electrode pads. A second electrode wire is configured to adhere to the second electrode pad region in the stretched region.

公开(公告)号：US20150188008A1

公开(公告)日：2015-07-02

申请号：US14643609

申请日：2015-03-10

Applicant: KANEKA CORPORATION

Inventor： Tadashi Kokubo ,  Katsuya Ouchi ,  Takahisa Iwahara ,  Kazuhiko Hirabayashi ,  Hiroshi Okoshi ,  Tomokazu Tozawa ,  Shuhei Ozaki

IPC: H01L33/56 ,  C08K5/098 ,  H01L33/62 ,  H01L23/495 ,  H01L23/29 ,  C08K3/36 ,  C08K3/22

CPC classification number: H01L33/56 ,  C08K3/22 ,  C08K3/36 ,  C08K5/098 ,  C08K2003/2241 ,  H01L23/295 ,  H01L23/296 ,  H01L23/3171 ,  H01L23/49586 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

Abstract translation: 本发明的目的在于提供一种固化性树脂组合物，其具有低的线性膨胀系数的固化物。 本发明的固化性树脂组合物含有作为必要成分的（A）每分子具有至少两个与SiH基反应的碳 - 碳双键的有机化合物，（B）每分子含有至少两个SiH基的化合物， （C）氢化硅烷化催化剂，（D）每分子具有至少一个与SiH基反应的碳 - 碳双键的硅氧烷化合物和（E）无机填料。

公开(公告)号：US08962716B2

公开(公告)日：2015-02-24

申请号：US13722461

申请日：2012-12-20

Applicant: Kaneka Corporation

Inventor： Katsuyu Wakabayashi ,  Katsuya Ouchi

IPC: C08K5/34 ,  C08L83/04

CPC classification number: C08L83/04 ,  C08G65/2609 ,  C08G65/2663 ,  C08G65/336 ,  C08G65/337 ,  C08K5/16 ,  C08K5/31 ,  C08K5/5419 ,  C08K5/5425 ,  C08L101/10 ,  C08L2312/08 ,  C09D133/08 ,  C09J171/02 ,  C09K3/10 ,  C09K2200/0239 ,  C09K2200/0657

Abstract: An object of the present invention is to provide a curable composition which is made mainly of a polymer having one or more reactive silicon groups, has good curability even when filler is used while a non-organotin catalyst is used, and is further high in industrial practicability. The object is solved by a curable composition, comprising, as constituents, a polymer (A) having one or more reactive silicon groups on average per molecule thereof, the reactive silicon group(s) being (each) a group which can be crosslinked by forming a siloxane bond, a Lewis acid and/or derivative thereof (B), an amine compound (C), a compound (D) having a reactive silicon group, and filler (E), and obtained by mixing the constituents with each other.

Abstract translation: 本发明的目的是提供一种主要由具有一个或多个反应性硅基团的聚合物制成的可固化组合物，即使使用非有机锡催化剂，即使使用填料也具有良好的固化性，并且工业上更高 实用性。 该目的通过一种可固化组合物来解决，该组合物包含平均每分子具有一个或多个反应性硅基团的聚合物（A），反应性硅基团为（各自）可以被 形成硅氧烷键，路易斯酸和/或其衍生物（B），胺化合物（C），具有反应性硅基团的化合物（D）和填料（E），并且通过将组分彼此混合 。