公开(公告)号：US20220372271A1

公开(公告)日：2022-11-24

申请号：US17879046

申请日：2022-08-02

Applicant: KANEKA CORPORATION

Inventor： Kazuhiko Hirabayashi ,  Jiro Okai ,  Taisuke Sasaki ,  Kenichi Yoshihashi

IPC: C08L53/00 ,  C09J153/00 ,  C09K3/10

Abstract: A composition with improved storage viscosity is provided. The composition contains a (meth)acrylic-based copolymer (A′) and an epoxy compound (C). A molecule of the (meth)acrylic-based copolymer (A′) includes an XY diblock structure or an XYX triblock structure therein. A number of repeating units which are derived from a (meth)acrylic ester monomer having an alkoxysilyl group and are included in an X block is 1.0 or more on average; an amount of repeating units which are derived from a (meth)acrylic ester monomer having an alkoxysilyl group and are included in a Y block is 0% by weight to 3% by weight, with respect to a weight of all repeating units included in the Y block. A molecular weight distribution (Mw/Mn) of the (meth)acrylic-based copolymer (A′) is 1.8 or less.

公开(公告)号：US09793456B2

公开(公告)日：2017-10-17

申请号：US14344075

申请日：2012-09-26

Applicant: KANEKA CORPORATION

Inventor： Tomokazu Tozawa ,  Takahisa Iwahara ,  Hiroshi Ogoshi ,  Kazuhiko Hirabayashi ,  Shuhei Ozaki ,  Satoaki Iba ,  Kazuaki Kanai ,  Yasushi Kakehashi ,  Takao Manabe ,  Mitsuhiro Hori ,  Ryoichi Narita

IPC: H01L33/62 ,  H01L33/60 ,  B29C45/14 ,  B29C45/37 ,  C08L83/04 ,  H01L23/00 ,  H05K13/00 ,  C08G77/54 ,  C08K5/3492 ,  C08G77/12 ,  C08G77/20 ,  C08G77/14

CPC classification number: H01L33/62 ,  B29C45/14655 ,  B29C45/372 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/54 ,  C08K5/34924 ,  C08L83/04 ,  H01L24/97 ,  H01L33/60 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01322 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  H05K13/00 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  C08L83/00 ,  C08L83/14

Abstract: A molded resin body for surface-mounted light-emitting device has a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 μm to 10 μm, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under the conditions of a temperature range of −50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.

公开(公告)号：US20150188008A1

公开(公告)日：2015-07-02

申请号：US14643609

申请日：2015-03-10

Applicant: KANEKA CORPORATION

Inventor： Tadashi Kokubo ,  Katsuya Ouchi ,  Takahisa Iwahara ,  Kazuhiko Hirabayashi ,  Hiroshi Okoshi ,  Tomokazu Tozawa ,  Shuhei Ozaki

IPC: H01L33/56 ,  C08K5/098 ,  H01L33/62 ,  H01L23/495 ,  H01L23/29 ,  C08K3/36 ,  C08K3/22

CPC classification number: H01L33/56 ,  C08K3/22 ,  C08K3/36 ,  C08K5/098 ,  C08K2003/2241 ,  H01L23/295 ,  H01L23/296 ,  H01L23/3171 ,  H01L23/49586 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

Abstract translation: 本发明的目的在于提供一种固化性树脂组合物，其具有低的线性膨胀系数的固化物。 本发明的固化性树脂组合物含有作为必要成分的（A）每分子具有至少两个与SiH基反应的碳 - 碳双键的有机化合物，（B）每分子含有至少两个SiH基的化合物， （C）氢化硅烷化催化剂，（D）每分子具有至少一个与SiH基反应的碳 - 碳双键的硅氧烷化合物和（E）无机填料。

公开(公告)号：US20150008455A1

公开(公告)日：2015-01-08

申请号：US14344075

申请日：2012-09-26

Applicant: KANEKA CORPORATION

Inventor： Tomokazu Tozawa ,  Takahisa Iwahara ,  Hiroshi Ogoshi ,  Kazuhiko Hirabayashi ,  Shuhei Ozaki ,  Satoaki Iba ,  Kazuaki Kanai ,  Yasushi Kakehashi ,  Takao Manabe ,  Mitsuhiro Hori ,  Ryoichi Narita

IPC: H01L33/62 ,  H01L33/54 ,  H01L33/60 ,  H05K13/00

CPC classification number: H01L33/62 ,  B29C45/14655 ,  B29C45/372 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/54 ,  C08K5/34924 ,  C08L83/04 ,  H01L24/97 ,  H01L33/60 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01322 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  H05K13/00 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  C08L83/00 ,  C08L83/14

Abstract: A molded resin body for surface-mounted light-emitting device has cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 μm to 10 μm, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMS) under the conditions of a temperature range of −50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.

Abstract translation: 用于表面安装发光装置的模制树脂体具有与多个引线一体模制的固化树脂体和在底部暴露多个引线的凹部，其中十点平均粗糙度（Rz ）为1〜10μm，固化树脂体的玻璃化转变温度为10℃以上，玻璃化转变温度为使用热机械分析仪（TMS）测定的值 温度范围为-50至250℃，升温速率为5℃/分钟，样品尺寸长度为1至5mm的条件，以及在460nm的光学反射率 凹部为80％以上，在180℃下加热72小时后的开口面的光反射率保持率为90％以上。

公开(公告)号：US09496468B2

公开(公告)日：2016-11-15

申请号：US14643609

申请日：2015-03-10

Applicant: KANEKA CORPORATION

Inventor： Tadashi Kokubo ,  Katsuya Ouchi ,  Takahisa Iwahara ,  Kazuhiko Hirabayashi ,  Hiroshi Okoshi ,  Tomokazu Tozawa ,  Shuhei Ozaki

IPC: H01L33/56 ,  H01L23/29 ,  H01L33/60 ,  H01L23/31 ,  C08K3/22 ,  C08K3/36 ,  C08K5/098 ,  H01L23/495 ,  H01L33/62

CPC classification number: H01L33/56 ,  C08K3/22 ,  C08K3/36 ,  C08K5/098 ,  C08K2003/2241 ,  H01L23/295 ,  H01L23/296 ,  H01L23/3171 ,  H01L23/49586 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.