Transport Path Correction Techniques and Related Systems, Methods and Devices

    公开(公告)号:US20190297733A1

    公开(公告)日:2019-09-26

    申请号:US16435911

    申请日:2019-06-10

    Applicant: Kateeva, Inc.

    Abstract: A printer deposits material onto a substrate as part of a manufacturing process for an electronic product. At least one mechanical component experiences mechanical error, which is mitigated using transducers that equalize position of a transported thing, e.g., to provide an “ideal” conveyance path; a substrate conveyance system and/or a printhead conveyance system can each use transducers in this manner to improve precise droplet placement. In one embodiment, errors are measured in advance, with corrections being “played back” during production runs to mitigate repeatable transport path error. In a still more detailed embodiment, the transducers can be predicated on voice coils, which cooperate with a floatation table and floating, mechanical pivot assembly to provide frictionless, but mechanically-supported error correction.

    PRECISION POSITION ALIGNMENT, CALIBRATION AND MEASUREMENT IN PRINTING AND MANUFACTURING SYSTEMS

    公开(公告)号:US20180229497A1

    公开(公告)日:2018-08-16

    申请号:US15851419

    申请日:2017-12-21

    Applicant: Kateeva, Inc.

    Abstract: This disclosure provides a high precision measurement system for rapid, accurate determination of height of a deposition source relative to a deposition target substrate. In one embodiment, each of two transport paths of an industrial printer mounts a camera and a high precision sensor. The cameras are used to achieve registration between split transport axes, and the positions of the high precision sensors are each precisely determined in terms of xy position. One of the high precision sensors is used to measure height of the deposition source, while another measures height of the target substrate. Relative z axis position between these sensors is identified to provide for precise z-coordinate identification of both source and target substrate. Disclosed embodiments permit dynamic, real-time, high precision height measurement to micron or submicron accuracy.

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