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公开(公告)号：US09961782B2
公开(公告)日：2018-05-01
申请号：US15642037
申请日：2017-07-05
Applicant: Kateeva, Inc.
Inventor： Digby Pun , David C. Darrow , Robert B. Lowrance , Alexander Sou-Kang Ko
IPC: H01L21/67 , H01L21/68 , B05C5/02 , H01L23/02 , H01L23/28 , H05K3/46 , B05D5/12 , B41J29/393 , B41J2/01 , H01L21/683
CPC classification number: H05K3/4644 , B05C5/0208 , B05D5/12 , B41J2/01 , B41J3/407 , B41J13/0027 , B41J29/393 , H01L21/67 , H01L21/6715 , H01L21/6776 , H01L21/67784 , H01L21/68 , H01L21/683 , H05K3/4679 , H05K2203/0104 , H05K2203/013 , H05K2203/0736 , H05K2203/166
Abstract: A printer deposits material onto a substrate as part of a manufacturing process for an electronic product. At least one mechanical component experiences mechanical error, which is mitigated using transducers that equalize position of a transported thing, e.g., to provide an “ideal” conveyance path; a substrate conveyance system and/or a printhead conveyance system can each use transducers in this manner to improve precise droplet placement. In one embodiment, errors are measured in advance, with corrections being “played back” during production runs to mitigate repeatable transport path error. In a still more detailed embodiment, the transducers can be predicated on voice coils, which cooperate with a floatation table and floating, mechanical pivot assembly to provide frictionless, but mechanically-supported error correction.
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公开(公告)号：US20180014411A1
公开(公告)日：2018-01-11
申请号：US15642188
申请日：2017-07-05
Applicant: Kateeva, Inc.
Inventor： Eliyahu Vronsky , Karl Mathia , Alexander Sou-Kang Ko
IPC: H05K3/46
CPC classification number: H05K3/4644 , B05C5/0208 , B05D5/12 , B41J2/01 , B41J3/407 , B41J13/0027 , B41J29/393 , H01L21/67 , H01L21/6715 , H01L21/6776 , H01L21/67784 , H01L21/68 , H01L21/683 , H05K3/4679 , H05K2203/0104 , H05K2203/013 , H05K2203/0736 , H05K2203/166
Abstract: A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an “ideal” conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.
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公开(公告)号：US20160021760A1
公开(公告)日：2016-01-21
申请号：US14794509
申请日：2015-07-08
Applicant: OCE-TECHNOLOGIES B.V.
Inventor： Mircea V. RASA
IPC: H05K3/12
CPC classification number: H05K3/1241 , B41J2/04 , B41J2002/041 , H05K2203/0736
Abstract: The present invention relates to a method for ejecting droplets of a molten metal. In the present invention, the metal is a composition comprising a first metal and a second element, wherein the second element is Si. In jetting operation, the second elements may prevent contaminants present in the composition from precipitating and clogging the orifice. The present invention further relates to the use of such composition.
Abstract translation: 本发明涉及一种喷射熔融金属液滴的方法。 在本发明中，金属是包含第一金属和第二元素的组合物，其中第二元素是Si。 在喷射操作中，第二元件可以防止组合物中存在的污染物使孔口沉淀和堵塞。 本发明还涉及这种组合物的用途。
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公开(公告)号：US07914842B1
公开(公告)日：2011-03-29
申请号：US11702735
申请日：2007-02-06
Applicant: Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Brian V. Mech
Inventor： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , Jerry Ok , Brian V. Mech
IPC: A61N1/04
CPC classification number: H05K3/0011 , A61N1/0543 , H05K3/0035 , H05K3/064 , H05K2203/0736 , H05K2203/095
Abstract: Polymer materials form electrode array bodies for neural stimulation, especially for retinal stimulation to create vision. The method lays down a polymer layer. Apply a metal layer to the polymer and pattern to create electrodes and leads. Apply a second polymer layer over the metal layer and pattern to leave openings for electrodes. The array and its supply cable are a single body. A method for manufacturing a flexible circuit electrode array, is: deposit a metal trace layer on an insulator polymer base layer; apply a layer of photoresist on the metal trace layer and pattern the metal trace layer and form metal traces on the insulator polymer base layer; activate the insulator polymer base layer and deposit a top insulator polymer layer and form a single insulating polymer layer with the base insulator polymer layer; wherein the insulator polymer layers are heated at 80-150° C. and then at 230-350° C.
Abstract translation: 聚合物材料形成用于神经刺激的电极阵列体，特别是用于视网膜刺激以产生视觉。 该方法沉积聚合物层。 将金属层施加到聚合物和图案以产生电极和引线。 在金属层和图案上施加第二聚合物层以留下用于电极的开口。 阵列及其供电电缆是单体。 柔性电路电极阵列的制造方法是：在绝缘体聚合物基层上沉积金属迹线层; 在金属迹线层上施加一层光致抗蚀剂，并对金属迹线层进行图案化并在绝缘体聚合物基层上形成金属迹线; 激活绝缘体聚合物基层并沉积顶绝缘体聚合物层并与基底绝缘体聚合物层形成单个绝缘聚合物层; 其中将绝缘体聚合物层在80-150℃，然后在230-350℃下加热
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公开(公告)号：US20190246506A1
公开(公告)日：2019-08-08
申请号：US16385435
申请日：2019-04-16
Applicant: Kateeva, Inc.
Inventor： Eliyahu Vronsky , Karl Mathia , Alexander Sou-Kang Ko
CPC classification number: H05K3/4644 , B05C5/0208 , B05D5/12 , B41J2/01 , B41J3/407 , B41J13/0027 , B41J29/393 , H01L21/67 , H01L21/6715 , H01L21/6776 , H01L21/67784 , H01L21/68 , H01L21/683 , H01L51/00 , H01L51/0005 , H05K3/4679 , H05K2203/0104 , H05K2203/013 , H05K2203/0736 , H05K2203/166
Abstract: A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an “ideal” conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.
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Patent Agency Ranking
公开(公告)号：US20180213633A1
公开(公告)日：2018-07-26
申请号：US15499586
申请日：2017-04-27
Applicant: Shiu Li Technology Co., Ltd.
Inventor： Chung-Cheng Chien
CPC classification number: H05K1/0209 , H05K1/0284 , H05K1/0306 , H05K1/095 , H05K3/1216 , H05K3/14 , H05K3/44 , H05K2201/0266 , H05K2201/10106 , H05K2203/0736 , H05K2203/1366
Abstract: A heat dissipator having a circuit formed by screen printing or spraying includes a circuit layer and an isolation layer. The circuit layer, which is on a surface of a heat dissipation part of the heat dissipator having the circuit formed by screen printing or spraying, is formed by screen printing or spraying a uniformly distributed plastic material and low electrical resistance conductive powder. The isolation layer is disposed on the circuit layer and the heat dissipation part.
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公开(公告)号：US20170123310A1
公开(公告)日：2017-05-04
申请号：US15319733
申请日：2015-06-19
Applicant: FUNDACIÓ INSTITUT CATALÀ DE NANOCIÈNCIA I NANOTECNOLOGIA , INSTITUCIÓ CATALANA DE RECERCA I ESTUDIS AVANÇATS
IPC: G03F7/00 , B01D71/48 , B01D71/02 , H05K3/12 , B01D67/00 , H05K1/18 , H05K3/00 , B01D71/12 , B01D69/12
CPC classification number: G03F7/0002 , B01D67/0034 , B01D69/02 , B01D69/12 , B01D71/021 , B01D71/12 , B01D71/48 , H05K1/189 , H05K3/0076 , H05K3/1275 , H05K2201/0145 , H05K2203/0736
Abstract: A method of forming an electronic device on a flexible substrate without using acetone dissolvent, including the steps of: printing a hydrophobic mask on a porous membrane to form a pattern thereon which is complementary to a desired pattern; filtering an aqueous suspension of an electronic material through the non-printed region of the porous membrane, whereby some electronic material is deposited on said non-printed region following the desired pattern; pressing the flexible substrate against the printed face of the membrane in order to transfer the patterned electronic material deposited on the porous membrane to the flexible substrate to form the electronic device thereon.
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公开(公告)号：US09636701B2
公开(公告)日：2017-05-02
申请号：US13568278
申请日：2012-08-07
Applicant: Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, Jr. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
Inventor： Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, Jr. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
CPC classification number: B05C11/1034 , B05C5/001 , B05C5/0225 , B05C11/10 , G05D7/0629 , H05K3/28 , H05K3/3484 , H05K2203/0736
Abstract: A viscous material noncontact jetting system has a jetting dispenser mounted for relative motion with respect to a surface. A control is operable to cause the jetting dispenser to jet a viscous material droplet that is applied to the surface as a viscous material dot. A device, such as a camera or weigh scale, is connected to the control and provides a feedback signal representing a size-related physical characteristic of the dot applied to the surface. The size-related physical characteristics of subsequently applied dots is controlled by heating and cooling, or adjusting a piston stroke in the jetting dispenser, in response to the size-related physical characteristic feedback. Dispensed material volume control and velocity offset compensation are also provided.
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公开(公告)号：US08257779B2
公开(公告)日：2012-09-04
申请号：US13079300
申请日：2011-04-04
Applicant: Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, Jr. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
Inventor： Ron Abernathy , Alec J. Babiarz , Nicholas Anthony Barendt , Robert Ciardella , James Everett Cooper, Jr. , Kenneth S. Espenschied , Erik Fiske , Christopher L. Giusti , Patrick R. Jenkins , Alan Lewis , Raymond Andrew Merritt , Naoya Ian Nagano , Horatio Quinones , Thomas Ratledge , Joe Sherman , Floriana Suriawidjaja , Todd Weston
IPC: C23C16/52
CPC classification number: B05C11/1034 , B05C5/001 , B05C5/0225 , B05C11/10 , G05D7/0629 , H05K3/28 , H05K3/3484 , H05K2203/0736
Abstract: A viscous material noncontact jetting system has a jetting dispenser mounted for relative motion with respect to a surface. A control is operable to cause the jetting dispenser to jet a viscous material droplet that is applied to the surface as a viscous material dot. A device, such as a camera or weigh scale, is connected to the control and provides a feedback signal representing a size-related physical characteristic of the dot applied to the surface. The size-related physical characteristics of subsequently applied dots is controlled by heating and cooling, or adjusting a piston stroke in the jetting dispenser, in response to the size-related physical characteristic feedback. Dispensed material volume control and velocity offset compensation are also provided.
Abstract translation: 粘性材料非接触喷射系统具有安装成相对于表面相对运动的喷射分配器。 控制器可操作以使喷射分配器喷射作为粘性材料点施加到表面的粘性物质液滴。 诸如相机或称重秤的装置连接到控制器，并且提供表示应用于表面的点的与尺寸有关的物理特性的反馈信号。 响应于尺寸相关的物理特性反馈，随后施加的点的尺寸相关的物理特性由加热和冷却或喷射分配器中的活塞行程调节来控制。 还提供分配材料体积控制和速度偏移补偿。
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公开(公告)号：US11856694B2
公开(公告)日：2023-12-26
申请号：US17008636
申请日：2020-08-31
Inventor： Chen-Hao Wang , Hsueh-Yu Chen , Guan-Cheng Tong
IPC: H05K1/03 , H05K3/18 , B29C64/112 , B33Y10/00 , B33Y80/00 , C23C18/16 , B29C64/30 , B33Y40/20 , H05K3/46 , B29K67/00 , B29K101/12 , B29K105/00 , B29L31/34 , B29K55/02
CPC classification number: H05K1/0353 , B29C64/112 , B29C64/30 , B33Y10/00 , B33Y40/20 , B33Y80/00 , C23C18/1607 , C23C18/1641 , H05K3/181 , H05K3/4644 , B29K2055/02 , B29K2067/046 , B29K2101/12 , B29K2105/0014 , B29L2031/3425 , H05K2203/072 , H05K2203/0736
Abstract: The disclosure provides a circuit substrate and a method for manufacturing the same. The circuit substrate includes a wiring and a substrate having a base region and a circuit region. The base region having a first pattern is constituted by a first thermoplastic material. The circuit region having a second pattern is constituted by a second thermoplastic material. The first pattern has a portion opposite to the second pattern. The wiring is formed on the circuit region along the second pattern. The first thermoplastic material is different from the second thermoplastic material, and the second thermoplastic material includes a catalyst particle.
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