公开(公告)号：US5425822A

公开(公告)日：1995-06-20

申请号：US158982

申请日：1993-11-30

申请人： Kensuke Hidaka ,  Kanichi Tanaka ,  Yoshio Kohira ,  Hideshi Yamaguchi ,  Yoshinao Suzuki ,  Masahiro Nakagawa ,  Yoshio Fuwa ,  Kazuhiko Mori ,  Yoshihiko Ito ,  Atsushi Taguchi

发明人： Kensuke Hidaka ,  Kanichi Tanaka ,  Yoshio Kohira ,  Hideshi Yamaguchi ,  Yoshinao Suzuki ,  Masahiro Nakagawa ,  Yoshio Fuwa ,  Kazuhiko Mori ,  Yoshihiko Ito ,  Atsushi Taguchi

IPC分类号： B23K35/30 ,  C22C19/05 ,  C22C27/06 ,  C22C30/00

CPC分类号： C22C27/06

摘要： A hard facing chromium-base alloy consisting essentially of 30.0 to 48.0% by weight of nickel. 1.5 to 15.0% by weight of tungsten and/or 1.0 to 6.5% by weight of molybdenum, the balance being more than 40.0% by weight of chromium, and the maximum sum of tungsten and molybdenum being 15.0% by weight. The alloy may also contain one or more of iron, cobalt, carbon, boron, aluminum, silicon, niobium and titanium. When the alloy is used in powder form as a material for hard facing by welding, the alloy may further contain 0.01 to 0.12% by weight of aluminum, yttrium, misch metal, titanium, zirconium and hafnium. 0.01 to 0.1% by weight of oxygen may also be added to the alloy. The alloy has a high degree of toughness wear resistance and corrosion resistance. The alloy can be used as a hard facing material to be applied to various objects, such as automobile engine valves.

摘要翻译： 基本上由30.0至48.0重量％的镍组成的硬质铬基合金。 1.5至15.0重量％的钨和/或1.0至6.5重量％的钼，余量大于40.0重量％的铬，钨和钼的最大总和为15.0重量％。 合金还可以含有铁，钴，碳，硼，铝，硅，铌和钛中的一种或多种。 当合金以粉末形式用作通过焊接的硬面材料时，该合金还可以含有0.01至0.12重量％的铝，钇，混合金属，钛，锆和铪。 也可以向合金中添加0.01〜0.1重量％的氧。 该合金具有高韧性耐磨性和耐腐蚀性。 该合金可以用作用于各种物体的硬质材料，例如汽车发动机阀门。

公开(公告)号：US5314659A

公开(公告)日：1994-05-24

申请号：US883960

申请日：1992-05-15

申请人： Kensuke Hidaka ,  Kanichi Tanaka ,  Yoshio Kohira ,  Hideshi Yamaguchi ,  Yoshinao Suzuki ,  Masahiro Nakagawa ,  Yoshio Fuwa ,  Kazuhiko Mori ,  Yoshihiko Ito ,  Atsushi Taguchi

发明人： Kensuke Hidaka ,  Kanichi Tanaka ,  Yoshio Kohira ,  Hideshi Yamaguchi ,  Yoshinao Suzuki ,  Masahiro Nakagawa ,  Yoshio Fuwa ,  Kazuhiko Mori ,  Yoshihiko Ito ,  Atsushi Taguchi

IPC分类号： B23K35/30 ,  C22C19/05 ,  C22C27/06 ,  C22C30/00

CPC分类号： C22C27/06

摘要： A hard facing chromium-base alloy consisting essentially of 30.0 to 48.0% by weight of nickel, 1.5 to 15.0% by weight of tungsten and/or 1.0 to 6.5% by weight of molybdenum, the balance being more than 40.0% by weight of chromium, and the maximum sum of tungsten and molybdenum being 15.0% by weight. The alloy may also contain one or more of iron, cobalt, carbon, boron, aluminum, silicon, niobium and titanium. When the alloy is used in powder form as a material for hard facing by welding, the alloy may further contain 0.01 to 0.12% by weight of aluminum, yttrium, misch metal, titanium, zirconium and hafnium. 0.01 to 0.1% by weight of oxygen may also be added to the alloy. The alloy has a high degree of toughness, wear resistance and corrosion resistance. The alloy can be used as a hard facing material to be applied to various objects, such as automobile engine valves.

摘要翻译： 基本上由30.0至48.0重量％的镍，1.5至15.0重量％的钨和/或1.0至6.5重量％的钼组成的硬质铬基合金，余量大于40.0重量％的铬 ，钨和钼的最大总和为15.0重量％。 合金还可以含有铁，钴，碳，硼，铝，硅，铌和钛中的一种或多种。 当合金以粉末形式用作通过焊接的硬面材料时，该合金还可以含有0.01至0.12重量％的铝，钇，混合金属，钛，锆和铪。 也可以向合金中添加0.01〜0.1重量％的氧。 该合金具有高韧性，耐磨性和耐腐蚀性。 该合金可以用作用于各种物体的硬质材料，例如汽车发动机阀门。

公开(公告)号：US5019338A

公开(公告)日：1991-05-28

申请号：US428293

申请日：1989-10-26

申请人： Shinji Oishi ,  Masahiro Nakagawa ,  Mototsugu Koyama ,  Kanichi Tanaka ,  Syozo Nagai ,  Kensuke Hidaka

发明人： Shinji Oishi ,  Masahiro Nakagawa ,  Mototsugu Koyama ,  Kanichi Tanaka ,  Syozo Nagai ,  Kensuke Hidaka

IPC分类号： B23K35/30 ,  B23K35/32 ,  C22C30/00 ,  F01L3/02 ,  F02B1/04

CPC分类号： B23K35/3086 ,  B23K35/32 ,  C22C30/00 ,  F01L3/02 ,  F02B1/04

摘要： An alloy for building up a valve according to the present invention comprises: with respect to the total weight of the alloy taken as 100%, 30 to 40% by weight of chromium; 15 to 31% by weight of nickel; 7 to 20% by weight of molybdenum; 0.7 to 2.2% by weight of carbon; 1.5% or less by weight of silicon; and balance of iron and inevitable impurities. The alloy is superior in hardness at high temperatures, PbO resistance and PbO+PbSO.sub.4 resistance. In addition, the alloy is suitable for powder buildup welding.

公开(公告)号：US4948559A

公开(公告)日：1990-08-14

申请号：US385075

申请日：1989-07-26

申请人： Shinji Oishi ,  Masahiro Nakagawa ,  Mototsugu Koyama ,  Kanichi Tanaka ,  Syozo Nagai ,  Kensuke Hidaka

发明人： Shinji Oishi ,  Masahiro Nakagawa ,  Mototsugu Koyama ,  Kanichi Tanaka ,  Syozo Nagai ,  Kensuke Hidaka

IPC分类号： B23K35/30 ,  B23K35/32 ,  C22C30/00 ,  F01L3/02 ,  F02B1/04

CPC分类号： B23K35/3086 ,  B23K35/32 ,  C22C30/00 ,  F01L3/02 ,  F02B1/04

摘要： An alloy for building up a valve according to the present invention comprises: with respect to the total weight of the alloy taken as 100%, 30 to 40% by weight of chromium; 15 to 31% by weight of nickel; 7 to 20% by weight of molybdenum; 0.7 to 2.2% by weight of carbon; 1.5% or less by weight of silicon; and balance of iron and inevitable impurities. The alloy is superior in hardness at high temperatures, PbO resistance and PbO+PbSO.sub.4 resistance. In addition, the alloy is suitable for powder buildup welding.

公开(公告)号：US20060181690A1

公开(公告)日：2006-08-17

申请号：US11403922

申请日：2006-04-14

申请人： Hisashi Nishinaga ,  Ikuo Hikima ,  Mitsunori Toyoda ,  Masahiro Nakagawa ,  Tsuneyuki Hagiwara ,  Yasushi Mizuno ,  Naonori Kita ,  Osamu Tanitsu ,  Nozomu Emura

发明人： Hisashi Nishinaga ,  Ikuo Hikima ,  Mitsunori Toyoda ,  Masahiro Nakagawa ,  Tsuneyuki Hagiwara ,  Yasushi Mizuno ,  Naonori Kita ,  Osamu Tanitsu ,  Nozomu Emura

IPC分类号： G03B27/42

CPC分类号： G03F7/7015 ,  G03F7/70058 ,  G03F7/70341 ,  G03F7/706 ,  G03F7/7085

摘要： A part of exposure beam through a liquid via a projection optical system enters a light-transmitting section, enters an optical member without passing through gas, and is focused. The exposure apparatus receives the exposure light from the projection optical system to perform various measurements even if the numerical aperture of the projection optical system increases.

公开(公告)号：US5408121A

公开(公告)日：1995-04-18

申请号：US131125

申请日：1993-10-04

申请人： Tetsuro Nakamura ,  Eiichiro Tanaka ,  Shinji Fujiwara ,  Masahiro Nakagawa

发明人： Tetsuro Nakamura ,  Eiichiro Tanaka ,  Shinji Fujiwara ,  Masahiro Nakagawa

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L31/0203 ,  H01L27/14 ,  H01L31/00

CPC分类号： H01L31/0203 ,  H01L21/563 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83224 ,  H01L2224/83874 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01065 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49128 ,  Y10T29/49144

摘要： A semiconductor device according to the present invention includes: a light-transmitting substrate having a first surface and a second surface; a circuit conductor layer formed on the first surface of the light-transmitting substrate; a semiconductor chip having electrodes formed on a surface thereof, the semiconductor device being mounted face-down on the first surface of the light-transmitting substrate; a photo-thermal cross-linkable insulating resin layer for fixing the semiconductor chip on the light-transmitting substrate; a plated metal layer formed on at least a portion of the circuit conductor layer, the electrodes of the semiconductor chip being connected to the circuit conductor layer through the plated metal layer; an alloy layer formed in an abutting portion between each plated metal layer and the circuit conductor layer; and a second alloy layer formed in an abutting portion between each electrode and each plated metal layer, the alloy layers being formed by melting and recoagulating the plated metal layer upon the circuit conductor layer.

摘要翻译： 根据本发明的半导体器件包括：具有第一表面和第二表面的透光衬底; 形成在所述透光性基板的第一面上的电路导体层; 具有形成在其表面上的电极的半导体芯片，所述半导体器件面朝下安装在所述透光衬底的第一表面上; 用于将所述半导体芯片固定在所述透光基板上的光热交联绝缘树脂层; 形成在所述电路导体层的至少一部分上的电镀金属层，所述半导体芯片的电极通过所述电镀金属层与所述电路导体层连接; 在每个镀覆的金属层和电路导体层之间的邻接部分中形成的合金层; 以及在每个电极和每个电镀金属层之间的邻接部分中形成的第二合金层，通过在电路导体层上熔化和重新填充镀覆的金属层来形成合金层。

公开(公告)号：US5405809A

公开(公告)日：1995-04-11

申请号：US264530

申请日：1994-06-23

申请人： Tetsuro Nakamura ,  Eiichiro Tanaka ,  Shinji Fujiwara ,  Masahiro Nakagawa

发明人： Tetsuro Nakamura ,  Eiichiro Tanaka ,  Shinji Fujiwara ,  Masahiro Nakagawa

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L31/0203

CPC分类号： H01L31/0203 ,  H01L21/563 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83224 ,  H01L2224/83874 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01065 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49128 ,  Y10T29/49144

摘要： A semiconductor device according to the present invention includes: a light-transmitting substrate having a first surface and a second surface; a circuit conductor layer formed on the first surface of the light-transmitting substrate; a semiconductor chip having electrodes formed on a surface thereof, the semiconductor device being mounted face-down on the first surface of the light-transmitting substrate; a photo-thermal cross-linkable insulating resin layer for fixing the semiconductor chip on the light-transmitting substrate; a plated metal layer formed on at least a portion of the circuit conductor layer, the electrodes of the semiconductor chip being connected to the circuit conductor layer through the plated metal layer; an alloy layer formed in an abutting portion between each plated metal layer and the circuit conductor layer; and a second alloy layer formed in an abutting portion between each electrode and each plated metal layer, the alloy layers being formed by melting and recoagulating the plated metal layer upon the circuit conductor layer.

公开(公告)号：US20080042068A1

公开(公告)日：2008-02-21

申请号：US11896447

申请日：2007-08-31

申请人： Hisashi Nishinaga ,  Ikuo Hikima ,  Mitsunori Toyoda ,  Masahiro Nakagawa ,  Tsuneyuki Hagiwara ,  Yasushi Mizuno ,  Naonori Kita ,  Osamu Tanitsu ,  Nozomu Emura

发明人： Hisashi Nishinaga ,  Ikuo Hikima ,  Mitsunori Toyoda ,  Masahiro Nakagawa ,  Tsuneyuki Hagiwara ,  Yasushi Mizuno ,  Naonori Kita ,  Osamu Tanitsu ,  Nozomu Emura

IPC分类号： G01T1/24

CPC分类号： G03F7/7015 ,  G03F7/70058 ,  G03F7/70341 ,  G03F7/706 ,  G03F7/7085

摘要： A sensor is used at a substrate level in a lithographic projection apparatus having a projection system with a numeric aperture that is greater than 1 and is configured to project a patterned radiation beam onto a target portion of a substrate The sensor includes a radiation-detector; a transmissive plate having a front surface and a back surface, the transmissive plate being positioned such that radiation projected by the projection system passes into the front surface of the transmissive plate and out of the back surface thereof to the radiation detector; and a luminescent layer provided on the back surface of the transmissive plate, the luminescent layer absorbing the radiation and emitting luminescent radiation of a different wavelength, wherein the back surface is rough.

摘要翻译： 在具有数值孔径大于1的投影系统的光刻投影设备中使用传感器，并且被配置为将图案化的辐射束投影到基板的目标部分上。传感器包括辐射检测器; 具有前表面和后表面的透射板，所述透射板被定位成使得由所述投影系统投影的辐射进入所述透射板的前表面并且从其背表面延伸到所述辐射探测器; 以及设置在所述透射板的背面上的发光层，所述发光层吸收所述辐射并发射不同波长的发光辐射，其中所述背面粗糙。

公开(公告)号：US06942705B2

公开(公告)日：2005-09-13

申请号：US10392875

申请日：2003-03-21

申请人： Kazuo Inoue ,  Misa Mishna ,  Masahiro Nakagawa

发明人： Kazuo Inoue ,  Misa Mishna ,  Masahiro Nakagawa

IPC分类号： D06P1/16 ,  D06P1/651 ,  D06P1/92 ,  D06P3/00 ,  D06P3/54 ,  D06P3/79

CPC分类号： D06P3/794 ,  D06P1/16 ,  D06P1/6515 ,  D06P1/926 ,  D06P3/004 ,  D06P3/54

摘要： The invention provides a method of effectively dyeing a thermoplastic resin plastic lens in any desired color tone and density as well as a colored plastic lens made by the method. The method involves dipping a thermoplastic resin plastic lens in a dyeing liquid containing one or more disperse dyes and one or more monocyclic monoterpenes.

摘要翻译： 本发明提供一种以任何所需色调和密度有效地染色热塑性树脂塑料透镜的方法以及通过该方法制成的彩色塑料透镜。 该方法包括将热塑性树脂塑料透镜浸入含有一种或多种分散染料和一种或多种单环单萜的染色液体中。

公开(公告)号：US5680200A

公开(公告)日：1997-10-21

申请号：US651098

申请日：1996-09-05

申请人： Ayako Sugaya ,  Masahiro Nakagawa ,  Tadashi Nagayama

发明人： Ayako Sugaya ,  Masahiro Nakagawa ,  Tadashi Nagayama

IPC分类号： G03F7/20 ,  G03F9/00 ,  G03B27/42 ,  G03B27/58

CPC分类号： G03F7/706 ,  G03F7/70241 ,  G03F7/70633 ,  G03F7/70641 ,  G03F9/70

摘要： The present invention relates to inspection apparatus and method in which, based on images under a plurality of focus conditions formed by way of an optical system to be inspected, namely, using images under a plurality of defocal conditions, tendency in positional change or change of asymmetry between the images is calculated so as to specify at least one of aberration condition and optical adjustment condition of the optical system to be inspected as well as to exposure apparatuses and overlay accuracy measurement apparatuses provided with the inspection apparatus. In addition, the present invention relates to an image-forming optical system suitable to an alignment apparatus which is applicable to the exposure apparatuses. This image-forming optical system comprises a correction optical system for intentionally generating asymmetric aberration or symmetric aberration in the image-forming optical system and a decentering mechanism for decentering the correction optical system to cancel asymmetric aberration or symmetric aberration in the image-forming optical system.

摘要翻译： 本发明涉及一种检查装置和方法，其中基于通过待检查的光学系统形成的多个聚焦条件下的图像，即，使用多个放置条件下的图像，位置变化或变化的趋势 计算图像之间的不对称性，以便指定要检查的光学系统的像差条件和光学调节条件以及设置有检查装置的曝光装置和重叠精度测量装置中的至少一个。 此外，本发明涉及适用于可应用于曝光装置的对准装置的图像形成光学系统。 该图像形成光学系统包括用于在图像形成光学系统中有意产生不对称像差或对称像差的校正光学系统和用于使校正光学系统偏心以消除图像形成光学系统中的非对称像差或对称像差的偏心机构 。