公开(公告)号：US09073169B2

公开(公告)日：2015-07-07

申请号：US13223159

申请日：2011-08-31

申请人： Kun Xu ,  Ingemar Carlsson ,  Feng Q. Liu ,  David Maxwell Gage ,  You Wang ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Yuchun Wang ,  Pierre Fontarensky ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

发明人： Kun Xu ,  Ingemar Carlsson ,  Feng Q. Liu ,  David Maxwell Gage ,  You Wang ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Yuchun Wang ,  Pierre Fontarensky ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

IPC分类号： G06F19/00 ,  H01L21/00 ,  B24B49/00 ,  B24B37/005 ,  B24B37/04 ,  B24B37/10 ,  B24B37/30 ,  B24B49/12 ,  G01B11/06

CPC分类号： B24B37/005 ,  B24B37/042 ,  B24B37/107 ,  B24B37/30 ,  B24B49/12 ,  G01B11/0683

摘要： A method of controlling polishing includes polishing a first substrate having an overlying layer on an underlying layer or layer structure. During polishing, the substrate is monitored with an in-situ monitoring system to generate a sequence of measurements. The measurements are sorted into groups, each group associated with a different zone of a plurality of zones on the substrate. For each zone, a time at which the overlying layer is cleared is determined based on the measurements from the associated group. At least one second adjusted polishing pressure for at least zone is calculated based on a pressure applied in the at least one zone during polishing the substrate, the time for the at least one zone, and the time for another zone. A second substrate is polished using the at least one adjusted polishing pressure.

摘要翻译： 控制抛光的方法包括在下层或层结构上抛光具有上层的第一衬底。 在抛光期间，用原位监测系统监测基底以产生测量序列。 测量被分组成组，每个组与衬底上的多个区域的不同区域相关联。 对于每个区域，基于来自关联组的测量来确定覆盖层被清除的时间。 基于在抛光衬底期间在至少一个区域中施加的压力，至少一个区域的时间和另一个区域的时间来计算至少一个至少一个区域的调整后的第二抛光压力。 使用至少一个调整的抛光压力来抛光第二基底。

公开(公告)号：US20120064801A1

公开(公告)日：2012-03-15

申请号：US13223159

申请日：2011-08-31

申请人： Kun Xu ,  Ingemar Carlsson ,  Feng Q. Liu ,  David Maxwell Gage ,  You Wang ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Yuchun Wang ,  Pierre Fontarensky ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

发明人： Kun Xu ,  Ingemar Carlsson ,  Feng Q. Liu ,  David Maxwell Gage ,  You Wang ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Yuchun Wang ,  Pierre Fontarensky ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

IPC分类号： B24B49/00

CPC分类号： B24B37/005 ,  B24B37/042 ,  B24B37/107 ,  B24B37/30 ,  B24B49/12 ,  G01B11/0683

摘要： A method of controlling polishing includes polishing a first substrate having an overlying layer on an underlying layer or layer structure. During polishing, the substrate is monitored with an in-situ monitoring system to generate a sequence of measurements. The measurements are sorted into groups, each group associated with a different zone of a plurality of zones on the substrate. For each zone, a time at which the overlying layer is cleared is determined based on the measurements from the associated group. At least one second adjusted polishing pressure for at least zone is calculated based on a pressure applied in the at least one zone during polishing the substrate, the time for the at least one zone, and the time for another zone. A second substrate is polished using the at least one adjusted polishing pressure.

摘要翻译： 控制抛光的方法包括在下层或层结构上抛光具有上层的第一衬底。 在抛光期间，用原位监测系统监测基底以产生测量序列。 测量被分组成组，每个组与衬底上的多个区域的不同区域相关联。 对于每个区域，基于来自关联组的测量来确定覆盖层被清除的时间。 基于在抛光衬底期间在至少一个区域中施加的压力，至少一个区域的时间和另一个区域的时间来计算至少一个至少一个区域的调整后的第二抛光压力。 使用至少一个调整的抛光压力来抛光第二基底。

公开(公告)号：US20130224890A1

公开(公告)日：2013-08-29

申请号：US13774843

申请日：2013-02-22

申请人： Kun Xu ,  Ingemar Carlsson ,  Tzu-Yu Liu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

发明人： Kun Xu ,  Ingemar Carlsson ,  Tzu-Yu Liu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

IPC分类号： H01L21/66

CPC分类号： H01L22/26 ,  B24B37/005 ,  B24B37/04 ,  B24B49/12 ,  H01L22/12

摘要： A method of controlling polishing includes storing a desired ratio representing a ratio for a clearance time of a first zone of a substrate to a clearance time of a second zone of the substrate. During polishing of a first substrate, an overlying layer is monitored, a sequence of measurements is generated, and the measurements are sorted a first group associated with the first zone of the substrate and a second group associated with the second zone on the substrate. A first time and a second time at which the overlying layer is cleared is determined based on the measurements from the first group and the second group, respectively. At least one adjusted polishing pressure is calculated for the first zone based on a first pressure applied in the first zone during polishing the first substrate, the first time, the second time, and the desired ratio.

摘要翻译： 控制抛光的方法包括将表示基材的第一区域的间隙时间的比率与基材的第二区域的间隙时间的所需比率进行存储。 在第一衬底的抛光期间，监测上覆层，产生一系列测量，并且对与衬底的第一区域相关联的第一组和与衬底上的第二区域相关联的第二组对第一组进行测量。 基于来自第一组和第二组的测量，分别确定覆盖层被清除的第一次和第二次。 基于在抛光第一基板期间第一区域中施加的第一压力，第一时间，第二时间和期望比率，针对第一区域计算至少一个调整的抛光压力。

公开(公告)号：US20120276662A1

公开(公告)日：2012-11-01

申请号：US13095819

申请日：2011-04-27

申请人： Hassan G. Iravani ,  Kun Xu ,  Boguslaw A. Swedek ,  Ingemar Carlsson ,  Shih-Haur Shen ,  Wen-Chiang Tu ,  David Maxwell Gage

发明人： Hassan G. Iravani ,  Kun Xu ,  Boguslaw A. Swedek ,  Ingemar Carlsson ,  Shih-Haur Shen ,  Wen-Chiang Tu ,  David Maxwell Gage

IPC分类号： H01L21/66

CPC分类号： H01L22/26 ,  B24B37/013 ,  B24B49/105 ,  H01L22/14 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of chemical mechanical polishing a substrate includes polishing a plurality of discrete separated metal features of a layer on the substrate at a polishing station, using an eddy current monitoring system to monitor thickness of the metal features in the layer, and controlling pressures applied by a carrier head to the substrate during polishing of the layer at the polishing station based on thickness measurements of the metal features from the eddy current monitoring system to reduce differences between an expected thickness profile of the metal feature and a target profile.

摘要翻译： 用于化学机械研磨衬底的方法包括在抛光工位上使用涡流监测系统来研磨衬底上的层的多个离散分离的金属特征，以监测该层中的金属特征的厚度，以及控制由 基于来自涡流监视系统的金属特征的厚度测量，在抛光台处抛光层期间的载体头到达基板，以减少金属特征的预期厚度分布与目标轮廓之间的差异。

公开(公告)号：US20120276817A1

公开(公告)日：2012-11-01

申请号：US13095822

申请日：2011-04-27

申请人： Hassan G. Iravani ,  Kun Xu ,  Boguslaw A. Swedek ,  Ingemar Carlsson ,  Shih-Haur Shen ,  Wen-Chiang Tu ,  David Maxwell Gage ,  James C. Wang

发明人： Hassan G. Iravani ,  Kun Xu ,  Boguslaw A. Swedek ,  Ingemar Carlsson ,  Shih-Haur Shen ,  Wen-Chiang Tu ,  David Maxwell Gage ,  James C. Wang

IPC分类号： B24B1/00

CPC分类号： B24B37/00 ,  B24B49/105

摘要： A method of chemical mechanical polishing a substrate includes polishing a metal layer on the substrate at a polishing station, monitoring thickness of the metal layer during polishing at the polishing station with an eddy current monitoring system, and halting polishing when the eddy current monitoring system indicates that residue of the metal layer is removed from an underlying layer and a top surface of the underlying layer is exposed.

摘要翻译： 对基板进行化学机械抛光的方法包括：在抛光台处对基板上的金属层进行抛光，用涡流监视系统在抛光台上研磨抛光期间监测金属层的厚度，并且当涡流监视系统指示时停止抛光 金属层的残留物从下层移除，底层的顶表面被暴露。

公开(公告)号：US20110294400A1

公开(公告)日：2011-12-01

申请号：US13193011

申请日：2011-07-28

申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

IPC分类号： B24B51/00

CPC分类号： G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

公开(公告)号：US07746485B2

公开(公告)日：2010-06-29

申请号：US12253160

申请日：2008-10-16

申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

IPC分类号： G01B11/28

CPC分类号： G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

公开(公告)号：US07840375B2

公开(公告)日：2010-11-23

申请号：US12059435

申请日：2008-03-31

申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jeffrey Drue David ,  Jun Qian ,  Sidney P. Huey ,  Ingemar Carlsson ,  Lakshmanan Karuppiah ,  Harry Q. Lee

发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jeffrey Drue David ,  Jun Qian ,  Sidney P. Huey ,  Ingemar Carlsson ,  Lakshmanan Karuppiah ,  Harry Q. Lee

IPC分类号： G01B5/00 ,  G06F19/00

CPC分类号： G01N21/31 ,  G01N21/253 ,  H01L21/67161 ,  H01L21/67207 ,  H01L21/67253 ,  H01L21/67766

摘要： A method of generating a library from a reference substrate for use in processing product wafers is described. The method includes measuring substrate characteristics at a plurality of well-defined points of a reference substrate, measuring spectra at plurality of measurement points of the reference substrate, there being more measurement points than well-defined points, and associating measured spectra with measured substrate characteristics.

摘要翻译： 描述了从用于处理产品晶片的参考基板产生库的方法。 该方法包括在参考基板的多个明确定义的点处测量衬底特性，测量参考衬底的多个测量点处的光谱，存在比明确定义的点多的测量点，以及将测量的光谱与测量的衬底特性相关联 。

公开(公告)号：US20090033942A1

公开(公告)日：2009-02-05

申请号：US12253160

申请日：2008-10-16

申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

IPC分类号： G01N21/55 ,  G01B11/02

CPC分类号： G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

公开(公告)号：US20080239308A1

公开(公告)日：2008-10-02

申请号：US12059464

申请日：2008-03-31

申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jeffrey Drue David ,  Jun Qian ,  Sidney P. Huey ,  Ingemar Carlsson ,  Lakshmanan Karuppiah ,  Harry Q. Lee

发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jeffrey Drue David ,  Jun Qian ,  Sidney P. Huey ,  Ingemar Carlsson ,  Lakshmanan Karuppiah ,  Harry Q. Lee

IPC分类号： G01J3/40

CPC分类号： G01N21/31 ,  G01N21/253 ,  H01L21/67161 ,  H01L21/67207 ,  H01L21/67253 ,  H01L21/67766

摘要： A substrate processing system includes a processing module to process a substrate, a factory interface module configured to accommodate at least one cassette for holding the substrate, a spectrographic monitoring system positioned in or adjoining the factory interface module, and a substrate handler to transfer the substrate between the at least one cassette, the spectrographic monitoring system and the processing module.

摘要翻译： 衬底处理系统包括处理衬底的处理模块，被配置为容纳用于保持衬底的至少一个盒的工厂接口模块，位于工厂接口模块中或邻接工厂接口模块的光谱监测系统，以及衬底处理器，用于传送衬底 在所述至少一个盒，所述光谱监视系统和所述处理模块之间。