Abstract:
A sealing sheet is provided which is used for sealing of a semiconductor chip embedded in a substrate or a semiconductor chip on a pressure sensitive adhesive sheet in a method for producing a semiconductor device. The method includes a treatment step using an alkaline solution. The sealing sheet includes at least an adhesive layer having curability. The adhesive layer is formed of an adhesive composition that contains a thermoset resin, a thermoplastic resin, and an inorganic filler. The inorganic filler is surface-treated with a surface treatment agent having a minimum coverage area of 550 m2/g or more and 1,500 m2/g or less. The sealing sheet is less likely to cause the inorganic filler to escape from a cured layer 11′.
Abstract:
Provided is an antifouling sheet having an antifouling layer formed of an antifouling layer-forming composition containing a specific tetrafunctional silane compound (A) and a specific trifunctional silane compound (B) wherein the content of the component (B) is 8 to 90 mol % relative to 100 mol % of the component (A), and the antifouling layer is a layer formed by drying and curing a coating film formed of the antifouling layer-forming composition, in an ammonia atmosphere. Also provided is a method for producing the antifouling sheet. The antifouling sheet is provided with an antifouling layer having good surface state and curability, has a large slip acceleration for water droppings, thereby having excellent water repellency that makes water droplets slip off instantly, and has excellent interlayer adhesiveness.
Abstract:
A sealing sheet is provided which is used for sealing of a semiconductor chip embedded in a substrate or a semiconductor chip on a pressure sensitive adhesive sheet in a method of manufacturing a semiconductor device. The method includes a treatment step using an alkaline solution. The sealing sheet includes at least an adhesive layer having curability. The adhesive layer is formed of an adhesive composition that contains a thermoset resin, a thermoplastic resin, and an inorganic filler. The inorganic filler is surface-treated with a surface treatment agent having a minimum coverage area of less than 550 m2/g. With the sealing sheet, blisters in plating are less likely to occur.
Abstract:
An adhesive composition contains an acrylic copolymer and an adhesive aid, in which the acrylic copolymer contains 2-ethylhexyl acrylate as a main monomer, and the adhesive aid contains as a main component a rubber material having a reactive group. An adhesive sheet includes a base material and an adhesive layer containing the adhesive composition.
Abstract:
Provided is an antifouling sheet having an interlayer (X) containing a (poly)silazane compound and having an antifouling layer (Y) layered on the surface of the interlayer (X), wherein the layer (Y) is formed of an antifouling layer-forming composition containing a specific tetrafunctional silane compound (A) and a specific trifunctional silane compound (B), the content of the component (B) in the antifouling layer-forming composition is 8 to 90 mol % relative to 100 mol % of the component (A). The antifouling sheet is provided with an antifouling layer having good surface state and curability, has a large slip acceleration for water droplets, thereby having excellent water repellency that makes water droplets slip off instantly, and has excellent interlayer adhesiveness.
Abstract:
Provided is an antifouling composition including a tetrafunctional silane-based compound (A) having a specified structure, a trifunctional silane-based compound having a specified structure, and at least one metal catalyst (C) selected from the group consisting of a titanium-based catalyst, an aluminum-based catalyst, a tin-based catalyst, and a zinc-based catalyst, the antifouling composition satisfying the following relational expression (1). 1.5≦y≦2x+1 Expression (1): In the expression, x indicates the carbon number of an alkyl group that is selected for R2 in the formula (b) representing the silane-based compound (B) and indicates a number of 4 to 22; and y indicates a blending amount ratio (A)/(B) in a molar ratio of the silane-based compound (A) to the silane-based compound (B).
Abstract:
An electrically peelable pressure sensitive adhesive composition, which contains an acrylic polymer (A), a (poly)alkylene polyol (B) having a number average molecular weight of no greater than 2000, and an ammonium salt (C), has a high adhesiveness before voltage application, but the adhesiveness can decrease effectively by voltage application for a short time.
Abstract:
An electrically peelable pressure sensitive adhesive composition consists of an emulsion type acrylic pressure sensitive adhesive (A) comprising an acrylic polymer (A1) obtained by emulsion polymerization in the presence of a surfactant using a monomer mixture comprising an alkyl(meth)acrylate, and a (poly)alkylene polyol (B) having a number average molecular weight of 2000 or less, wherein a content of the component (B) based on 100 parts by mass of active ingredient of the component (A) is 3.5 parts by mass or more. In the electrically peelable pressure sensitive adhesive composition, the adhesiveness before voltage application is high, but the adhesiveness can decrease effectively by voltage application for a short time.