公开(公告)号：US3779842A

公开(公告)日：1973-12-18

申请号：US3779842D

申请日：1972-04-21

Applicant: MACDERMID INC

Inventor： GRUNWALD J ,  SLOMINSKI L ,  LANDAU A ,  SHAH D

IPC: C23F1/18 ,  C23F1/34 ,  C23F1/00

CPC classification number: C23F1/18 ,  C23F1/34

Abstract: A method of and composition for dissolving metallic copper and copper rich alloys are disclosed, wherein there is employed a peroxydiphosphate compound, preferably with an adjuvant copper acceptor or solubilizing agent, to provide a stable etchant system which operates well in either acid or alkaline medium.

Abstract translation: 公开了一种用于溶解金属铜和富铜合金的方法和组合物，其中使用过氧化二磷酸盐化合物，优选使用辅助铜受体或增溶剂，以提供在酸性或碱性介质中良好运行的稳定的蚀刻剂体系。

公开(公告)号：US3854973A

公开(公告)日：1974-12-17

申请号：US28095672

申请日：1972-08-16

Applicant: MACDERMID INC

Inventor： GRUNWALD J ,  INNES W ,  MERSEREAU M ,  RHODENIZER H

IPC: C23C18/16 ,  C23C18/20 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  C23C3/00

CPC classification number: H05K3/381 ,  C23C18/1605 ,  C23C18/2086 ,  H05K3/062 ,  H05K3/108 ,  H05K3/181 ,  H05K2201/0344 ,  H05K2203/0783 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31957

Abstract: Substrates are disclosed for use in forming printed circuit boards by the additive process, in which the surface of the substrate is contacted with a particular class of solvents, activated for electroless deposition of the metal thereon, and at one or more points in the process the board is heated or baked.

Abstract translation: 公开了用于通过添加方法形成印刷电路板的基板，其中基板的表面与特定类别的溶剂接触，用于在其上无电沉积金属，并且在该过程的一个或多个点处 板被加热或烘烤。

公开(公告)号：US3798096A

公开(公告)日：1974-03-19

申请号：US3798096D

申请日：1971-11-09

Applicant: MACDERMID INC

Inventor： GRUNWALD J ,  LOMBARDO M ,  D OTTAVIO E ,  RHODENIZER H

IPC: B32B15/08 ,  C08J7/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/18 ,  H05K3/38 ,  B32B31/12 ,  C09J5/02

CPC classification number: H05K3/184 ,  B32B15/08 ,  H05K1/0366 ,  H05K1/09 ,  H05K3/381 ,  H05K3/385 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2203/0315 ,  H05K2203/0716 ,  H05K2203/1105 ,  H05K2203/1152 ,  H05K2203/1407 ,  Y10T156/1153 ,  Y10T428/31692

Abstract: PLASTIC PARTS ARE FORMED AGAINST AN ANODICALLY TREATED ALUMINUM SURFACE BY MOLDING, LAMINATING ETC., WHEREBY THE SURFACE OF THE FORMED PART AFTER REMOVAL OF OR SEPARATION FROM THE ALUMINUM HAS A HIGH ENERGY LEVEL AND IS RECEPTIVE TO ADHERENT COATING OF PAINT OR METAL PLATE. IN PARTICULAR, LAMINATES OF A THERMOPLASTIC RESIN AND A SACRIFICAL CLADDING OF ALUMINUM FOIL ARE PREPARED WHICH, AFTER SUBSEQUENT STRIPPING OF THE SACRIFICAL METAL CLADDING, EXHIBIT UNIQUE SURFACE PROPERTIES ENHANCING THE BONDING THERETO OF PAINTS, INKS AND PLATED METAL DEPOSITS.

公开(公告)号：US3716392A

公开(公告)日：1973-02-13

申请号：US3716392D

申请日：1970-05-11

Applicant: MACDERMID INC

Inventor： GRUNWALD J ,  D OTTAVIO E

IPC: C08J7/00 ,  C23C18/20 ,  B01J13/00 ,  B44D

CPC classification number: C23C18/30 ,  C23C18/2033 ,  C23C18/208 ,  C23C18/285

Abstract: A method of and composition for promoting adhesion between plated metal and a plastic substrate, in which the active agent is provided in finely divided dispersed or colloidal form in an aqueous emulsion. The active agents are any of a group of low molecular weight organic unsaturated compounds of the fatty acid type, and more especially of the group of naturally occurring products such as linseed, tall, tung and castor oils, turpentine and similar wood rosins. These, when dispersed in water to provide stable emulsions, are used as a pretreatment bath for plastic substrates, prior to plating of the substrate, in order to promote the formation of a stronger bond between the metal plate and substrate.

Abstract translation: 一种用于促进电镀金属和塑料基材之间的粘附的方法和组合物，其中活性剂以细分散或胶体形式提供在水性乳液中。 活性剂是脂肪酸类的一组低分子量有机不饱和化合物中的任何一种，更特别是一些天然存在的产物如亚麻子，高，桐和蓖麻油，松节油和类似的木松香中的任何一种。 这些在分散在水中以提供稳定的乳液时，在电镀基片之前用作塑料基材的预处理槽，以促进在金属板和基底之间形成更强的结合。

公开(公告)号：US3819497A

公开(公告)日：1974-06-25

申请号：US27314572

申请日：1972-07-19

Applicant: MACDERMID INC

Inventor： GRUNWALD J ,  RHODENIZER H ,  SLOMINSKI L

IPC: C23C18/18 ,  H05K3/06 ,  H05K3/10 ,  H05K3/42 ,  C23B5/48 ,  C23B5/52

CPC classification number: H05K3/108 ,  C23C18/1653 ,  C23C18/1844 ,  H05K3/062 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2203/0392 ,  H05K2203/072 ,  H05K2203/1105

Abstract: Copper surfaces are plated in a process comprising etching, activating, electroless and electrolytic copper deposition, and heating or baking at a temperature of about 150* to about 450*F. for about 10 min. to about 2 hours or more. Substantial improvement in the adhesion between the copper surface and the metal deposited by electroless and electrolytic plating is achieved. Processes for plating on copper-clad plastic substrates and for the manufacture of printed circuit boards are also set forth.

Abstract translation: 铜表面以包括蚀刻，活化，无电解和电解铜沉积以及在约150°至约450°F的温度下加热或烘烤约10分钟的方法进行电镀。 至约2小时以上。 实现铜表面和通过化学镀和电解电镀沉积的金属之间的粘合力的显着改善。 还阐述了在包铜塑料基板上的电镀工艺和用于制造印刷电路板的工艺。

公开(公告)号：US3793106A

公开(公告)日：1974-02-19

申请号：US3793106D

申请日：1971-11-09

Applicant: MACDERMID INC

Inventor： RHODENIZER H ,  GRUNWALD J ,  LOMBARDO M ,  D OTTAVIO E

IPC: B32B15/08 ,  C08J7/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/18 ,  H05K3/38 ,  B32B31/24 ,  C09J5/02 ,  C23B9/02

CPC classification number: B32B15/08 ,  C23C18/1653 ,  C23C18/285 ,  C23C18/30 ,  H05K1/0366 ,  H05K1/09 ,  H05K3/184 ,  H05K3/381 ,  H05K3/385 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2203/0315 ,  H05K2203/0716 ,  H05K2203/1105 ,  H05K2203/1152 ,  H05K2203/1407 ,  Y10T428/2495 ,  Y10T428/31678

Abstract: Plastic parts are formed against an anodically treated aluminum surface by molding, laminating, etc., whereby the surface of the formed part, after chemically stripping or dissolving away the aluminum, has a high energy level and is receptive to adherent coatings of metal plate. In particular, laminates are prepared which are useful in producing substrates for the additive formation of printed circuit boards after stripping the aluminum chemically from the substrate, and then catalyzing the stripped surface and depositing a conductor metal plate thereon by electroless and or electrolytic deposition.

Abstract translation: 通过模制，层压等形成塑料部件抵抗阳极处理的铝表面，由此在化学剥离或溶解掉铝之后，成形部件的表面具有高能级并且接受金属板的粘附涂层。 特别地，制备层压制品，其可用于生产用于在从基材上化学地剥离铝之后的印刷电路板的添加剂形成用基材，然后催化剥离的表面并通过无电沉积或电解沉积在其上沉积导体金属板。

公开(公告)号：US3784440A

公开(公告)日：1974-01-08

申请号：US3784440D

申请日：1971-11-09

Applicant: MACDERMID INC

Inventor： GRUNWALD J ,  D OTTAVIO E ,  RHODENIZER H ,  LOMBARDO M

IPC: B32B15/08 ,  C08J7/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/18 ,  H05K3/38 ,  B32B15/20 ,  H05K1/00

CPC classification number: H05K3/381 ,  B32B15/08 ,  H05K1/0366 ,  H05K1/09 ,  H05K3/184 ,  H05K3/385 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2203/0315 ,  H05K2203/0716 ,  H05K2203/1105 ,  H05K2203/1152 ,  H05K2203/1407 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31688 ,  Y10T428/31692 ,  Y10T428/31696 ,  Y10T428/31699 ,  Y10T428/31707

Abstract: Plastic parts are formed against an anodically treated aluminum surface by molding, laminating, etc., to produce laminates useful, after removal of or separation from the aluminum, in providing a plastic surface of a high energy level promoting greater adhesion of deposited metal conductor circuits in the additive process of making printed circuit boards.

Abstract translation: 塑料部件通过模制，层压等形成为抵抗阳极处理的铝表面，以产生在从铝中除去或分离之后可用的层压板，以提供高能级的塑料表面，促进沉积的金属导体电路的更大粘合力 在印刷电路板的添加过程中。