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公开(公告)号：US10151888B2
公开(公告)日：2018-12-11
申请号：US15472703
申请日：2017-03-29
Applicant: Mellanox Technologies, LTD.
Inventor： Pierre Avner Badehi , Yaniv Kazav , Soren Balslev , Anna Sandomirsky
Abstract: Methods and associated apparatuses are described that provide an optical waveguide structure configured for use within an optoelectronic connector. The optical waveguide structure includes a base member having a first surface defining a plurality of trenches including an optical transmission medium and one or more channels including an adhesive material. The optical waveguide structure includes a lid member having a first surface, where the first surface of the lid member is disposed against the first surface of the base member to form the optical waveguide structure. The one or more channels having the adhesive material serve to secure the lid member to the base member, and the plurality of trenches having an optical transmission medium allow optical signals to pass therethrough.
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公开(公告)号：US20230170670A1
公开(公告)日：2023-06-01
申请号：US17540440
申请日：2021-12-02
Applicant: MELLANOX TECHNOLOGIES, LTD. , BAR-ILAN UNIVERSITY
Inventor： Dimitrios Kalavrouziotis , Paraskevas Bakopoulos , Elad Mentovich , Anna Sandomirsky , Boaz Atias , Doron Naveh , Eilam Zigi Ben Smolinsky , Adi Levi , Rana Darweesh
CPC classification number: H01S5/1014 , H01S5/026 , H01S5/068
Abstract: A light emitting device, a transmitter, and a silicon photonics chip, among other things, are disclosed. An illustrative light emitting device is disclosed to include a silicon substrate, a waveguide disposed on or integrated in the silicon substrate, where the waveguide includes a wide waveguide section at a first end and a narrow waveguide section at a second end, a first metal pad disposed over the wide waveguide section and at least partially across the first end of the waveguide, and a second metal pad disposed over the wide waveguide section, distanced away from the first metal pad. Electrical current passing between the first metal pad and the second metal pad may cause light to be produced in the wide waveguide section and the light produced in the wide waveguide section is at least partially reflected by the first metal pad and directed to the narrow waveguide section for transmission.
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公开(公告)号：US20180284372A1
公开(公告)日：2018-10-04
申请号：US15472703
申请日：2017-03-29
Applicant: Mellanox Technologies, LTD.
Inventor： Pierre Avner Badehi , Yaniv Katzav , Soren Balslev , Anna Sandomirsky
IPC: G02B6/42
CPC classification number: G02B6/3861 , G02B6/3636 , G02B6/3652 , G02B6/3882 , G02B6/3885 , G02B6/4204 , G02B6/4239
Abstract: Methods and associated apparatuses are described that provide an optical waveguide structure configured for use within an optoelectronic connector. The optical waveguide structure includes a base member having a first surface defining a plurality of trenches including an optical transmission medium and one or more channels including an adhesive material. The optical waveguide structure includes a lid member having a first surface, where the first surface of the lid member is disposed against the first surface of the base member to form the optical waveguide structure. The one or more channels having the adhesive material serve to secure the lid member to the base member, and the plurality of trenches having an optical transmission medium allow optical signals to pass therethrough.
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公开(公告)号：US12255439B2
公开(公告)日：2025-03-18
申请号：US17540440
申请日：2021-12-02
Applicant: MELLANOX TECHNOLOGIES, LTD. , BAR-ILAN UNIVERSITY
Inventor： Dimitrios Kalavrouziotis , Paraskevas Bakopoulos , Elad Mentovich , Anna Sandomirsky , Boaz Atias , Doron Naveh , Eilam Zigi Ben Smolinsky , Adi Levi , Rana Darweesh
Abstract: A light emitting device, a transmitter, and a silicon photonics chip, among other things, are disclosed. An illustrative light emitting device is disclosed to include a silicon substrate, a waveguide disposed on or integrated in the silicon substrate, where the waveguide includes a wide waveguide section at a first end and a narrow waveguide section at a second end, a first metal pad disposed over the wide waveguide section and at least partially across the first end of the waveguide, and a second metal pad disposed over the wide waveguide section, distanced away from the first metal pad. Electrical current passing between the first metal pad and the second metal pad may cause light to be produced in the wide waveguide section and the light produced in the wide waveguide section is at least partially reflected by the first metal pad and directed to the narrow waveguide section for transmission.
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5.发明授权公开(公告)号：US10012809B2
公开(公告)日：2018-07-03
申请号：US15187109
申请日：2016-06-20
Applicant: Mellanox Technologies, Ltd.
Inventor： Elad Mentovich , Itshak Kalifa , Sylvie Rockman , Pierre Avner Badehi , Anna Sandomirsky , Evelyn Landman
CPC classification number: G02B6/4245 , G02B6/12004 , G02B6/30 , G02B6/4206 , G02B6/428 , G02B6/4284
Abstract: An apparatus and method of assembly are described that provide an improved printed circuit board (PCB) assembly for an electro-optical interface, where more accurate positioning and alignment of electro-optical components can be achieved in an active part of the PCB assembly that is used for the electro-optical interface to meet tighter tolerances in an easier and more cost efficient manner. In particular, a photonic integrated circuit (PIC) is received in a cavity defined in a PCB that includes conductive elements for transmitting electrical signals. An optoelectronic transducer is connected to the PIC to convert between the optical signals and the corresponding electrical signals, and an optical coupler is secured to the optoelectronic transducer and supported by the PIC and/or PCB, where the optical coupler is configured to transmit the optical signals between the optoelectronic transducer and an optical fiber.
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Patent Agency Ranking
公开(公告)号：US20170371114A1
公开(公告)日：2017-12-28
申请号：US15195538
申请日：2016-06-28
Applicant: Mellanox Technologies, Ltd.
Inventor： Elad Mentovich , Itshak Kalifa , Sylvie Rockman , Alon Webman , Amir Prescher , Evelyn Landman , Anna Sandomirsky , Eitan Zahavi , Yaakov Gridish
CPC classification number: G02B6/4243 , G02B6/32 , G02B6/4206 , G02B6/4214 , G02B6/423 , G02B6/4246 , G02B6/43
Abstract: An opto-mechanical coupler and corresponding method are provided. The coupler may include a first end and a second end configured to receive optical fibers and a top surface and bottomed surface defining a through hole extending between the top and bottom surfaces. The coupler may include a reflective surface that redirects the optical signals between a first direction and a second direction substantially perpendicular to the first direction. The coupler may position one or more optical fibers along a second direction such that an optical signal from the plurality of optoelectronic transceivers is directed into one or more optical fibers or an optical signal from the one or more optical fibers is directed into a plurality of the optoelectronic transceivers, with the coupler accommodating different diameters of optical fiber including POF, SMF, and/or MMF fiber.
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公开(公告)号：US20240288639A1
公开(公告)日：2024-08-29
申请号：US18119630
申请日：2023-03-09
Applicant: Mellanox Technologies, Ltd.
Inventor： Roy Rudnick , Elad Mentovich , Isabelle Cestier , Ran Hasson Ruso , Dimitrios Kalavrouziotis , Anna Sandomirsky , Vladimir Iakovlev
IPC: G02B6/42
CPC classification number: G02B6/4237 , G02B6/4214 , G02B6/4243 , G02B6/4244
Abstract: Multiple methods are provided for fiber optic welding on a photonic integrated circuit (PIC). An example method includes providing a PIC, forming an attachment surface on the PIC configured to receive an optical fiber. The method further includes disposing at least a portion of the optical fiber on the attachment surface. The method may then include welding the optical fiber to secure the optical fiber with respect to the attachment surface. The attachment surface may be comprised of substantially the same material as an outer portion of the optical fiber and may result in a homogenous weld securing and connecting the optical fiber to the PIC.
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公开(公告)号：US11789222B2
公开(公告)日：2023-10-17
申请号：US17341645
申请日：2021-06-08
Applicant: Mellanox Technologies, Ltd.
Inventor： Dimitrios Kalavrouziotis , Sylvie Rockman , Elad Mentovich , Tamir Sharkaz , Yaakov Gridish , Anna Sandomirsky
CPC classification number: G02B6/4277 , G02B6/4206 , H04B10/501
Abstract: Optical components and associated methods of manufacturing are provided. An example optical component includes a body defined by an optical interposer substrate and a passivation layer applied to the optical interposer substrate. The optical interposer substrate defines a first surface of the body, and the passivation layer defines a second surface of the body opposite the first surface. The passivation layer includes a metallic shielding element configured to prevent interference between the first surface and the second surface. The optical component further includes an opening extending from the second surface to the optical interposer substrate, the opening defining an optical path through the passivation layer. The optical interposer substrate receives an optical signal from an optical transmitter supported by the second surface via the optical path.
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9.发明申请公开(公告)号：US20220061148A1
公开(公告)日：2022-02-24
申请号：US17517693
申请日：2021-11-03
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor： Elad Mentovich , Anna Sandomirsky , Dimitrios Kalavrouziotis
Abstract: A semiconductor device assembly (10) includes a multi-layer printed circuit board (PCB—40), a thermoelectric cooler (TEC—30), a chip (22), and packaged integrated circuitry (IC—26). The multi-layer PCB includes a lateral heat conducting path (60) formed in a recessed area (44) of the PCB. The TEC and the chip are disposed on the PCB, side-by-side to one another over the lateral heat conducting path. The TEC is configured to evacuate heat from the chip via the lateral heat conducting path, and to dissipate the evacuated heat via a first end of a heat sink (33) in thermal contact with the TEC. The packaged IC is disposed on an un-recessed area of the PCB, wherein the packaged IC is configured to dissipate heat via a second end of the heat sink that is in thermal contact with the packaged IC.
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10.发明授权公开(公告)号：US10996401B2
公开(公告)日：2021-05-04
申请号：US16313503
申请日：2016-06-30
Applicant: Mellanox Technologies, Ltd.
Inventor： Elad Mentovich , Itshak Kalifa , Sylvie Rockman , Anna Sandomirsky , Giannis Poulopoulos , Dimitrios Kalavrouziotis , Paraskevas Bakopoulos , Hercules Avramopoulos , Xin Yin , Geert Van Steenberge
Abstract: An optical coupler and method of assembly are described that provide efficient coupling from the photonic integrated circuit (PIC) waveguide layer to external components, such as optical fibers, VCSELs, photodetectors, and gain blocks, among others. The optical coupler includes a PIC that can be supported by a printed circuit board, an optoelectronic transducer supported by the PIC that can convert between optical signals and corresponding electrical signals, and a coupled waveguide assembly. The coupled waveguide assembly includes a low-index waveguide, a high-index waveguide, and a reflective surface that changes a pathway of the optical signals to direct the optical signals from the optoelectronic transducer into the low-index waveguide or from the low-index waveguide into the optoelectronic transducer.
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