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公开(公告)号：US09889310B2
公开(公告)日：2018-02-13
申请号：US14338815
申请日：2014-07-23
Applicant: Medtronic, Inc.
Inventor： Andrew J Ries , Richard P Nelson , Kamal Deep Mothilal
CPC classification number: A61N1/3968 , A61N1/0558 , A61N1/057 , A61N1/372 , A61N1/375 , A61N2001/0582
Abstract: An implantable medical device housing has an outer surface and an inner surface that defines an interior cavity. A wire is coupled to the housing outer surface. The wire wholly defines an open aperture for receiving a fixation member. The wire includes a first wire end, a second wire end, and an annular loop between the first and second ends. A cover extends over at least the first end and the second end of the wire.
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公开(公告)号：US09220902B2
公开(公告)日：2015-12-29
申请号：US14179795
申请日：2014-02-13
Applicant: Medtronic, Inc.
Inventor： Andrew J Ries , Terrence J Snyder , Iryna M Levina , Robert A Munoz , Eric J Wengreen , John E Lovins
CPC classification number: A61N1/362 , A61N1/3754 , A61N1/3758 , A61N1/378 , B23K26/24 , H01M2/0207 , H01M2/1016 , H01M2/1022 , H01M10/425 , Y10T29/49826
Abstract: An implantable medical device includes two conductive enclosures that are attached together, wherein the first enclosure contains electronics, and the second enclosure contains a power source. The second enclosure, all or a portion of which is located outside the first enclosure, includes an inner layer, an outer layer, and a header plate, all of which are configured to provide redundant sealing for the power source. The inner and outer layers, formed by separate metal sheets nested one within the other, are preferably in direct mechanical and electrical contact. The first sheet, which forms the inner layer, approximately conforms to a profile of the power source, located therein, and the second sheet, which forms the outer layer, conforms to a profile of the first sheet. An insulative housing, which contains connector contacts of the device, is directly secured to the first and second conductive enclosures, for example, by mounting brackets.
Abstract translation: 可植入医疗装置包括两个连接在一起的导电外壳，其中第一外壳包含电子元件，第二外壳包含电源。 第二外壳，其全部或一部分位于第一外壳的外部，包括内层，外层和集管板，所有这些外壳均被配置为为电源提供冗余密封。 优选地，内层和外层由彼此嵌套的单独的金属板形成，其中，所述内层和外层优选直接机械和电接触。 形成内层的第一片大致符合位于其中的电源的轮廓，形成外层的第二片符合第一片的轮廓。 包含设备的连接器触点的绝缘壳体例如通过安装支架直接固定到第一和第二导电外壳。
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公开(公告)号：US20170281954A1
公开(公告)日：2017-10-05
申请号：US15140637
申请日：2016-04-28
Applicant: Medtronic, Inc.
Inventor： James D Reinke , Sarah A Audet , Andrew J Ries , Robert W Stadler , John D Wahlstrand , Zhongping Yang
CPC classification number: A61N1/3787 , A61N1/365 , A61N1/37 , A61N1/3756 , H02J50/15
Abstract: An implantable device system for delivering electrical stimulation pulses to a patient's body includes a pulse delivery device having a piezoelectric element that is enclosed by a housing and produces voltage signals delivered to the patient's body in response to receiving ultrasound energy. The pulse delivery device includes a circuit having a rate limiter configured to filter voltage signals produced by the piezoelectric element a rate faster than a maximum stimulation rate.
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公开(公告)号：US09731138B1
公开(公告)日：2017-08-15
申请号：US15141430
申请日：2016-04-28
Applicant: Medtronic, Inc.
Inventor： Robert W Stadler , Zhongping Yang , Sarah A Audet , James K Carney , James D Reinke , Andrew J Ries , John D Wahlstrand
CPC classification number: A61N1/36585 , A61B5/0422 , A61N1/057 , A61N1/36542 , A61N1/37288 , A61N1/3756 , A61N1/3787
Abstract: An implantable medical device system is configured to deliver cardiac pacing by receiving a cardiac electrical signal by sensing circuitry of a first device via a plurality of sensing electrodes, identifying by a control module of the first device a first cardiac event from the cardiac electrical signal, setting a first pacing interval in response to identifying the first cardiac event, controlling a power transmitter of the first device to transmit power upon expiration of the first pacing interval, receiving the transmitted power by a power receiver of a second device; and delivering at least a portion of the received power to a patient's heart via a first pacing electrode pair of the second device coupled to the power receiver.
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公开(公告)号：US09802055B2
公开(公告)日：2017-10-31
申请号：US15140637
申请日：2016-04-28
Applicant: Medtronic, Inc.
Inventor： James D Reinke , Sarah A Audet , Andrew J Ries , Robert W Stadler , John D Wahlstrand , Zhongping Yang
CPC classification number: A61N1/3787 , A61N1/365 , A61N1/37 , A61N1/3756 , H02J50/15
Abstract: An implantable device system for delivering electrical stimulation pulses to a patient's body includes a pulse delivery device having a piezoelectric element that is enclosed by a housing and produces voltage signals delivered to the patient's body in response to receiving ultrasound energy. The pulse delivery device includes a circuit having a rate limiter configured to filter voltage signals produced by the piezoelectric element a rate faster than a maximum stimulation rate.
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Patent Agency Ranking
公开(公告)号：US09362660B2
公开(公告)日：2016-06-07
申请号：US14695035
申请日：2015-04-23
Applicant: Medtronic, Inc.
Inventor： Andrew J Ries , Jeffrey A Swanson , George A Patras
CPC classification number: H01R13/5202 , A61N1/0587 , A61N1/3752 , A61N1/3754 , B29C45/14639 , B29L2031/753 , H01R13/665 , H01R24/58 , H01R2107/00 , H01R2201/12
Abstract: An implantable medical device connector assembly and method of manufacture include a molded, insulative shell having an inner surface forming a connector bore, a circuit member including one or more traces extending through apertures in the connector shell. One or more conductive members, positioned along the connector bore, are electrically coupled to the traces. The sealing members are positioned between the conductive members.
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公开(公告)号：US10772228B2
公开(公告)日：2020-09-08
申请号：US15299941
申请日：2016-10-21
Applicant: Medtronic, Inc.
Inventor： John K Day , Michael J Nidelkoff , Kris A Peterson , Andrew J Ries , David A Ruben , Craig L Wiklund
Abstract: Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.
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公开(公告)号：US09750950B2
公开(公告)日：2017-09-05
申请号：US14844697
申请日：2015-09-03
Applicant: Medtronic, Inc.
Inventor： John D Norton , Andrew J Ries , Randolph E Crutchfield
CPC classification number: A61N1/3975 , A61N1/378 , A61N1/3782 , A61N1/3931 , A61N1/3956 , A61N1/3981
Abstract: Implantable medical device systems of the present disclosure may include a subcutaneous implantable cardioverter defibrillator (SICD) that is powered by a multi-cell power source that is connected to a transformer and power conversion circuitry to charge one or more relatively small, but powerful, high voltage capacitors to provide a relatively high discharge voltage. The SICD includes electrical isolation for the multi-cell power source to protect against cross-charging between the cells during the operational lifetime of the SICD.
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公开(公告)号：US09401562B2
公开(公告)日：2016-07-26
申请号：US14695036
申请日：2015-04-23
Applicant: Medtronic, Inc.
Inventor： Andrew J Ries , Jeffrey A Swanson , George A Patras
IPC: A61N1/00 , H01R13/52 , A61N1/375 , H01R24/58 , A61N1/05 , B29C45/14 , H01R13/66 , H01R107/00 , B29L31/00
CPC classification number: H01R13/5202 , A61N1/0587 , A61N1/3752 , A61N1/3754 , B29C45/14639 , B29L2031/753 , H01R13/665 , H01R24/58 , H01R2107/00 , H01R2201/12
Abstract: An implantable medical device connector assembly and method of manufacture include a molded, insulative shell having an inner surface forming a connector bore, a circuit member including one or more traces extending through apertures in the connector shell. One or more conductive members, positioned along the connector bore, are electrically coupled to the traces. The sealing members are positioned between the conductive members.
Abstract translation: 可植入医疗装置连接器组件及其制造方法包括：模制的绝缘外壳，其具有形成连接器孔的内表面;电路构件，包括延伸穿过连接器外壳中的孔的一个或多个迹线。 沿着连接器孔定位的一个或多个导电构件电耦合到迹线。 密封构件位于导电构件之间。
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10.发明授权公开(公告)号：US08825160B2
公开(公告)日：2014-09-02
申请号：US13777625
申请日：2013-02-26
Applicant: Medtronic, Inc.
Inventor： Angela Rodgers , Andrew J Ries , Kurt J Casby , John D Norton , Mark D Breyen , Dan D Erklouts , Brian J Ross , Timothy T Bomstad , Wayne L Appleseth , Michael E Clarke , Jeffrey L Kehn , Scott J Robinson
CPC classification number: A61N1/05 , A61N1/375 , H01G9/008 , H01G9/08 , H01R2201/12
Abstract: A complex connector and component within an implantable medical device in which the complex connector is positioned within the spacing footprint of the component to optimize packaging within the device.
Abstract translation: 可植入医疗装置内的复杂连接器和部件，其中复合连接器位于部件的间隔覆盖区内，以优化装置内的包装。
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