公开(公告)号：US11961825B2

公开(公告)日：2024-04-16

申请号：US17805818

申请日：2022-06-07

Applicant: Micron Technology, Inc.

Inventor： Aparna U. Limaye ,  Dong Soon Lim ,  Randon K. Richards ,  Owen R. Fay

IPC: H01L23/552 ,  H01L21/66 ,  H01L21/78 ,  H01L23/00 ,  H01L23/64 ,  H01L23/66 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18 ,  H01Q1/22 ,  H01Q1/48

CPC classification number: H01L25/0657 ,  H01L21/78 ,  H01L22/12 ,  H01L23/552 ,  H01L23/645 ,  H01L23/66 ,  H01L24/08 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/18 ,  H01L25/50 ,  H01Q1/2283 ,  H01Q1/48 ,  H01L2223/6677 ,  H01L2224/08145 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2225/06531 ,  H01L2225/06537 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1443 ,  H01L2924/14511 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.

公开(公告)号：US11948921B2

公开(公告)日：2024-04-02

申请号：US17932401

申请日：2022-09-15

Applicant: Micron Technology, Inc.

Inventor： Randon K. Richards ,  Aparna U. Limaye ,  Owen R. Fay ,  Dong Soon Lim

IPC: H01L23/48 ,  H01L21/66 ,  H01L21/78 ,  H01L23/00 ,  H01L23/52 ,  H01L23/552 ,  H01L23/64 ,  H01L23/66 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18 ,  H01L29/40 ,  H01Q1/22 ,  H01Q1/48

CPC classification number: H01L25/0657 ,  H01L21/78 ,  H01L22/12 ,  H01L23/552 ,  H01L23/645 ,  H01L23/66 ,  H01L24/08 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/18 ,  H01L25/50 ,  H01Q1/2283 ,  H01Q1/48 ,  H01L2223/6677 ,  H01L2224/08145 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2225/06531 ,  H01L2225/06537 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1443 ,  H01L2924/14511 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate and the components are connected with conductive material in preformed holes in dielectric material in the bond lines aligned with TSVs of the devices and the exposed conductors of the substrate. Methods of fabrication are also disclosed.

公开(公告)号：US11726869B2

公开(公告)日：2023-08-15

申请号：US16995334

申请日：2020-08-17

Applicant: Micron Technology, Inc.

Inventor： Tomoko Ogura Iwasaki ,  Avani F. Trivedi ,  Jianmin Huang ,  Aparna U. Limaye ,  Tracy D. Evans

IPC: G06F11/10 ,  G06F11/07 ,  G06F11/30 ,  G06F12/02 ,  G06F11/20

CPC classification number: G06F11/1068 ,  G06F11/0772 ,  G06F11/203 ,  G06F11/3037 ,  G06F12/0246 ,  G06F12/0253 ,  G06F2212/7209

Abstract: Systems, apparatuses, and methods related to media management, including “garbage collection,” in memory or storage systems or sub-systems, such as solid state drives, are described. For example, a signaling can be received that indicates a request from a controller to migrate valid data from a first data block to a second data block. For example, the first data block can be a data block of a plurality of memory cells configured as single-level-cell (SLC) memory. The second data block can be configured as multi-level-cell (MLC) memory. The data migration operation can include an error control operation that is performed using the memory component, the error control operation excluding transferring the data to the controller. The data can be migrated from the first data block configured as SLC memory to the second data block configured as MLC memory after the error control operation is performed using the memory component.

公开(公告)号：US11386231B2

公开(公告)日：2022-07-12

申请号：US16939499

申请日：2020-07-27

Applicant: Micron Technology, Inc.

Inventor： Aparna U. Limaye ,  Lindsay Hamilton ,  Carla L. Christensen ,  Cipriana Forgy ,  Brandi M. Jones

IPC: G06F21/00 ,  G06F21/62 ,  G06F21/32 ,  H04W12/61 ,  H04W12/63 ,  H04W12/68

Abstract: Methods and systems for context-based mobile device feature control are provided. One method comprises determining, with a mobile device, one or more contexts corresponding to the mobile device; selecting, from a predetermined set of security protocols, a security protocol corresponding to the determined one or more contexts; and adjusting a permission setting for one or more functional features of the mobile device based upon the selected security protocol. One apparatus comprises one or more features configure to input data, output data, transform data, or a combination thereof; and a controller configured to: determine one or more contexts corresponding to the mobile computing device, to select, from a predetermined set of security protocols, a security protocol corresponding to the determined one or more contexts, and to adjust a permission setting for the one or more functional features based upon the selected security protocol.

公开(公告)号：US20210200885A1

公开(公告)日：2021-07-01

申请号：US16939499

申请日：2020-07-27

Applicant: Micron Technology, Inc.

Inventor： Aparna U. Limaye ,  Lindsay Hamilton ,  Carla L. Christensen ,  Cipriana Forgy ,  Brandi M. Jones

IPC: G06F21/62 ,  H04W12/00 ,  G06F21/32

Abstract: Methods and systems for context-based mobile device feature control are provided. One method comprises determining, with a mobile device, one or more contexts corresponding to the mobile device; selecting, from a predetermined set of security protocols, a security protocol corresponding to the determined one or more contexts; and adjusting a permission setting for one or more functional features of the mobile device based upon the selected security protocol. One apparatus comprises one or more features configure to input data, output data, transform data, or a combination thereof; and a controller configured to: determine one or more contexts corresponding to the mobile computing device, to select, from a predetermined set of security protocols, a security protocol corresponding to the determined one or more contexts, and to adjust a permission setting for the one or more functional features based upon the selected security protocol.

公开(公告)号：US20210118849A1

公开(公告)日：2021-04-22

申请号：US16939650

申请日：2020-07-27

Applicant: Micron Technology, Inc.

Inventor： Aparna U. Limaye ,  Dong Soon Lim ,  Randon K. Richards ,  Owen R. Fay

IPC: H01L25/065 ,  H01L25/18 ,  H01L23/00 ,  H01L23/552 ,  H01L23/64 ,  H01L21/78 ,  H01L21/66 ,  H01L25/00

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.

公开(公告)号：US20210057018A1

公开(公告)日：2021-02-25

申请号：US16947795

申请日：2020-08-17

Applicant: Micron Technology, Inc.

Inventor： Tomoko Ogura Iwasaki ,  Tracy D. Evans ,  Avani F. Trivedi ,  Aparna U. Limaye ,  Jianmin Huang

IPC: G11C11/408 ,  G11C11/4074 ,  G06F12/02

Abstract: Systems and methods for read operations and management are disclosed. More specifically, this disclosure is directed to receiving a first read command directed to a first logical address and receiving, after the first read command, a second read command directed to a second logic address. The method also includes receiving, after the second read command, a third read command directed to a third logical address and determining that the first logical address and the third logical address correspond to a first physical address and a third physical address, respectively. The first physical address and the third physical address can be associated with a first word line of a memory component while the second logical address corresponds to a second physical address associated with a second word line of the memory component. The method includes executing the first read command and the third read command sequentially.

公开(公告)号：US12199068B2

公开(公告)日：2025-01-14

申请号：US17817690

申请日：2022-08-05

Applicant: Micron Technology, Inc.

Inventor： Owen R. Fay ,  Randon K. Richards ,  Aparna U. Limaye ,  Dong Soon Lim ,  Chan H. Yoo ,  Bret K. Street ,  Eiichi Nakano ,  Shijian Luo

IPC: H01L25/065 ,  H01L21/66 ,  H01L21/78 ,  H01L23/00 ,  H01L23/552 ,  H01L23/64 ,  H01L23/66 ,  H01L25/00 ,  H01L25/18 ,  H01Q1/22 ,  H01Q1/48

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate, each microelectronic device comprising an active surface having bond pads operably coupled to conductive traces extending over a dielectric material to via locations beyond at least one side of the stack, and vias extending through the dielectric materials at the via locations and comprising conductive material in contact with at least some of the conductive traces of each of the two or more electronic devices and extending to exposed conductors of the substrate. Methods of fabrication and related electronic systems are also disclosed.

公开(公告)号：US11979979B2

公开(公告)日：2024-05-07

申请号：US17238797

申请日：2021-04-23

Applicant: Micron Technology, Inc.

Inventor： M. Ataul Karim ,  David K. Ovard ,  Aparna U. Limaye ,  Timothy M. Hollis

IPC: H05K1/02 ,  H04B3/32 ,  H04B3/487

CPC classification number: H05K1/0233 ,  H04B3/32 ,  H04B3/487 ,  H05K1/0228

Abstract: Methods, systems, and devices for crosstalk cancellation for signal lines are described. In some examples, a device (e.g., a host device or a memory device) may generate a first signal and may invert the first signal to obtain an inverted first signal. The device may obtain a second signal based on attenuating a first range of frequencies of the inverted first signal and a second range of frequencies of the inverted first signal, where the first range of frequencies is below a first threshold frequency and the second range of frequencies is above a second threshold frequency that is greater than the first threshold frequency. The device may transmit the first signal via a first signal line of a set of signal lines and the second signal line via a second signal line of the set of signal lines.

公开(公告)号：US11880457B2

公开(公告)日：2024-01-23

申请号：US16586097

申请日：2019-09-27

Applicant: Micron Technology, Inc.

Inventor： Aparna U. Limaye ,  Diana C. Majerus ,  Rachael R. Carlson ,  Shea M. Morrison ,  Debra M. Bell

IPC: G06F21/56 ,  G06F3/06

CPC classification number: G06F21/563 ,  G06F3/0622 ,  G06F3/0659 ,  G06F3/0673 ,  G06F21/566 ,  G06F2221/033

Abstract: Apparatuses and methods related to detecting synchronization between multiple devices. The security of a device may be compromised if the device receives commands from unauthorized sources. A state of a device can be affected by the commands the device receives. A different device can determine whether there is synchronicity between device and the different device to determine whether the security of the device may have been compromised.