摘要:
On a surface of a silicon substrate, N.sup.+ type buried layer and N-type epitaxial layer are formed in order, and an isolation layer reaching the silicon substrate from the surface of the N-type epitaxial layer is formed to define a photodiode. In the surface of the photodiode, a rectangular recess is selectively formed toward inside of the N-type epitaxial layer. On the side face of the recess, a silicon oxide layer is formed. In the region surrounded by the silicon oxide layer, a photo absorbing layer and so forth is formed. On the other hand, in an optical waveguide, a LOCOS oxide layer is formed toward inside from the surface of the N-type epitaxial layer. The N-type epitaxial layer is sandwiched between the LOCOS oxide layer and the N.sup.+ type buried layer. The refraction indexes of the LOCOS oxide layer and the N.sup.+ type buried layer are smaller than that of the N-type epitaxial layer. Thus, the N-type epitaxial layer serves as an optical passage to efficiently introduce a light beam into the photo absorbing layer of the photodiode.
摘要:
A method of manufacturing a semiconductor device includes a monocrystalline semiconductor layer of one conductivity type with a first insulating film covering the semiconductor layer. An aperture is selectively formed in the first insulating film to expose a part of the semiconductor layer. A first polycrystalline semiconductor film of an opposite conductivity type is formed on the first insulating film and has an overhang portion projecting over the aperture from an edge of the first insulating film defining the aperture. A second polycrystalline semiconductor film and a monocrystalline semiconductor film of the opposite conductivity type are grown simultaneously on a bottom surface of the overhang portion of the first polycrystalline semiconductor film and on the part of the monocrystalline semiconductor layer respectively until monocrystalline semiconductor film is in contact with the second polycrystalline semiconductor film, with a second insulating film selectively formed on the monocrystalline semiconductor film with leaving a part thereof to be exposed.
摘要:
It is the object of the invention to suppress the leakage current of a semiconductor photodiode. A trench, a side wall of which is covered with and insulating layer, is formed on the surface of a semiconductor substrate of the first conductivity type. Then, an epitaxial layer of the second conductivity type is grown in the trench, where a PN-junction is constructed between the bottom surface of the epitaxial layer and the semiconductor substrate. An impurity diffusion layer of the second conductivity type with higher impurity concentration than that of an internal portion of the epitaxial semiconductor layer is formed over the side surface of the epitaxial layer of the second conductivity type. In the aforementioned structure, when a reverse bias voltage is applied to the PN-junction, a depletion layer does not extend to a neighborhood of the insulating layer, and a leakage current, which flows via surface states near the insulating layer.
摘要:
It is the object of the invention to suppress the leakage current of a semiconductor photodiode. A trench, a side wall of which is covered with and insulating layer, is formed on the surface of a semiconductor substrate of the first conductivity type. Then, an epitaxial layer of the second conductivity type is grown in the trench, where a PN-junction is constructed between the bottom surface of the epitaxial layer and the semiconductor substrate. An impurity diffusion layer of the second conductivity type with higher impurity concentration than that of an internal portion of the epitaxial semiconductor layer is formed over the side surface of the epitaxial layer of the second conductivity type. In the aforementioned structure, when a reverse bias voltage is applied to the PN-junction, a depletion layer does not extend to a neighborhood of the insulating layer, and a leakage current, which flows via surface states near the insulating layer.
摘要:
In a broadcast receiving system, a first antenna receives a broadcast signal of a first frequency band and a second antenna receives a signal of a second frequency band different from the first frequency band. A frequency conversion unit converts the signal of the second frequency band into a second signal of the first frequency band. A selection unit selects one of the broadcast signal output from the first antenna and the second signal output from the frequency conversion unit. A demodulation unit demodulates the one of the broadcast signal and the second signal selected by the selection unit.
摘要:
A fabrication method of a semiconductor device that can realize a semiconductor device having an improved radiation performance of heat together with a low parasitic capacitance between a semiconductor substrate and a conductor of the device. An SOI structure having a single-crystal silicon layer formed on an insulating substructure is prepared and then, device regions are formed on the substructure by using the single-crystal silicon layer. Sidewall insulators are formed to cover side faces of the respective device regions, laterally isolating the device regions from each other. A resistive silicon layer is formed on a non-device region of the substructure. The resistive silicon layer has a resistivity or specific resistance greater than that of the device regions. Electronic elements are formed in the device regions. The resistive silicon layer may be made of polysilicon or single-crystal silicon.
摘要:
An insulating film is provided on a single crystal silicon layer of a SOI substrate, and a first groove for device isolation and a second groove for thickness measurement are formed to expose a surface of a silicon substrate of the SOI substrate. Then, the first and second grooves are filled with a filling film, and the filling film is etched back, so that the first groove is still filled with the filling film, while the filling film which have filled the second groove is removed to expose the surface of the silicon substrate, because the second groove has a width larger than that of the first groove.
摘要:
Provided is a liquid crystal display device includes an optical switching member; a light guide plate made of a thermoplastic material, which includes at least one light introducing portion on at least one side surface thereof; and a light source disposed on the at least one side surface, in which: the at least one light introducing portion includes, in plan view of the light guide plate: a first portion extending from a light incident surface, which is an end surface of the at least one light introducing portion, while keeping a substantially constant width; and a second portion, which extends from the first portion and has a form which widens; and at least the second portion is connected to a front surface of the light guide plate through an inclined surface which is smoothly continuous with the front surface of the light guide plate.
摘要:
A color cathode ray has an electron gun which includes three cathodes for emitting three in-line electron beams and a plurality of electrodes fixed in a predetermined axially spaced relationship on insulating supports. At least one of the plurality of electrodes is cup-shaped and has a correction electrode therein, and edges of the correction electrode are formed with recesses and sloped portions. A distance L from a mouth of each of the recesses of the correction electrode to an inner wall of the at least one of the plurality of electrodes satisfies the following relationship: L′≦L≦15 &mgr;m, where L′ is a height of a burr caused in press-forming of the recesses.
摘要翻译:彩色阴极射线具有电子枪,其包括用于发射三个一字形电子束的三个阴极和在绝缘支撑件上以预定的轴向间隔关系固定的多个电极。 多个电极中的至少一个是杯形的并且其中具有校正电极,并且校正电极的边缘形成有凹陷部分和倾斜部分。 从校正电极的每个凹部的口部到多个电极中的至少一个电极的内壁的距离L满足以下关系:L'<= L <=15μm,其中L'是高度 在凹部的压制成型中引起的毛刺。
摘要:
A color cathode ray tube including a panel section having a phosphor layer formed on an internal surface thereof, a neck portion having an electron gun assembly for emission of three electron beams therein, and a funnel section connecting the panel section and the neck portion. The electron gun assembly includes three cathodes and a plurality of grid electrodes disposed along a tube axis. The grid electrodes includes at least one plate-shaped electrode which has a fixed support structure. The plate-shaped electrode has three bulged portions along an electron beam passage, a first electron beam passage hole being formed in a respective bulged portion and a second electron beam passage being hole formed in a top face portion of a respective bulge portion. A diameter of the first electron beam passage hole is greater than a diameter of the second electron beam passage hole.