公开(公告)号：US20130076203A1

公开(公告)日：2013-03-28

申请号：US13678683

申请日：2012-11-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Junichi SAITO ,  Yoshinori UEDA ,  Tatsuo KUNISHI

IPC: H01G4/12 ,  H01C7/00 ,  H05K1/03 ,  H01F17/00 ,  H01L41/083

CPC classification number: H01G4/12 ,  H01C7/008 ,  H01F17/0013 ,  H01F27/292 ,  H01G4/005 ,  H01G4/30 ,  H01L41/0472 ,  H01L41/083 ,  H01L41/273 ,  H05K1/0306

Abstract: A ceramic body including therein conductors more effectively prevents ingress of moisture into voids between the conductors and the ceramic body. A supercritical fluid containing a monomer flows in the voids between internal electrode layers and a ceramic laminated body. Then, the voids between the internal electrode layers and the ceramic laminated body are filled with a polymer by the polymerization of the monomer.

Abstract translation: 其中包括导体的陶瓷体更有效地防止水分进入导体和陶瓷体之间的空隙。 含有单体的超临界流体流入内部电极层和陶瓷层叠体之间的空隙。 然后，通过单体的聚合，用聚合物填充内部电极层和陶瓷层叠体之间的空隙。

公开(公告)号：US20190066908A1

公开(公告)日：2019-02-28

申请号：US16170964

申请日：2018-10-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshinori UEDA ,  Koshi HIMEDA ,  Hayami KUDO

IPC: H01F27/29 ,  H01F27/28 ,  H01F27/32

Abstract: An electronic component comprising a main body part including an insulating layer and a conductor layer laminated alternately. The insulating layer and the conductor layer are partially exposed on a side surface of the main body part in a direction orthogonal to a lamination direction. Also, the side surface of the main body part is provided with a metal film extending in the lamination direction to cover the insulating layer and the conductor layer exposed on the side surface.

公开(公告)号：US20190055653A1

公开(公告)日：2019-02-21

申请号：US16167297

申请日：2018-10-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshinori UEDA

IPC: C23C18/18 ,  C23C18/31 ,  H01F27/29 ,  H01F41/04 ,  H05K3/18

Abstract: A manufacturing method that enables an electrode to be formed on a specific portion of a surface of a sintered ceramic body by a simple technique. A method of manufacturing a ceramic electronic component includes preparing a sintered ceramic body that contains a metal oxide, and forming low-resistance portions that is formed by reducing the resistance of portions of the ceramic body by radiating laser onto electrode-formation regions of surfaces of the ceramic body. The method further includes causing a catalytic metal to selectively adhere to the low-resistance portions by immersing the ceramic body, in which the low-resistance portions have been formed, in a catalytic metal substitution treatment solution, and forming a plating layer that serves as an electrode onto the low-resistance portions by performing electroless plating on the ceramic body to which the catalytic metal has adhered.

公开(公告)号：US20190066909A1

公开(公告)日：2019-02-28

申请号：US16173873

申请日：2018-10-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinji OTANI ,  Masaki TSUTSUMI ,  Yoshinori UEDA ,  Hayami KUDO

IPC: H01F27/29 ,  H01L41/047 ,  H01C7/00 ,  H01C1/14 ,  H01G4/40 ,  H01G4/33 ,  H01G4/252 ,  H01G4/236 ,  H01G4/232 ,  H01G4/008 ,  H01F41/02 ,  H01F27/28 ,  H01F27/255 ,  H01F17/04 ,  H01F17/00 ,  H01F1/03 ,  H01C17/28 ,  H01C7/18 ,  H05K1/16

Abstract: An electronic component includes a composite body made of a composite material of a resin material and a metal powder; and a metal film disposed on an outer surface of the composite body. The metal film is in contact with the resin material and the metal powder of the composite body, and an average particle diameter of crystals of the metal film contacting the resin material is 60% or more and 120% or less of an average particle diameter of crystals of the metal film contacting the metal powder.

公开(公告)号：US20170162319A1

公开(公告)日：2017-06-08

申请号：US15298577

申请日：2016-10-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinji OTANI ,  Masaki TSUTSUMI ,  Yoshinori UEDA ,  Hayami KUDO

IPC: H01F27/29 ,  H01F1/03 ,  H01F27/28 ,  H01F41/02 ,  H01L41/047 ,  H01G4/40 ,  H01C7/00 ,  H01C17/28 ,  H01G4/008 ,  H01F27/255 ,  H01G4/252

CPC classification number: H01F27/29 ,  H01C1/14 ,  H01C7/008 ,  H01C7/18 ,  H01C17/28 ,  H01F1/0306 ,  H01F17/0013 ,  H01F17/0033 ,  H01F17/04 ,  H01F27/255 ,  H01F27/2804 ,  H01F41/0206 ,  H01F2017/048 ,  H01G4/008 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/236 ,  H01G4/252 ,  H01G4/33 ,  H01G4/40 ,  H01L41/0477 ,  H05K1/165

Abstract: An electronic component includes a composite body made of a composite material of a resin material and a metal powder; and a metal film disposed on an outer surface of the composite body. The metal film is in contact with the resin material and the metal powder of the composite body, and an average particle diameter of crystals of the metal film contacting the resin material is 60% or more and 120% or less of an average particle diameter of crystals of the metal film contacting the metal powder.