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公开(公告)号：US20220336381A1
公开(公告)日：2022-10-20
申请号：US17718725
申请日：2022-04-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kenji NISHIYAMA , Koshi HIMEDA , Yoshimitsu USHIMI
IPC: H01L23/64 , H01L23/498 , H01L49/02
Abstract: A package board that includes an inductor layer having: a first magnetic layer including first magnetic particles and a resin; an inductor wiring that functions as an inductor in the first magnetic layer; and a second magnetic layer on at least one surface of the first magnetic layer, including second magnetic particles that are higher in average flatness than the first magnetic particles and a resin, the second magnetic particles having a shape where the dimension in a direction along the main surface of the second magnetic layer is longer than the dimension in the thickness direction of the second magnetic layer.
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公开(公告)号：US20210036176A1
公开(公告)日：2021-02-04
申请号：US17062461
申请日：2020-10-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kenji FUJIMOTO , Koshi HIMEDA , Toshihiro TADA , Tetsuro TORITSUKA , Shinji KABURAKI
Abstract: An optical semiconductor element having a mesa portion includes a substrate and semiconductor layers on the substrate. The optical semiconductor element further includes a first contact electrode, a second contact electrode on the semiconductor layer, first and second lead-out wires connected to the first and second contact electrodes, respectively, and an insulating film covering at least an upper surface of the semiconductor layer and the second contact electrode. The second lead-out wire is connected to the second contact electrode in an opening of the insulating film. An outer peripheral end of the second contact electrode in at least a portion where the second contact electrode and the second lead-out wire are connected is above and outside an outer peripheral end of a connection portion with the semiconductor layer, and an inner peripheral end is above and inside an inner peripheral end of the connection portion with the semiconductor layer.
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公开(公告)号：US20240242892A1
公开(公告)日：2024-07-18
申请号：US18618058
申请日：2024-03-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Akitomo TAKAHASHI , Takeshi FURUKAWA , Koshi HIMEDA
Abstract: A capacitor element that includes: a capacitor portion including an anode plate having a porous portion on a core portion, a dielectric layer on the porous portion, and a cathode layer on the dielectric layer; a first cathode through conductor and a second cathode through conductor each penetrating the dielectric layer and the anode plate in a thickness direction and electrically connected to the cathode layer; and an anode through conductor penetrating the dielectric layer and the anode plate in the thickness direction and electrically connected to the anode plate, wherein, in a plan view from a thickness direction of the anode plate, a first center-to-center distance between the first anode through conductor and the first cathode through conductor is equivalent to a second center-to-center distance between the first anode through conductor and the second cathode through conductor.
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公开(公告)号：US20220200551A1
公开(公告)日：2022-06-23
申请号：US17644035
申请日：2021-12-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Mitsunori SAMATA , Satoshi ARAYASHIKI , Koshi HIMEDA , Masayuki AOIKE
Abstract: A power amplification device includes a first member in which a first circuit is formed, a second member in which a second circuit is formed, and a member-member connection conductor that electrically connects the first circuit and the second circuit to each other. The second member is mounted on the first member. The second circuit includes a first amplifier, which amplifies a radio frequency signal to output a first amplified signal. The first circuit includes a control circuit that controls an operation of the second circuit. At least part of a first termination circuit, which is connected to the first amplifier through the member-member connection conductor and which attenuates a harmonic wave component of the first amplified signal, is formed in the first member.
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公开(公告)号：US20220157748A1
公开(公告)日：2022-05-19
申请号：US17649287
申请日：2022-01-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Mayuka ONO , Motoji TSUDA , Fumio HARIMA , Koshi HIMEDA , Hiroaki TOKUYA
IPC: H01L23/66 , H01L23/12 , H01L23/31 , H01L25/065 , H05K1/18 , H01L23/498
Abstract: A mounting substrate has one main surface (a first main surface). An electronic component has a first face, a second face, and a side face, and is provided on the one main surface of the mounting substrate. A solder bump is disposed between the mounting substrate and the electronic component, and electrically connects the mounting substrate and the electronic component. A resin layer is provided on the one main surface of the mounting substrate to cover the electronic component. The first face is a face of the electronic component at a side opposite to the mounting substrate. The side face of the electronic component is in contact with the resin layer. A space is provided between at least a part of the first face and the resin layer in a thickness direction of the mounting substrate.
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Patent Agency Ranking
公开(公告)号：US20190066908A1
公开(公告)日：2019-02-28
申请号：US16170964
申请日：2018-10-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoshinori UEDA , Koshi HIMEDA , Hayami KUDO
Abstract: An electronic component comprising a main body part including an insulating layer and a conductor layer laminated alternately. The insulating layer and the conductor layer are partially exposed on a side surface of the main body part in a direction orthogonal to a lamination direction. Also, the side surface of the main body part is provided with a metal film extending in the lamination direction to cover the insulating layer and the conductor layer exposed on the side surface.
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公开(公告)号：US20250125098A1
公开(公告)日：2025-04-17
申请号：US18990112
申请日：2024-12-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Akitomo TAKAHASHI , Takeshi FURUKAWA , Koshi HIMEDA
Abstract: A capacitor element that includes: a capacitor portion including an anode plate including a porous portion on a core portion, a dielectric layer on the porous portion, and a cathode layer on the dielectric layer; a sealing layer covering the capacitor portion; conductive interconnect layers on the sealing layer; and an outer insulating layer covering the sealing layer and the conductive interconnect layers. In a plan view from a thickness direction of the anode plate, a center-to-center distance between a first anode through conductor and a first cathode through conductor is equivalent to a center-to-center distance between the first anode through conductor and a second cathode through conductor, and a center-to-center distance between a fifth cathode through conductor and the first cathode through conductor is equivalent to a center-to-center distance between the fifth cathode through conductor and the second cathode through conductor.
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公开(公告)号：US20240379280A1
公开(公告)日：2024-11-14
申请号：US18779712
申请日：2024-07-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Nobuyoshi ADACHI , Koshi HIMEDA , Yoshimitsu USHIMI , Kenji NISHIYAMA
Abstract: An inductor component includes an element body including a magnetic layer, a first coil and a second coil that are disposed adjacent to each other on a plane in the element body, and a first connection conductor that connects the first coil and the second coil. A first axis of the first coil and a second axis of the second coil are disposed parallel in a first direction that is orthogonal to the plane. A shortest distance between the first coil and the second coil is equal to or greater than a larger wiring width of a first wiring width of the first coil and a second wiring width of the second coil, and is equal to or less than an average value of a first diameter of a first smallest circle enclosing the first coil and a second diameter of a second smallest circle enclosing the second coil.
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公开(公告)号：US20240355533A1
公开(公告)日：2024-10-24
申请号：US18762018
申请日：2024-07-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoshimitsu USHIMI , Koshi HIMEDA , Kenji NISHIYAMA , Hidehiko SASAKI , Nobuyoshi ADACHI
CPC classification number: H01F27/2823 , H01F27/24 , H01F27/324
Abstract: A coil that includes: a coil wire spirally wound along an axis; and an insulator that covers at least a portion of the coil wire. In a cross section including the axis, the insulator includes: a first insulation portion in contact with a first end surface of the coil wire on a first side in a direction of the axis of the coil wire, a second insulation portion in contact with a second end surface of the coil wire on a second side in the direction of the axis of the coil wire, and a third insulation portion between adjacent turns in the direction of the axis of the coil wire. At least one of a first thickness of the first insulation portion and a second thickness of the second insulation portion is thinner than half of a third thickness of the third insulation portion.
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公开(公告)号：US20200235026A1
公开(公告)日：2020-07-23
申请号：US16749886
申请日：2020-01-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Atsushi KUROKAWA , Koshi HIMEDA , Kazuya KOBAYASHI
IPC: H01L23/367 , H01L27/082 , H01L27/02 , H01L23/528 , H01L29/08 , H01L29/205 , H01L29/10 , H01L29/737 , H01L29/417 , H01L29/423 , H01L29/45 , H01L23/00 , H01L29/165
Abstract: A semiconductor apparatus includes a substrate, plural transistor groups disposed on the substrate, an insulating film, and a metal member. Each of the plural transistor groups includes plural unit transistors arranged in a first direction within a plane of a top surface of the substrate. The plural transistor groups are arranged in a second direction perpendicular to the first direction. The insulating film covers the plural unit transistors and includes at least one cavity. The metal member is disposed on the insulating film and is electrically connected to the plural unit transistors via the at least one cavity. A heat transfer path is formed by a metal in a region from each of the plural unit transistors to a top surface of the metal member. Thermal resistance values of the heat transfer paths are different from each other among the plural unit transistors.
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