公开(公告)号：US20210084775A1

公开(公告)日：2021-03-18

申请号：US16772643

申请日：2018-12-13

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Eiichi NOMURA ,  Yutaka MIYAMOTO ,  Takayuki HASHIMOTO

IPC: H05K3/46 ,  H05K1/14

Abstract: A manufacturing method of a mounting structure includes: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a disposing step of disposing a thermosetting sheet and a thermoplastic sheet on the mounting member, with the thermosetting sheet interposed between the thermoplastic sheet and the first circuit member; a first sealing step of pressing a stack of the thermosetting sheet and the thermoplastic sheet against the first circuit member, and heating the stack, to seal the second circuit members and to cure the thermosetting sheet into a cured layer; and a removal step of removing the thermoplastic sheet from the cured layer. At least one of the second circuit members is a hollow member having a space from the first circuit member, and in the first sealing step, the second circuit members are sealed so as to maintain the space.

公开(公告)号：US20200287518A1

公开(公告)日：2020-09-10

申请号：US16650709

申请日：2018-09-28

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Takayuki HASHIMOTO ,  Takuya ISHIBASHI ,  Kazuki NISHIMURA

IPC: H03H9/08 ,  H03H3/08 ,  H03H9/05 ,  H03H9/10 ,  H01L41/047 ,  H01L41/053 ,  H01L41/23 ,  H01L41/338

Abstract: A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member, the mounting member having a space between the first circuit member and the second circuit member; a step of preparing a laminate sheet including a first thermal-conductive layer and a second thermal-conductive layer, the first thermal-conductive layer disposed at least on one outermost side; a disposing step of disposing the laminate sheet on the mounting member such that the first thermal-conductive layer faces the second circuit members; and a sealing step of pressing the laminate sheet against the first circuit member and heating the laminate sheet, to seal the second circuit members so as to maintain the space, and to cure the laminate sheet. The first thermal-conductive layer after curing has a coefficient of thermal conductivity in a thickness direction at room temperature being equal to or greater than that in a principal surface direction, and the second thermal-conductive layer after curing has a coefficient of thermal conductivity in a principal surface direction at room temperature being greater than that in a thickness direction.

公开(公告)号：US20210403765A1

公开(公告)日：2021-12-30

申请号：US17293327

申请日：2019-07-12

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Takayuki HASHIMOTO ,  Eiichi NOMURA ,  Katsushi KAN ,  Daisuke MORI ,  Yosuke OI ,  Yukio YADA ,  Takashi HIRAOKA ,  Takeyuki KITAGAWA

IPC: C09J7/35 ,  C09J7/10 ,  C09J11/04 ,  B32B9/00 ,  B32B9/04 ,  B32B27/38 ,  B32B27/30 ,  B32B27/36 ,  B32B27/28 ,  B32B27/20 ,  H01L23/29

Abstract: A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.

公开(公告)号：US20200266797A1

公开(公告)日：2020-08-20

申请号：US16651833

申请日：2018-09-28

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Takayuki HASHIMOTO ,  Takuya ISHIBASHI ,  Hiroyuki OKADA ,  Kazuki NISHIMURA

IPC: H03H9/10 ,  H03H3/08 ,  H03H9/05 ,  H01L41/047 ,  H01L41/053 ,  H01L41/23 ,  B29C51/12 ,  B29C51/14 ,  B32B27/08

Abstract: A manufacturing method of a mounting structure, the method including: a step of preparing a mounting member including a first circuit member and a plurality of second circuit members placed on the first circuit member; a step of preparing a sheet having thermosetting property; a disposing step of disposing the sheet on the mounting member so as to face the second circuit members; and a sealing step of pressing the sheet against the first circuit member and heating the sheet, to seal the second circuit members and to cure the sheet, wherein the second circuit members include a reference member, and a first adjacent member and a second adjacent member each adjacent to the reference member, a separation distance D1 between the reference member and the first adjacent member is different from a separation distance D2 between the reference member and the second adjacent member, at least one of the plurality of the second circuit members is a hollow member to be provided with a space from the first circuit member, and in the sealing step, the plurality of the second circuit members are sealed so as to maintain the space.

公开(公告)号：US20170117874A1

公开(公告)日：2017-04-27

申请号：US15300587

申请日：2015-03-31

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Takuya ISHIBASHI ,  Masatoshi FUJIMOTO ,  Takayuki HASHIMOTO

IPC: H03H9/64

CPC classification number: H03H9/64 ,  B32B3/02 ,  B32B3/26 ,  B32B5/024 ,  B32B5/026 ,  B32B5/26 ,  B32B7/06 ,  B32B7/12 ,  B32B9/005 ,  B32B9/045 ,  B32B15/08 ,  B32B15/082 ,  B32B15/088 ,  B32B15/09 ,  B32B15/092 ,  B32B15/095 ,  B32B15/098 ,  B32B15/18 ,  B32B15/20 ,  B32B17/00 ,  B32B27/08 ,  B32B27/12 ,  B32B27/281 ,  B32B27/283 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/40 ,  B32B27/42 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2307/54 ,  B32B2307/748 ,  B32B2457/00 ,  H01L23/04 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H03H9/1014 ,  H03H9/1071 ,  H01L2924/00014

Abstract: A circuit member including: an element having a functional region; a tabular cover disposed opposite to the functional region; and a rib formed to surround the functional region, for providing a space between the functional region and the cover. The cover includes a sheet S having a thickness of 100 μm or less. The sheet S has a tensile elastic modulus Es at 175° C. of 10 GPa or more. The tensile elastic modulus Es at 175° C. of the sheet S is preferably 20 GPa or more.