公开(公告)号：US11718770B2

公开(公告)日：2023-08-08

申请号：US17293327

申请日：2019-07-12

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Takayuki Hashimoto ,  Eiichi Nomura ,  Katsushi Kan ,  Daisuke Mori ,  Yosuke Oi ,  Yukio Yada ,  Takashi Hiraoka ,  Takeyuki Kitagawa

IPC: B32B7/12 ,  C09J7/35 ,  C09J7/10 ,  B32B9/00 ,  B32B9/04 ,  B32B27/20 ,  B32B27/28 ,  B32B27/30 ,  B32B27/36 ,  B32B27/38 ,  C09J11/04 ,  H01L23/29

CPC classification number: C09J7/35 ,  B32B9/005 ,  B32B9/045 ,  B32B27/20 ,  B32B27/283 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  C09J7/10 ,  C09J11/04 ,  H01L23/295 ,  B32B2264/1021 ,  B32B2270/00 ,  B32B2457/14 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2467/00 ,  C09J2483/00

Abstract: A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.