公开(公告)号：US11608435B2

公开(公告)日：2023-03-21

申请号：US16610992

申请日：2018-05-30

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Yasuhito Fujii ,  Katsushi Kan ,  Yosuke Oi

IPC: H01L21/56 ,  H01L23/29 ,  C08L63/00 ,  C09J163/00 ,  C08K3/36 ,  C08K7/26 ,  C08L63/04 ,  B29C43/00 ,  B29K63/00 ,  C08G59/42 ,  C08K5/18

Abstract: To provide an epoxy resin composition capable of forming a polished surface with high flatness when polished after curing, and a method for producing an electronic component mounting structure having a polished surface with high flatness, the polished surface obtained by polishing the surface of an encapsulation body. Disclosed are an epoxy resin composition, an electronic component mounting structure including the epoxy resin composition, and a method for producing the electronic component mounting structure, wherein: the epoxy resin composition includes a fused silica possibly containing hollow particles, and a curing agent; on a polished surface obtained by polishing a cured product of the epoxy resin composition, the number of pores having a diameter of more than 5 μm observed within a 25-mm2 area is one or less, the pores derived from cross sections of the hollow particles; and the polished surface is coated with a coating material.

公开(公告)号：US11718770B2

公开(公告)日：2023-08-08

申请号：US17293327

申请日：2019-07-12

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Takayuki Hashimoto ,  Eiichi Nomura ,  Katsushi Kan ,  Daisuke Mori ,  Yosuke Oi ,  Yukio Yada ,  Takashi Hiraoka ,  Takeyuki Kitagawa

IPC: B32B7/12 ,  C09J7/35 ,  C09J7/10 ,  B32B9/00 ,  B32B9/04 ,  B32B27/20 ,  B32B27/28 ,  B32B27/30 ,  B32B27/36 ,  B32B27/38 ,  C09J11/04 ,  H01L23/29

CPC classification number: C09J7/35 ,  B32B9/005 ,  B32B9/045 ,  B32B27/20 ,  B32B27/283 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  C09J7/10 ,  C09J11/04 ,  H01L23/295 ,  B32B2264/1021 ,  B32B2270/00 ,  B32B2457/14 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2467/00 ,  C09J2483/00

Abstract: A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.

公开(公告)号：US09963587B2

公开(公告)日：2018-05-08

申请号：US14415231

申请日：2013-07-16

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Yukari Kouno ,  Katsushi Kan

IPC: C08L63/00 ,  C08G59/68 ,  C08G59/42 ,  H01L21/52 ,  H01L23/00 ,  H01L23/29 ,  C08G59/24 ,  H01L21/56

CPC classification number: C08L63/00 ,  C08G59/245 ,  C08G59/42 ,  C08G59/4223 ,  C08G59/4238 ,  C08G59/686 ,  C08G2190/00 ,  C08K3/36 ,  C08L33/06 ,  C08L2203/206 ,  H01L21/52 ,  H01L21/563 ,  H01L23/293 ,  H01L24/13 ,  H01L24/29 ,  H01L2224/13147 ,  H01L2224/2929 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: There are provided an epoxy resin composition for encapsulation, which is particularly suitable for use in resin pre-setting type flip-chip mounting of a Cu post chip, and which is capable of suppressing defects due to the generation of voids; and a method for manufacturing a semiconductor device using a Cu post chip. The present invention provides an epoxy resin composition for semiconductor encapsulation for flip-chip mounting, which contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and 3 to 64 parts by weight, relative to 100 parts by weight of the component (A), of thermally thickening resin particles (D) having a volume-average primary particle diameter of 0.2 to 10 μm; and a method for manufacturing a semiconductor device by resin pre-setting type flip-chip mounting of a Cu post chip using the composition.

公开(公告)号：US20150175800A1

公开(公告)日：2015-06-25

申请号：US14415231

申请日：2013-07-16

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Yukari Kouno ,  Katsushi Kan

IPC: C08L63/00 ,  H01L21/56 ,  H01L23/00 ,  H01L21/52 ,  C08G59/42 ,  C08G59/24

CPC classification number: C08L63/00 ,  C08G59/245 ,  C08G59/42 ,  C08G59/4223 ,  C08G59/4238 ,  C08G59/686 ,  C08G2190/00 ,  C08K3/36 ,  C08L33/06 ,  C08L2203/206 ,  H01L21/52 ,  H01L21/563 ,  H01L23/293 ,  H01L24/13 ,  H01L24/29 ,  H01L2224/13147 ,  H01L2224/2929 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: There are provided an epoxy resin composition for encapsulation, which is particularly suitable for use in resin pre-setting type flip-chip mounting of a Cu post chip, and which is capable of suppressing defects due to the generation of voids; and a method for manufacturing a semiconductor device using a Cu post chip. The present invention provides an epoxy resin composition for semiconductor encapsulation for flip-chip mounting, which contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and 3 to 64 parts by weight, relative to 100 parts by weight of the component (A), of thermally thickening resin particles (D) having a volume-average primary particle diameter of 0.2 to 10 μm; and a method for manufacturing a semiconductor device by resin pre-setting type flip-chip mounting of a Cu post chip using the composition.

Abstract translation: 提供一种用于封装的环氧树脂组合物，其特别适用于Cu后片的树脂预设型倒装芯片安装，并且能够抑制由于空隙的产生而引起的缺陷; 以及使用Cu后置芯片制造半导体器件的方法。 本发明提供一种用于倒装芯片安装的半导体封装用环氧树脂组合物，其含有环氧树脂（A），固化剂（B），固化促进剂（C），相对于3〜64重量份 100重量份组分（A），体积平均一次粒径为0.2至10μm的热增稠树脂颗粒（D）; 以及通过使用该组合物的Cu后片的树脂预设置型倒装芯片安装来制造半导体器件的方法。