公开(公告)号：US20150305209A1

公开(公告)日：2015-10-22

申请号：US14646599

申请日：2013-12-03

Applicant: NEC CORPORATION

Inventor： Kenichi INABA ,  Minoru YOSHIKAWA ,  Hitoshi SAKAMOTO ,  Akira SHOUJIGUCHI ,  Arihiro MATSUNAGA ,  Masaki CHIBA

IPC: H05K7/20

CPC classification number: H05K7/20818 ,  F25B23/006 ,  F28D15/0266 ,  F28D15/06 ,  G06F1/20 ,  H05K7/20736 ,  H05K7/20809

Abstract: A cooling system of an electronic device storing apparatus of the present invention comprises: a rack including an electronic device and a plurality of placement shelves to place the electronic device; in the rack, a vaporizer having a refrigerant internally being mounted; outside the rack, a condensing part connected with the vaporizer by a laying pipe being installed; and a refrigerant adjustment means for adjusting a height of a refrigerant surface in the vaporizer.

Abstract translation: 本发明的电子设备存储装置的冷却系统包括：包括电子设备的机架和用于放置电子设备的多个放置架; 在机架中，内置有制冷剂的汽化器; 在机架外部，安装有通过铺设管与蒸发器连接的冷凝部件; 以及用于调节蒸发器中的制冷剂表面的高度的制冷剂调节装置。

公开(公告)号：US20160174417A1

公开(公告)日：2016-06-16

申请号：US14903205

申请日：2014-07-10

Applicant: NEC CORPORATION

Inventor： Mahiro HACHIYA ,  Minoru YOSHIKAWA ,  Hitoshi SAKAMOTO ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Kenichi INABA ,  Arihiro MATSUNAGA

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  F28D15/0266 ,  F28D15/06 ,  H05K7/20736 ,  H05K7/208

Abstract: A control mechanism becomes complex when an optimum volume of refrigerant is stably supplied to a plurality of objects to be cooled that have differing heat generation values. The present invention is a cooling system which comprises a first refrigerant tank that stores a liquid-phase refrigerant, a plurality of evaporators that gasify the liquid-phase refrigerant supplied from the first refrigerant tank, a condenser that liquefies the gas-phase refrigerant that was gasified by the evaporators, a vapor pipe that connects the evaporators and the condenser and in which the gas-phase refrigerant flows, and a liquid pipe that connects the condenser and the first refrigerant tank and connects the first refrigerant tank and the plurality of evaporators and in which the liquid-phase refrigerant flows, wherein the condenser is located higher than the plurality of evaporators, and the first refrigerant tank is located lower than the condenser.

Abstract translation: 当将制冷剂的最佳体积稳定地供给到具有不同发热量的待冷却对象物时，控制机构变得复杂。 本发明是一种冷却系统，其包括储存液相制冷剂的第一制冷剂罐，使从第一制冷剂罐供给的液相制冷剂气化的多个蒸发器，将液化制冷剂液化的冷凝器， 由蒸发器气化，将蒸发器和冷凝器连接并且其中气相制冷剂流动的蒸汽管和连接冷凝器和第一制冷剂罐并连接第一制冷剂罐和多个蒸发器的液体管和 其中液相制冷剂流动，其中冷凝器位于比多个蒸发器高的位置，并且第一制冷剂罐位于比冷凝器低的位置。

公开(公告)号：US20160338226A1

公开(公告)日：2016-11-17

申请号：US15110888

申请日：2015-01-15

Applicant: NEC CORPORATION

Inventor： Hitoshi SAKAMOTO ,  Minoru YOSHIKAWA ,  Mahiro HACHIYA

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  F28D15/0266 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20136 ,  H05K7/20327 ,  H05K7/20409 ,  H05K7/20436 ,  H05K7/20809 ,  H01L2924/00

Abstract: A cooling device 100 includes a first heat receiving unit 400, a second heat receiving unit 410, a first heat dissipating unit 700, and a second heat dissipating unit 710. The first heat dissipating unit 700 and the second heat dissipating unit 710 have a flat plate shape and have a structure in which air passes in a direction approximately perpendicular to a principal surface having a flat plate shape and a first principal surface 730 that is a principal surface having a flat plate shape in the first heat dissipating unit 700 and a second principal surface 740 that is a principal surface having a flat plate shape in the second heat dissipating unit 710 are arranged so as to face to each other. As a result, the size of the cooling device 100 can be reduced without degrading a heat dissipation performance to dissipate heat generated by a heat generating element.

Abstract translation: 冷却装置100包括第一受热单元400，第二受热单元410，第一散热单元700和第二散热单元710.第一散热单元700和第二散热单元710具有平坦 并且具有这样的结构，其中空气在大致垂直于具有平板形状的主表面的方向上流动，而第一主表面730是第一散热单元700中具有平板形状的主表面，第二主表面730 在第二散热单元710中具有平板形状的主表面的主表面740被布置成彼此相对。 结果，可以降低冷却装置100的尺寸，而不会降低散热性能以散发由发热元件产生的热量。

公开(公告)号：US20160147034A1

公开(公告)日：2016-05-26

申请号：US14904450

申请日：2014-07-16

Applicant: NEC CORPORATION

Inventor： Akira SHOUJIGUCHI ,  Minoru YOSHIKAWA ,  Hitoshi SAKAMOTO ,  Masaki CHIBA ,  Kenichi INABA ,  Arihiro MATSUNAGA

IPC: G02B7/02 ,  G03B21/16 ,  F28D15/02 ,  G02B27/00

CPC classification number: G02B7/028 ,  F28D15/02 ,  F28D15/0266 ,  G02B27/0006 ,  G03B21/16

Abstract: A cooling structure of a sealed casing according to the present invention includes sealed containers for housing heat-generation components irradiated with light from a light source to generate heat, an evaporation unit disposed in the sealed container to store a refrigerant, a condensation unit configured to liquefy the refrigerant gasified by the heat received from the heat-generation component, a steam pipe configured to connect the evaporation unit and the condensation unit, through which the gasified refrigerant flows, and a liquid pipe configured to connect the evaporation unit and the condensation unit to each other, through which the liquefied refrigerant flows. Thus, a cooling structure capable of preventing performance deterioration of a cooling target device can be achieved.

Abstract translation: 根据本发明的密封壳体的冷却结构包括用于容纳照射来自光源的光的发热部件以产生热的密封容器，设置在密封容器中以储存制冷剂的蒸发单元，冷凝单元，其构造成 液化通过从发热部件接收的热量气化的制冷剂，配置成连接蒸发单元和冷凝单元的蒸气管，气化的制冷剂流过冷凝单元;液体管，被配置为将蒸发单元和冷凝单元 彼此通过液化制冷剂流过。 因此，能够实现能够防止冷却对象装置的性能恶化的冷却结构。

公开(公告)号：US20160018143A1

公开(公告)日：2016-01-21

申请号：US14378659

申请日：2013-02-13

Applicant: NEC CORPORATION

Inventor： Kenichi INABA ,  Minoru YOSHIKAWA ,  Hitoshi SAKAMOTO ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Arihiro MATSUNAGA

IPC: F25B43/00 ,  F25B39/00

CPC classification number: F25B43/00 ,  F25B39/00 ,  F25B39/02 ,  F25B39/04 ,  F28D15/0266 ,  G06F1/20 ,  H05K7/20818

Abstract: A cooling apparatus includes N (N is an integer of 2 or larger) refrigerant storage units arranged in a vertical direction and configured to store refrigerants, a condensation unit disposed above the N refrigerant storage units, a steam pipe for circulating gas phase refrigerants flowing out of the N refrigerant storage units to the condensation unit, a liquid pipe for circulating a liquid phase refrigerant flowing out of the condensation unit to an uppermost refrigerant storage unit, and separation piping for circulating a liquid phase refrigerant flowing out of an upper refrigerant storage unit to a lower refrigerant storage unit. The liquid phase refrigerant flows into each refrigerant storage unit via an inlet, and flows out from the refrigerant storage unit via a first connection port formed below the inlet.

Abstract translation: 一种冷却装置，其特征在于，包括N个（N为2以上的整数）制冷剂储存单元，其沿垂直方向配置，构成为储存制冷剂，冷凝单元设置在所述N个制冷剂储存单元的上方;蒸气管，其使流出的气相制冷剂循环 的N个制冷剂储存单元的冷凝装置，将从冷凝装置流出的液相制冷剂循环到最上层的制冷剂储存部的液体管，以及使从上部制冷剂储存部流出的液相制冷剂循环的分离配管 到下部制冷剂储存单元。 液相制冷剂经由入口流入各制冷剂储存单元，经由形成在入口下方的第一连接口从制冷剂储存单元流出。

公开(公告)号：US20170125323A1

公开(公告)日：2017-05-04

申请号：US15128354

申请日：2015-03-20

Applicant: NEC Corporation

Inventor： Hitoshi SAKAMOTO ,  Minoru YOSHIKAWA ,  Mahiro HACHIYA

IPC: H01L23/427 ,  H01L23/40 ,  H05K7/20

CPC classification number: H01L23/427 ,  F28D15/0266 ,  H01L23/4006 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4068 ,  H01L2924/0002 ,  H05K7/20318 ,  H01L2924/00

Abstract: A cooler grows in size and its structure becomes complicated in a phase-change cooler if it is intended to cool a plurality of heating elements; therefore, a phase-change cooler according to an exemplary aspect of the present invention includes a heat-conducting board configured to be thermally connected to a cooling object; heat receiving means for storing a refrigerant and receiving heat of the cooling object through the heat-conducting board; radiation means for radiating heat, condensing and devolatilizing a vapor-phase refrigerant arising from vaporization of the refrigerant in the heat receiving means; and connection means for connecting the heat receiving means and the radiation means.

公开(公告)号：US20160014933A1

公开(公告)日：2016-01-14

申请号：US14769935

申请日：2014-02-19

Applicant: NEC CORPORATION

Inventor： Arihiro MATSUNAGA ,  Minoru YOSHIKAWA ,  Hitoshi SAKAMOTO ,  Masaki CHIBA ,  Akira SHOUJIGUCHI ,  Kenichi INABA

IPC: H05K7/20 ,  B23P19/00

CPC classification number: H05K7/20818 ,  B23P19/00 ,  F28D15/0266 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20827

Abstract: [Problem]To provide an electronic apparatus cooling system having superior cooling characteristics and portability.[Solution] A rack 2 is installed within a container 1. A heat receiving apparatus 3 is disposed on a lateral face of the rack 2, and receives heat emitted within the rack 2 by a liquid-phase cooling medium gasifying and becoming a gaseous-phase cooling medium. A gaseous-phase tube 6 is disposed extending in plumb direction, and transports the gaseous-phase cooling medium from the heat receiving apparatus 3. A heat radiating apparatus 4 is disposed above the rack 2 outside the container 1, and radiates the heat which the heat receiving apparatus 3 has received by cooling the gaseous-phase cooling medium flowing from the gaseous-phase tube 6, making said gaseous-phase cooling medium into the liquid-phase cooling medium. A liquid-phase tube 7 transports the liquid-phase cooling medium from the heat radiating apparatus 4 to the heat receiving apparatus 3. The gaseous-phase tube 6 further comprises a gaseous-phase tube bend part 6c whereat cooling medium droplets, which arise from the condensation of the gaseous phase cooling medium as a result of the gaseous-phase tube 6 being exposed to the environment external to the container 1, are collected.

Abstract translation: 提供具有优异的冷却特性和便携性的电子设备冷却系统。 [解决方案]机架2安装在容器1内。热接收装置3设置在齿条2的侧面上，并且通过液相冷却介质接收气体发生的气体发生的热量， 相冷却介质。 气相管6设置在铅垂方向延伸，并从热接收装置3输送气相冷却介质。散热装置4设置在容器1外部的齿条2的上方，并辐射热量 通过冷却从气相管6流出的气相冷却介质，接收热量接收装置3，使气相冷却介质进入液相冷却介质。 液相管7将液相冷却介质从散热装置4输送到热接收装置3.气相管6还包括气相管弯曲部6c，其中冷却介质液滴由 收集由于气相管6暴露于容器1外部的环境导致的气相冷却介质的冷凝。

公开(公告)号：US20150351286A1

公开(公告)日：2015-12-03

申请号：US14649172

申请日：2013-12-03

Applicant: NEC CORPORATION

Inventor： Hitoshi SAKAMOTO ,  Minoru YOSHIKAWA ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Kenichi INABA ,  Arihiro MATSUNAGA

IPC: H05K7/20

CPC classification number: H05K7/20663 ,  F25B1/00 ,  F25B21/02 ,  F25B2339/047 ,  F25B2400/24 ,  H05K7/20818

Abstract: The present invention includes: a heat receiving portion that receives heat generated by an electronic apparatus and causes a phase of a first heating medium to change from a liquid phase to a gas; a heat radiating portion that causes a phase of the first heating medium to change from the gas to the liquid and supplies the first heating medium to the heat receiving portion; and a compressor that raises a temperature of the first heating medium supplied from the heat receiving portion and supplies the first heating medium to the heat radiating portion.

Abstract translation: 本发明包括：受热部，其接收由电子设备产生的热量，并使第一加热介质的相位从液相变为气体; 散热部，其使所述第一加热介质的相位从所述气体向所述液体变化，并将所述第一加热介质供给到所述受热部; 以及压缩机，其升高从所述受热部供给的所述第一加热介质的温度，并将所述第一加热介质供给到所述散热部。

公开(公告)号：US20160014928A1

公开(公告)日：2016-01-14

申请号：US14768917

申请日：2014-02-19

Applicant: NEC CORPORATION

Inventor： Hitoshi SAKAMOTO ,  Minoru YOSHIKAWA ,  Akira SHOUJIGUCHI ,  Masaki CHIBA ,  Kenichi INABA ,  Arihiro MATSUNAGA

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  G06F1/20 ,  H05K7/20154 ,  H05K7/202 ,  H05K7/205

Abstract: An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510. This enables the heat generating component on the electronic board to be efficiently cooled with a small and simple configuration.

Abstract translation: 电子板200具有安装在其上的发热部件220。 外壳300容纳电子板200.热传输单元400耦合到外壳300，并将由发热部件220产生的热量输送到外部。 在热传输单元400,400A中设置有热量接收单元510。 受热单元510接收由发热组件220产生的热量。散热单元530以散热单元530的一部分暴露于外部空气的方式设置在热传输单元400中，并且耦合 散热单元530将由热接收单元510接收的热量散发到外部。 导管单元340形成为将发热部件220和热接收单元510互连的管，以便将发热部件220的热量释放到热接收单元510.这使得电子板上的发热部件 以小而简单的结构被有效地冷却。