Abstract:
Disclosed is a circuit board laminate including a metal substrate, an insulating layer disposed on at least one surface of the metal substrate and a metal foil disposed on the insulating layer. Characteristically, the insulating layer contains a crosslinked copolymer of bisphenol cyanate resin and novolac cyanate resin and an inorganic filler.
Abstract:
A method of manufacturing a circuit board laminate including a metal substrate, an insulating layer disposed on at least one surface of the metal substrate, and a metal foil disposed on the insulating later, the method including: forming, on at least one of the metal substrate and the metal foil, a film that includes a composition containing a bisphenol cyanate resin, a novolac cyanate resin and an inorganic filler; obtaining a laminate by joining the metal substrate and the metal foil to face each other with the film interposed therebetween; and heating the laminate at a temperature higher than 200° C. to form a crosslinked copolymer consisting of the bisphenol cyanate resin and the novolac cyanate resin in the film, and to obtain the insulating layer comprising the crosslinked copolymer.
Abstract:
A bush- and bracket-integrated stabilizer bar includes a stabilizer bar, a rubber bush attached to an outer periphery of the stabilizer bar, and a bracket configured to mount the stabilizer bar to a bottom of a vehicle body with the rubber bush intervened. The stabilizer bar has amine-based curable epoxy paint or amine-containing cationic paint and a surface treatment layer containing a halogen donor-based surface treatment agent on the paint. The rubber bush has a surface treatment layer containing a halogen donor-based surface treatment agent on an inner surface thereof. A thermosetting epoxy adhesive layer containing an amine-based or an organic hydrazide-based curing agent and a bisphenol type epoxy resin is formed between the stabilizer bar and the rubber bush.