公开(公告)号：US09825388B2

公开(公告)日：2017-11-21

申请号：US14457469

申请日：2014-08-12

Applicant: NOVATEK MICROELECTRONICS CORP.

Inventor： Chun-Yi Chou ,  Yu-Chang Pai ,  Teng-Yang Tan ,  Shih-Wei Tseng

IPC: H05K1/11 ,  H01R12/79 ,  H01R13/6471 ,  H05K1/18 ,  H05K1/14 ,  H05K3/30 ,  H01R12/72 ,  H01P5/12 ,  H01B7/08 ,  H05K1/02

CPC classification number: H01R12/79 ,  H01B7/0823 ,  H01P5/12 ,  H01R12/727 ,  H01R13/6471 ,  H05K1/0245 ,  H05K1/14 ,  H05K1/142 ,  H05K1/147 ,  H05K1/189 ,  H05K3/308 ,  H05K2201/10189

Abstract: A layout method applied to a connector is provided. The connector is electrically connected between a flexible printed circuit (FPC) and a printed circuit board (PCB). The FPC includes M pairs of differential lines and X shield lines. The PCB includes M pairs of differential lines and Z shield lines. The layout method includes following steps. Firstly, M pairs of conductive lines are disposed on the connector. The M conductive lines are correspondingly electrically connected to the M differential lines of the FPC and the M differential lines of the PCB. Then; Y conductive lines are disposed on the connector, wherein Y is smaller than X. Furthermore, at least one of the Y conductive lines is electrically connected to at least one of the X shield lines and at least one of the Z shield lines.

公开(公告)号：US20140231121A1

公开(公告)日：2014-08-21

申请号：US13792243

申请日：2013-03-11

Applicant: NOVATEK MICROELECTRONICS CORP.

Inventor： Yu-Chang Pai

IPC: H05K1/02 ,  H05K1/09

CPC classification number: H05K1/0228 ,  H05K1/0224 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/0393 ,  H05K1/09 ,  H05K2201/09272 ,  H05K2201/09681

Abstract: A ground line structure adapted to a flexible circuit board is provided. The ground line structure includes a plurality of ground line structure units located on the flexible circuit board to form a meshed pattern. The ground line structure units include a plurality of ground line edge segments, a ground line middle segment and a plurality of ground line connecting segments. The ground line edge segments define an edge shape of each ground line structure unit. The edge shape of each ground line structure unit is a hexagon. The ground line connecting segments are configured to connect the ground line middle segment and the ground line edge segments. The ground line edge segments, the ground line middle segment and the ground line connecting segments form a plurality of pentagonal electrode structures within the hexagonal ground line structure unit. A flexible circuit board including the ground line structure is also provided.

Abstract translation: 提供了适用于柔性电路板的接地线结构。 地线结构包括位于柔性电路板上的多个接地线结构单元，以形成网格图案。 接地线结构单元包括多个接地线边缘段，地线中间段和多个接地线连接段。 地线边缘段限定每个接地线结构单元的边缘形状。 每个地线结构单元的边缘形状是六边形。 接地线连接段配置为连接接地线中间段和接地线边缘段。 接地线边缘段，地线中间段和接地线连接段在六边形接地线结构单元内形成多个五边形电极结构。 还提供了包括接地线结构的柔性电路板。

公开(公告)号：US08941012B2

公开(公告)日：2015-01-27

申请号：US13792243

申请日：2013-03-11

Applicant: Novatek Microelectronics Corp.

Inventor： Yu-Chang Pai

IPC: H05K1/09 ,  H05K1/02

CPC classification number: H05K1/0228 ,  H05K1/0224 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/0393 ,  H05K1/09 ,  H05K2201/09272 ,  H05K2201/09681

Abstract: A ground line structure adapted to a flexible circuit board is provided. The ground line structure includes a plurality of ground line structure units located on the flexible circuit board to form a meshed pattern. The ground line structure units include a plurality of ground line edge segments, a ground line middle segment and a plurality of ground line connecting segments. The ground line edge segments define an edge shape of each ground line structure unit. The edge shape of each ground line structure unit is a hexagon. The ground line connecting segments are configured to connect the ground line middle segment and the ground line edge segments. The ground line edge segments, the ground line middle segment and the ground line connecting segments form a plurality of pentagonal electrode structures within the hexagonal ground line structure unit. A flexible circuit board including the ground line structure is also provided.

Abstract translation: 提供了适用于柔性电路板的接地线结构。 地线结构包括位于柔性电路板上的多个接地线结构单元，以形成网格图案。 接地线结构单元包括多个接地线边缘段，地线中间段和多个接地线连接段。 地线边缘段限定每个接地线结构单元的边缘形状。 每个地线结构单元的边缘形状是六边形。 接地线连接段配置为连接接地线中间段和接地线边缘段。 接地线边缘段，地线中间段和接地线连接段在六边形接地线结构单元内形成多个五边形电极结构。 还提供了包括接地线结构的柔性电路板。

公开(公告)号：US08895872B2

公开(公告)日：2014-11-25

申请号：US13689017

申请日：2012-11-29

Applicant: Novatek Microelectronics Corp.

Inventor： Yu-Chang Pai

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/11 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0251

Abstract: The printed circuit board comprises two first signal traces, a first grounding layer, two first signal traces, a second grounding layer, two signal conductive pillars and two grounding conductive pillars. The first signal traces are formed on a first surface of a substrate. The first grounding layer is formed on the first surface. The second signal traces are formed on a second surface of the substrate. The second grounding layer is formed on the second surface. The signal conductive pillars are extended to the second surface from the first surface and each signal conductive pillar connects the corresponding first signal trace and second signal trace. The grounding conductive pillars are extended to the second surface from the first surface and each grounding conductive pillar connects the first grounding layer and the second grounding layer. Each grounding conductive pillar and the corresponding signal conductive pillar are disposed in pairs.

Abstract translation: 印刷电路板包括两个第一信号迹线，第一接地层，两个第一信号迹线，第二接地层，两个信号导电柱和两个接地导电柱。 第一信号迹线形成在基板的第一表面上。 第一接地层形成在第一表面上。 第二信号迹线形成在基板的第二表面上。 第二接地层形成在第二表面上。 信号导电柱从第一表面延伸到第二表面，并且每个信号导电柱连接相应的第一信号迹线和第二信号迹线。 接地导电柱从第一表面延伸到第二表面，每个接地导体柱连接第一接地层和第二接地层。 每个接地导体柱和对应的信号导电柱成对设置。

公开(公告)号：US20160351524A1

公开(公告)日：2016-12-01

申请号：US14727842

申请日：2015-06-01

Applicant: Novatek Microelectronics Corp.

Inventor： Yu-Chang Pai ,  Chien-Hsi Lee

IPC: H01L23/00

CPC classification number: H01L24/48 ,  H01L24/05 ,  H01L24/06 ,  H01L2224/05553 ,  H01L2224/0612 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: An integrated circuit is provided. The integrated circuit includes first pads and second pads. The first pads are used to receive a first type signal, and the second pads are used to receive a second type signal which is different from the first type signal. The first and second pads are alternately disposed on the integrated circuit, and form pad rows. Each of the pad rows has a part of the first pads and a part of the second pads. Each of the first pads directly neighbors with a plurality of neighboring pads of the second pads.

Abstract translation: 提供集成电路。 集成电路包括第一焊盘和第二焊盘。 第一焊盘用于接收第一类型信号，并且第二焊盘用于接收与第一类型信号不同的第二类型信号。 第一和第二焊盘交替地设置在集成电路上，并形成焊盘行。 每个垫排具有第一垫的一部分和第二垫的一部分。 每个第一焊盘与第二焊盘的多个相邻焊盘直接相邻。