公开(公告)号：US20160190673A1

公开(公告)日：2016-06-30

申请号：US14582830

申请日：2014-12-24

Applicant: NXP B.V.

Inventor： Mingda Huang ,  Markus Carolus Antonius van Schie

IPC: H01P7/10 ,  H01L23/64 ,  H01L23/66 ,  H01L23/00 ,  G06F17/50 ,  H01L23/31

CPC classification number: H01L23/645 ,  G06F17/5022 ,  G06F17/5068 ,  G06F17/5081 ,  H01L23/5227 ,  H01L23/66 ,  H01L28/10 ,  H01L2223/6638 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1423 ,  H01P5/028 ,  Y02T10/82

Abstract: Consistent with an example embodiment, a System on Chip (SoC) device operates in millimeter wave frequencies. The SoC device comprises, a silicon device having at least one differential pair pad, the at least one differential pair pad having a shunt inductor coupled thereon. A parasitic capacitance on at least one differential pair pads is tuned out by resonance of the shunt inductor. A package has a redistribution layer (RDL), with an array of contact areas to which the silicon device is mounted and then encapsulated. A connection corresponds to the at least one differential pair pad and the connection is located about an outer row or column of the array of contact areas.

Abstract translation: 与示例性实施例一致，片上系统（SoC）器件以毫米波频率工作。 SoC器件包括具有至少一个差分对焊盘的硅器件，所述至少一个差分对焊盘具有耦合在其上的分流电感器。 通过并联电感器的谐振来调谐至少一个差分对焊盘的寄生电容。 封装具有再分配层（RDL），其具有安装硅器件的接触区域阵列，然后封装。 连接对应于至少一个差分对焊盘，并且连接位于接触区域阵列的外部行或列周围。

公开(公告)号：US20150108996A1

公开(公告)日：2015-04-23

申请号：US14472179

申请日：2014-08-28

Applicant: NXP B.V.

Inventor： Cicero Silveira Vaucher ,  Mingda Huang ,  Antonius de Graauw

IPC: G01R31/02

CPC classification number: G01R31/02 ,  G01R31/006 ,  G01R31/048 ,  G01R31/2822

Abstract: The invention provides a testing circuit for testing a connection between a chip and external circuitry. A current source is used to inject a DC current towards the connection to be tested from the chip side. On-chip ESD protection is provided giving a path between the connection to be tested and a fixed voltage line. A shunt path is also coupled to the connection to be tested on the external circuitry side. It is determined if the current source current flows through the ESD protection circuit, and this can be used to determine whether or not the connection to be tested presents an open circuit for the DC test current.

Abstract translation: 本发明提供一种用于测试芯片和外部电路之间的连接的测试电路。 电流源用于从芯片侧向被测试的连接端注入直流电流。 提供片上ESD保护，提供要测试的连接和固定电压线之间的路径。 分路还耦合到要在外部电路侧进行测试的连接。 确定电流源电流是否流过ESD保护电路，并且这可以用于确定待测试的连接是否对DC测试电流产生开路。

公开(公告)号：US10983193B2

公开(公告)日：2021-04-20

申请号：US16174997

申请日：2018-10-30

Applicant: NXP B.V.

Inventor： Yu Lin ,  Marcello Ganzerli ,  Mingda Huang

IPC: G01S7/03 ,  G01S13/931 ,  H01Q1/32 ,  H01Q3/26 ,  G01S13/34 ,  G01S13/87 ,  G01S13/86 ,  G01S7/40 ,  G01S13/00 ,  G01S13/02 ,  G01S13/46

Abstract: A communication unit, such as a radar unit (500) includes a plurality of cascaded millimetre wave, mmW, transceiver, TRx, circuit, each comprising at least one phase shift circuit (616) and each coupled to respective antennas; and a signal processor circuit (552) operably coupled to the plurality of cascaded mmW TRx circuits and configured to process transmit and receive signals of the plurality of cascaded mmW TRx circuits. The radar unit (500) further comprises: a first TRx circuit (320) of the plurality of cascaded mmW TRx circuits being configured to wirelessly transmit (360) a signal to a second TRx circuit (322) via a respective antenna; a localization processing circuit (580) operably coupled to at least one of the first TRx circuit (320) and second TRx circuit (322) and configured to wirelessly determine a distance relationship (350) between at least one antenna coupled to the first TRx circuit (320) and at least one antenna coupled to the second TRx circuit (322); and a phase control unit (602), operably coupled to the localization processing circuit (570) and configured to adjust at least one phase shifter (616) in response to the wirelessly determined distance relationship.

公开(公告)号：US20190178983A1

公开(公告)日：2019-06-13

申请号：US16174997

申请日：2018-10-30

Applicant: NXP B.V.

Inventor： YU LIN ,  Marcello Ganzerli ,  Mingda Huang

IPC: G01S7/03 ,  G01S13/93 ,  H01Q3/26 ,  H01Q1/32

Abstract: A communication unit, such as a radar unit (500) includes a plurality of cascaded millimetre wave, mmW, transceiver, TRx, circuit, each comprising at least one phase shift circuit (616) and each coupled to respective antennas; and a signal processor circuit (552) operably coupled to the plurality of cascaded mmW TRx circuits and configured to process transmit and receive signals of the plurality of cascaded mmW TRx circuits. The radar unit (500) further comprises: a first TRx circuit (320) of the plurality of cascaded mmW TRx circuits being configured to wirelessly transmit (360) a signal to a second TRx circuit (322) via a respective antenna; a localization processing circuit (580) operably coupled to at least one of the first TRx circuit (320) and second TRx circuit (322) and configured to wirelessly determine a distance relationship (350) between at least one antenna coupled to the first TRx circuit (320) and at least one antenna coupled to the second TRx circuit (322); and a phase control unit (602), operably coupled to the localization processing circuit (570) and configured to adjust at least one phase shifter (616) in response to the wirelessly determined distance relationship.

公开(公告)号：US09576915B2

公开(公告)日：2017-02-21

申请号：US14582830

申请日：2014-12-24

Applicant: NXP B.V.

Inventor： Mingda Huang ,  Markus Carolus Antonius van Schie

IPC: H01L23/50 ,  H01L23/66 ,  H01L23/64 ,  G06F17/50 ,  H01L23/522 ,  H01L49/02 ,  H01P5/02

CPC classification number: H01L23/645 ,  G06F17/5022 ,  G06F17/5068 ,  G06F17/5081 ,  H01L23/5227 ,  H01L23/66 ,  H01L28/10 ,  H01L2223/6638 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1423 ,  H01P5/028 ,  Y02T10/82

Abstract: Consistent with an example embodiment, a System on Chip (SoC) device operates in millimeter wave frequencies. The SoC device comprises, a silicon device having at least one differential pair pad, the at least one differential pair pad having a shunt inductor coupled thereon. A parasitic capacitance on at least one differential pair pads is tuned out by resonance of the shunt inductor. A package has a redistribution layer (RDL), with an array of contact areas to which the silicon device is mounted and then encapsulated. A connection corresponds to the at least one differential pair pad and the connection is located about an outer row or column of the array of contact areas.

Abstract translation: 与示例性实施例一致，片上系统（SoC）器件以毫米波频率工作。 SoC器件包括具有至少一个差分对焊盘的硅器件，所述至少一个差分对焊盘具有耦合在其上的分流电感器。 通过并联电感器的谐振来调谐至少一个差分对焊盘的寄生电容。 封装具有再分配层（RDL），其具有安装硅器件的接触区域阵列，然后封装。 连接对应于至少一个差分对焊盘，并且连接位于接触区域阵列的外部行或列周围。

公开(公告)号：US09435842B2

公开(公告)日：2016-09-06

申请号：US14472179

申请日：2014-08-28

Applicant: NXP B.V.

Inventor： Cicero Silveira Vaucher ,  Mingda Huang ,  Antonius de Graauw

IPC: G01R31/04 ,  G01R31/02 ,  G01R31/28 ,  G01R31/00

CPC classification number: G01R31/02 ,  G01R31/006 ,  G01R31/048 ,  G01R31/2822

Abstract: The invention provides a testing circuit for testing a connection between a chip and external circuitry. A current source is used to inject a DC current towards the connection to be tested from the chip side. On-chip ESD protection is provided giving a path between the connection to be tested and a fixed voltage line. A shunt path is also coupled to the connection to be tested on the external circuitry side. It is determined if the current source current flows through the ESD protection circuit, and this can be used to determine whether or not the connection to be tested presents an open circuit for the DC test current.

Abstract translation: 本发明提供一种用于测试芯片和外部电路之间的连接的测试电路。 电流源用于从芯片侧向被测试的连接端注入直流电流。 提供片上ESD保护，提供要测试的连接和固定电压线之间的路径。 分路还耦合到要在外部电路侧进行测试的连接。 确定电流源电流是否流过ESD保护电路，并且这可以用于确定待测试的连接是否对DC测试电流产生开路。