公开(公告)号：US20110120752A1

公开(公告)日：2011-05-26

申请号：US12949207

申请日：2010-11-18

申请人： Noboru IMAI ,  Ken Takahashi ,  Katsutoshi Taga ,  Aki Suzuki

发明人： Noboru IMAI ,  Ken Takahashi ,  Katsutoshi Taga ,  Aki Suzuki

IPC分类号： H05K1/00 ,  H01L31/18

CPC分类号： H01L31/0516 ,  H01L31/048 ,  Y02E10/50

摘要： A method for fabricating a solar battery module includes cell preparing step for preparing a solar battery cell having an electrode wiring, wiring substrate preparing step for preparing a base material and a wiring substrate having a wiring pattern provided above the base material, mounting step for electrically connecting the wiring pattern with the electrode wiring and mounting the solar battery cell on the wiring substrate, and exposing step for removing the base material to expose the wiring pattern.

摘要翻译： 一种太阳能电池模块的制造方法，其特征在于，包括：准备具有电极布线的太阳能电池单元，配置基材的布线基板准备工序和配置在基材上方的布线基板的布线基板的电池准备工序， 将所述布线图案与所述电极布线连接并将所述太阳能电池单元安装在所述布线基板上，以及用于移除所述基材以暴露所述布线图案的曝光步骤。

公开(公告)号：US07268408B2

公开(公告)日：2007-09-11

申请号：US10348478

申请日：2003-01-21

申请人： Akira Chinda ,  Akira Matsuura ,  Takayuki Yoshiwa ,  Mamoru Mita ,  Takashi Kageyama ,  Katsutoshi Taga

发明人： Akira Chinda ,  Akira Matsuura ,  Takayuki Yoshiwa ,  Mamoru Mita ,  Takashi Kageyama ,  Katsutoshi Taga

IPC分类号： H01L29/00

CPC分类号： H05K3/403 ,  H01L2924/0002 ,  H01L2924/19107 ,  H05K3/0052 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/423 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2203/0733 ,  H01L2924/00

摘要： A wiring board which can realize a small and thin passive component such as solid condenser, resistor, coil, transistor or so on is provided. A wiring board which forms an electronic component by mounting a passive element, comprising an insulating board provided with an opening having predetermined pattern, a wiring formed with predetermined pattern on said insulating board, and an external terminal filled to said opening, connected with said wiring by said filling, and exposed to a bottom of said insulating board where said wiring is formed.

摘要翻译： 本发明提供可实现固体冷凝器，电阻器，线圈，晶体管等小而薄的无源部件的布线基板。 一种通过安装无源元件形成电子部件的布线板，包括设置有具有预定图案的开口的绝缘板，在所述绝缘板上形成有预定图案的布线，以及填充到所述开口的外部端子，与所述布线连接 通过所述填充，并暴露于所述绝缘板的形成所述布线的底部。

公开(公告)号：US5837154A

公开(公告)日：1998-11-17

申请号：US847753

申请日：1997-04-23

申请人： Norio Okabe ,  Yasuharu Kameyama ,  Katsutoshi Taga ,  Takayuki Sato ,  Mamoru Mita ,  Hiroki Tanaka ,  Hiroshi Ishikawa

发明人： Norio Okabe ,  Yasuharu Kameyama ,  Katsutoshi Taga ,  Takayuki Sato ,  Mamoru Mita ,  Hiroki Tanaka ,  Hiroshi Ishikawa

IPC分类号： B23K26/00 ,  B23K26/38 ,  H01L21/48 ,  H01L21/60 ,  H01L23/12 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  B44C1/22

CPC分类号： H01L21/4846 ,  H05K3/0032 ,  H05K3/4092 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0394 ,  H05K2203/0554 ,  H05K2203/0796 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/424 ,  H05K3/427

摘要： A method of manufacturing a double-sided circuit tape carrier comprising an insulating film like a polyimide tape, circuit wiring patterns on both sides thereof, and via holes through which at least a part of the circuit wiring patterns on both sides are electrically connected with each other. A copper thin film is patterned by photoetching. Via holes are formed through the insulating film by irradiating a laser beam by using the patterned copper thin film as a mask. Then, a conductive layer of a graphite conductive thin film and a copper plating layer is formed. The copper thin film is patterned by photoetching forming a chip hole and an outer lead hole through the insulating film by irradiating a laser beam. Finally, one of the copper thin films is patterned by photoetching to form circuit wiring pattern.

摘要翻译： 一种制造双面电路带载体的方法，其包括绝缘膜，如聚酰亚胺带，其两侧上的电路布线图案和通孔，两侧的至少一部分电路布线图案与每个电路布线图案电连接 其他。 铜薄膜通过光刻图案化。 通过使用图案化铜薄膜作为掩模，通过照射激光束，通过绝缘膜形成通孔。 然后，形成石墨导电薄膜和镀铜层的导电层。 通过光刻图案化铜薄膜，通过照射激光来形成穿过绝缘膜的芯片孔和外引线孔。 最后，通过光刻将铜薄膜中的一个图案化以形成电路布线图案。