公开(公告)号：US07268408B2

公开(公告)日：2007-09-11

申请号：US10348478

申请日：2003-01-21

申请人： Akira Chinda ,  Akira Matsuura ,  Takayuki Yoshiwa ,  Mamoru Mita ,  Takashi Kageyama ,  Katsutoshi Taga

发明人： Akira Chinda ,  Akira Matsuura ,  Takayuki Yoshiwa ,  Mamoru Mita ,  Takashi Kageyama ,  Katsutoshi Taga

IPC分类号： H01L29/00

CPC分类号： H05K3/403 ,  H01L2924/0002 ,  H01L2924/19107 ,  H05K3/0052 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/423 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2203/0733 ,  H01L2924/00

摘要： A wiring board which can realize a small and thin passive component such as solid condenser, resistor, coil, transistor or so on is provided. A wiring board which forms an electronic component by mounting a passive element, comprising an insulating board provided with an opening having predetermined pattern, a wiring formed with predetermined pattern on said insulating board, and an external terminal filled to said opening, connected with said wiring by said filling, and exposed to a bottom of said insulating board where said wiring is formed.

摘要翻译： 本发明提供可实现固体冷凝器，电阻器，线圈，晶体管等小而薄的无源部件的布线基板。 一种通过安装无源元件形成电子部件的布线板，包括设置有具有预定图案的开口的绝缘板，在所述绝缘板上形成有预定图案的布线，以及填充到所述开口的外部端子，与所述布线连接 通过所述填充，并暴露于所述绝缘板的形成所述布线的底部。

公开(公告)号：US20090211796A1

公开(公告)日：2009-08-27

申请号：US12432249

申请日：2009-04-29

申请人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

发明人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

IPC分类号： H05K1/16

CPC分类号： H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.

摘要翻译： 电子器件基板设置有薄板芯基板; 金属电极，其设置在所述芯基板上并电连接到要封装在其上的电子部件的电极; 以及电绝缘层，电绝缘层上安装有电子部件，并且设置成围绕金属电极。

公开(公告)号：US20080201943A1

公开(公告)日：2008-08-28

申请号：US12081538

申请日：2008-04-17

申请人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

发明人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

IPC分类号： H05K3/30 ,  H05K3/00

CPC分类号： H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.

摘要翻译： 电子器件基板设置有薄板芯基板; 金属电极，其设置在所述芯基板上并电连接到要封装在其上的电子部件的电极; 以及电绝缘层，电绝缘层上安装有电子部件，并且设置成围绕金属电极。

公开(公告)号：US08230591B2

公开(公告)日：2012-07-31

申请号：US12081538

申请日：2008-04-17

申请人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

发明人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

IPC分类号： H05K3/02

CPC分类号： H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.

摘要翻译： 电子器件基板设置有薄板芯基板; 金属电极，其设置在所述芯基板上并电连接到要封装在其上的电子部件的电极; 以及电绝缘层，电绝缘层上安装有电子部件，并且设置成围绕金属电极。

公开(公告)号：US20060225918A1

公开(公告)日：2006-10-12

申请号：US11376556

申请日：2006-03-16

申请人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

发明人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

IPC分类号： H05K7/00 ,  H05K3/30

CPC分类号： H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.

摘要翻译： 电子器件基板设置有薄板芯基板; 金属电极，其设置在所述芯基板上并电连接到要封装在其上的电子部件的电极; 以及电绝缘层，电绝缘层上安装有电子部件，并且设置成围绕金属电极。

公开(公告)号：US08101864B2

公开(公告)日：2012-01-24

申请号：US12432249

申请日：2009-04-29

申请人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

发明人： Akira Chinda ,  Nobuaki Miyamoto ,  Koki Hirasawa ,  Kenji Uchida ,  Mamoru Mita

IPC分类号： H05K1/03

CPC分类号： H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.

摘要翻译： 电子器件基板设置有薄板芯基板; 金属电极，其设置在所述芯基板上并电连接到要封装在其上的电子部件的电极; 以及电绝缘层，电绝缘层上安装有电子部件，并且设置成围绕金属电极。

公开(公告)号：US07780836B2

公开(公告)日：2010-08-24

申请号：US11544720

申请日：2006-10-10

申请人： Akira Chinda ,  Nobuaki Miyamoto ,  Mamoru Mita

发明人： Akira Chinda ,  Nobuaki Miyamoto ,  Mamoru Mita

IPC分类号： C25D5/02

CPC分类号： H05K3/423 ,  H01L2924/0002 ,  H05K3/0023 ,  H05K3/025 ,  H05K3/108 ,  H05K3/386 ,  H05K3/421 ,  H05K3/427 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0733 ,  H01L2924/00

摘要： On both surfaces of an electric insulating material 1, a surface conductive layer 2A and a back surface conductive layer 2B are formed by transcription. Further, a via hole 5 penetrating through the surface conductive layer 2A and the electric insulating material 1 is provided. After forming a photosensitive plating resist pattern 14, the via hole 5 is filled with a copper plating filler 15, and the surface wiring layer 9A and the back surface wiring layer 9B are formed. Thereafter, the photosensitive plating resist pattern 14 as well as the surface conductive layer 2A and the back surface conductive layer 2B provided under the photosensitive plating resist pattern 14 are removed to fabricate a double-sided wiring board 11.

摘要翻译： 在电绝缘材料1的两面上通过转印形成表面导电层2A和背面导电层2B。 此外，设置穿过表面导电层2A和电绝缘材料1的通孔5。 在形成感光电镀抗蚀剂图案14之后，通孔5填充有镀铜填料15，并且形成表面布线层9A和背面布线层9B。 此后，除去设置在感光电镀抗蚀剂图案14之下的感光电镀抗蚀剂图案14以及表面导电层2A和背面导电层2B，以制造双面布线板11。

公开(公告)号：US06943100B2

公开(公告)日：2005-09-13

申请号：US10684423

申请日：2003-10-15

申请人： Akira Chinda ,  Akira Matsuura

发明人： Akira Chinda ,  Akira Matsuura

IPC分类号： H01L23/12 ,  H01L23/498 ,  H05K1/11 ,  H05K3/24 ,  H05K3/34 ,  H05K3/40 ,  H01L21/48 ,  H01L23/48 ,  H01R43/16

CPC分类号： H01L23/49811 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H05K1/113 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/4069 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2203/0733 ,  Y02P70/613 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a writing board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is disposed on a principle plane of the insulating substrate, and a conductive member to be connected with the connection terminal of the electric wiring is disposed inside the opening; the conductive member having a thickness from a surface on which the electric wiring of the insulating substrate has been disposed is thinner than that of the insulating substrate.

摘要翻译： 在其中开口限定在薄膜状绝缘基板的预定位置的写板中，在绝缘基板的主平面上设置设置有覆盖开口的连接端子的电布线和要连接的导电构件 其中电线的连接端子设置在开口内部; 具有从绝缘基板的电气布线配置的表面的厚度的导电部件的厚度比绝缘基板的厚度薄。

公开(公告)号：US06670718B2

公开(公告)日：2003-12-30

申请号：US10021257

申请日：2001-12-19

申请人： Akira Chinda ,  Akira Matsuura

发明人： Akira Chinda ,  Akira Matsuura

IPC分类号： H01L2348

CPC分类号： H01L23/49811 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H05K1/113 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/4069 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2203/0733 ,  Y02P70/613 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a wiring board wherein an opening is defined at a predetermined position of a film-like insulating substrate, an electric wiring provided with a connection terminal covering the opening is disposed on a principal plane of the insulating substrate, and a conductive member to be connected with the connection terminal of the electric wiring is disposed inside the opening; the conductive member having a thickness from a surface on which the electric wiring of the insulating substrate has been disposed is thinner than that of the insulating substrate.

摘要翻译： 在薄膜状绝缘基板的规定位置设有开口部的布线基板中，在绝缘基板的主面上配置设置有覆盖该开口部的连接端子的电布线和要连接的导电部件 其中电线的连接端子设置在开口内部; 具有从绝缘基板的电气布线配置的表面的厚度的导电部件的厚度比绝缘基板的厚度薄。

公开(公告)号：US20070269590A1

公开(公告)日：2007-11-22

申请号：US11645948

申请日：2006-12-27

申请人： Nobuaki Miyamoto ,  Akira Chinda ,  Koki Hirasawa ,  Kenji Uchida

发明人： Nobuaki Miyamoto ,  Akira Chinda ,  Koki Hirasawa ,  Kenji Uchida

IPC分类号： B05D5/12

CPC分类号： H01L21/4832 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/05553 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/49171 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0023 ,  H05K3/007 ,  H05K3/06 ,  H05K3/243 ,  H05K3/284 ,  H05K2203/0156 ,  H05K2203/0571 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device substrate having: a base material formed of a thin board; an electrical insulation layer formed on the base material and having plural openings in a thickness direction thereof; and a metal plating layer filled in the plural openings. The base material has a metal layer, a release layer formed contacting the metal layer, and a metal film formed contacting the release layer.

摘要翻译： 一种电子器件基板，具有：由薄板形成的基材; 电绝缘层，形成在基材上，在其厚度方向上具有多个开口; 以及填充在所述多个开口中的金属镀层。 基材具有金属层，与金属层接触形成的剥离层和与剥离层接触形成的金属膜。